Tech Talk

November 2024

Kevin Speer, Director of Technology for SiC, Microchip

Ally Winning, European Editor, PSD

At any power exhibition you’ll see the ubiquitous 62mm packaging on almost any SiC manufacturer’s display. Over time, many companies have tried to improve the packaging to remove heat and for better and more reliable connectivity. However, that packaging style itself is a legacy from silicon desig

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Date:

11/05/2024

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Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.

Tech Talk

Making EVs and Renewable Energy Work Together

Power Efficiency Measurements With a Single Tool

Smart Power Stage adds Flexibility to Vertical Power Delivery

Microchip Boosts IGBT7 Performance With New Packaging

Power Systems Design

Power Systems Design

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