Tech Talk

    December 2024
    New High-Power IGBT Technology Reduces Design Complexity

    Philippe Blanchard and Serge Bontemps, Microchip

      A few weeks ago, I had a chat with Kevin Speer from Microchip, who told us about how the company’s SP6LI packaging could reduce parasitics in SiC modules. Today, the company's Serge Bontemps and Philippe Blanchard took time out to discuss Microchip’s IGBT Trench7 (IGBT7) range and also how the SP6LI
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    Date:
    12/17/2024
    ­Advanced Analog and Mixed-Signal Platform

    Hassane El-Khoury, CEO of onsemi

      Platforms have had mixed success in electronics. Usually their main benefit is time saving, as all the constituent parts are included in a single chip or board, allowing designer to focus on adding their own secret sauce. This works well in products such as single board computers, where any flexibility
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    Date:
    12/13/2024
    ­Ideal Diodes for Multiple Power Source Designs

    Frederik Dostal, Subject Matter Expert for Power Management, Analog Devices

      Devices with more than one power source have become much more common with the rise in popularity of portable consumer goods, such as mobile phones and tablets. Those devices are designed to work from battery, but they can still operate from the mains when the charger is plugged in. There are also other desi
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    Date:
    12/03/2024
    Archive

    Making EVs and Renewable Energy Work Together

    Mar 25,2026
    Ally Winning, European Editor, PSD

    Power Efficiency Measurements With a Single Tool

    Feb 24,2026
    Ally Winning, European Editor, PSD

    Smart Power Stage adds Flexibility to Vertical Power Delivery

    Jan 28,2026
    Ally Winning, European Editor, PSD

    Microchip Boosts IGBT7 Performance With New Packaging

    Dec 19,2025
    Ally Winning, European Editor, PSD

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