Powering Communications

August 2025

Click image to enlarge

Figure 1: Ever-increasing server rack power consumption

The Future of Powering AI: Redefining Power Flow from Grid-to-Core in Data Centers

Carl Smith, Global Applications Manager Data Center, Infineon Technologies AG

A recent tweet[1] by Sam Altman, the CEO of OpenAI, suggested that being polite in your chats to ChatGPT costs the company tens of millions of dollars due to the additional computational load to process unnecessary words such as “please” and “thank you”. While this set off a range of opinions on the

. . . Learn More

Date:

08/30/2025

Nordic Semiconductor Launches nRF Connect SDK Bare Metal Option for nRF54L Series

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today launched the nRF Connect SDK Bare Metal option, a new software solution for the next-generation nRF54L Series ultra-low power wireless SoCs. This Zephyr RTOS-independent option enables development of simple Bluetooth LE

. . . Learn More

Date:

08/28/2025

Heilind Expands Inventory with Molex Mini-Fit Low Mating Force Terminal Series

Heilind Electronics, a leading global distributor of interconnect, electromechanical, and sensor solutions, is now stocking Molex Mini-Fit® Low Mating Force (LMF) Terminals. Designed to reduce insertion force without compromising electrical performance, these terminals provide a dependable solution for hi

. . . Learn More

Date:

08/18/2025

Alpha and Omega Semiconductor Announces Advanced eFuse that Meets High Reliability Server Application Requirements

Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced the release of its AOZ17517QI series, a 60A eFuse in a compact 5mm x 5mm QFN package. AO

. . . Learn More

Date:

08/12/2025