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UnitedSiC announces SiC JFET family for low power AC-DC Flyback converters

SiC JFETs for Low Power AC/DC Flyback Converters

UnitedSiC announces SiC JFET family for low power AC-DC Flyback converters
March 19, 2019, Applied Power Electronics Conference (APEC) Anaheim CA, and Princeton,New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced it has released a range of SiC JFET die suitable for co-packaging with a controller IC with built in low
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Date:
03/20/2019
UnitedSiC announces strategic investment by Analog Devices

Chris Dries, President and CEO at UnitedSiC

UnitedSiC announces strategic investment by Analog Devices
March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc.
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Date:
03/18/2019
Two Steps to High Voltages

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Figure 1. Boost topology for generating a high voltage from a low voltage

Two Steps to High Voltages
Frederik Dostal

If a high voltage needs to be generated from a low voltage, a boost converter can be used. This represents one of the three elementary switching regulator topologies and requires only two switches, an inductor, and input and output capacitors. Besides the boost converter, the other basic topologies are the buck
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Date:
03/08/2019

Wide Bandgap Semiconductors and Packaging - it’s happening

Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor

Wide Bandgap Semiconductors and Packaging - it’s happening
Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor

The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better
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Date:
03/08/2019
50-Watt, High Current Density, Non-isolated Digital DC-DC Modules
50-Watt, High Current Density, Non-isolated Digital DC-DC Modules
Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and
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Date:
03/06/2019
New SCALE-iDriver SiC-MOSFET Gate Driver
New SCALE-iDriver SiC-MOSFET Gate Driver
Power Integrations announced the SIC1182K SCALE-iDriver, a high-efficiency, single-channel SiC MOSFET gate driver that delivers the highest peak output gate current available without an external boost stage. Devices can be configured to support different gate-drive
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Date:
03/06/2019
Ultra-Low Power Technology applied to Energy Harvesting
Ultra-Low Power Technology applied to Energy Harvesting
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package,
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Date:
03/06/2019
Power solution for high speed e-commerce hub conveyers
Power solution for high speed e-commerce hub conveyers
Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W
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Date:
03/06/2019
Industry’s first automotive USB 3.1 SmartHub supports Type-C
Industry’s first automotive USB 3.1 SmartHub supports Type-C
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in
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Date:
03/06/2019
Industry’s smallest logic parts approved for automotive
Industry’s smallest logic parts approved for automotive
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for
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Date:
03/06/2019
Han ES Press HMC connector range allows fast installation
Han ES Press HMC connector range allows fast installation
The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles.
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Date:
03/06/2019
Reenvision Inductor Operation to Optimize New Applications

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Figure 1: Core material performance curves

Reenvision Inductor Operation to Optimize New Applications
Len Crane, Technical Marketing Manger, Coilcraft

What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application?   Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained
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Date:
03/01/2019
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