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Powering Communications

 



 

 

Powering Communications

February 2013
0805-size metal plate resistor handles up to one Watt
Offering the ability to use a smaller component while maintaining a high power rating, the TLR2A 0805-size metal plate current-sense resistor from KOA Speer Electronics can handle up to one Watt.
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Date:
02/28/2013
Among their announcements at the Mobile World Congress, imec and Target Compiler Technologies presented a new multi-standard LDPC (low-density parity check) FEC (forward error correction) ASIP architecture
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Date:
02/26/2013
Digitally-tunable capacitors empower LTE smartphone designs
At the Mobile World Congress in Barcelona, Peregrine Semiconductor, a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced it has expanded its DuNE™ Digitally
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Date:
02/26/2013

BodyCom technology uses human body as a secure, low-power communication channel
Microchip Technology, a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced from the Embedded World conference in Germany its BodyCom™ technology, which provides
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Date:
02/26/2013
Converter well-suited for micro-cell transmitter and power amplifier apps
Packaged as an industry standard open-frame quarter brick module with through-hole mounting, the Murata Power Solutions PAQ Series of 150 Watt isolated DC-DC converters has a 2:1 input range of 36
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Date:
02/26/2013
Nickel-zinc batteries are mercury free
Developed as an ideal cost-effective and highly-reliable substitute to conventional primary silver oxide (Ag2O) button cells, the new mercury-free primary nickel-zinc(NiOOH) batteries from VARTA Microbattery
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Date:
02/25/2013
Precision 50μV offset op-amp accepts 76V input
Available in dual and quad versions, the LT6016 and LT6017 wide-input operational amplifiers from Linear Technology combine high precision with the ruggedness and versatility of the Over-the-Top®
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Date:
02/20/2013
The power-semiconductor switches used in power supplies and inverters are based on two technologies, namely MOSFETs and IGBTs. MOSFETs can operate at relatively high switching frequencies significantly above 30 kHz but, unlike IGBTs, they have a very large chip surface area. A new generation of IGBT
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Date:
02/15/2013
Non-magnetic D-subminiature connectors well-suited for medical imaging apps
CONEC, a manufacturer of high-quality connectors, has developed a series of non-magnetic combination D-subminiature connectors for advanced medical imaging equipment. These combination D-subminiature
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Date:
02/13/2013
With features such as 4- and 6-bit voltage identification (VID) interfaces, the LM10011 power management controller is presented as the first VID controller designed to operate along with a point-of-load
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Date:
02/13/2013
Bus converter ideal for Network-Attached-Storage apps
Ericsson has launched what is presented as the first digitally-controlled Advanced Bus Converter specifically aimed at powering Redundant Array of Independent Disks (RAID) and Network Attached Storage
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Date:
02/12/2013
O2Micro International announced that it was issued 20 claims under United States patent number 8,294,421 for its Cell Balancing system. This system balances battery cells in a battery pack to keep
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Date:
02/12/2013
Powerline communication SoC for LED lighting targets cost-sensitive apps
Greenvity Communications expands its Hybrii family of system-on-chip (SoC) connectivity solutions with the Hybrii-Mini GV7013 aimed at cost-sensitive consumer and industrial applications. Compatible
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Date:
02/12/2013
PoE Plus single-port jack integrates all necessary power device controller circuitry and ethernet connectivity
Integrating all necessary Power Device controller circuitry and Ethernet connectivity, the PDJack™ PoE Plus single-port integrated controller Power Device (PD) jack from Molex is a complete off-the-shelf
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Date:
02/11/2013
Converter delivers up to 700mA with four passive components
Incorporating an onboard inductor, power switch, and DC/DC controller, the LTM8045 2.8V-18V input, multi-topology DC/DC μModule® (micromodule) converter from Linear Technology can deliver up to 700mA
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Date:
02/08/2013
Embedded power management module directly targets smartphone and tablet apps
Based on TDK's SESUB technology (semiconductor embedded in substrate), a Series of highly integrated, IC-embedded multi-channel power management modules is presented as the world's first device of
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Date:
02/08/2013
Capable of supporting frequencies up to 6GHz, two Series of miniature RF-DC and RF-RF SMT Crossovers from AVX use their MLO™ technology, which matches the CTE of PCB material and provides low loss
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Date:
02/01/2013

 



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