Test & Measurement

March 2018

AMETEK Programmable Power Announces New SGX Series With Touch Screen Display for the Sorensen DC Power Supply Family

SAN DIEGO – AMETEK Programmable Power has introduced the Sorensen SGX Series with touch screen display. This new feature makes the Sorensen SG family of programmable DC power supplies even easier to use. The SGX Series is the next generation of the successful SG line of programmable DC power suppl

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Date:

03/27/2018

The first beam of light leaves the test beamline at its end.

Light for the Technology of the Future

Physikalisch-Technische Bundesanstalt (PTB)

Increasing miniaturization in the microelectronic sector has created inevitable facts: In the future, structures on microchips and on other components will have to be manufactured by means of lithography in the EUV range, which means using extremely short wavelengths of just 13.5 nm. For test measurements, the Ph

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Date:

03/26/2018

Würth Elektronik eiSos joins STMicroelectronics Partner Program to one common goal: success for their customer!

Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, has joined the partner program of STMicroelectronics. The goal of the initiative set up by ST, a global semiconductor leader serving customers across the spectrum of electronics applications, is to speed customer development e

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Date:

03/21/2018

Power Industry Leaders Create Alliance for 48V Direct-Conversion Applications

San Jose, Calif. – At the Open Compute U.S. Summit 2018, four leading suppliers of power solutions announced a new alliance, the Power Stamp Alliance, to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules - or ‘power stamps’ -

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Date:

03/20/2018

Dual 15A or Single 30A μModule Regulator with Stacked Inductor Package is 96% Peak Efficient

NORWOOD, MA - Analog Devices announces the Power by Linear LTM4662, a dual 15A or single 30A step-down µModule regulator in a BGA package with an exposed stacked inductor for improved thermal dissipation properties. The remaining components, the MOSFETs, DC/DC controller and supporting components, are overmolded and

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Date:

03/08/2018

Dynamically Configurable Off-Line Switcher IC from Power Integrations Supports USB PD 3.0 + PPS

Power Integrations announced the release of its InnoSwitch3-Pro family of configurable off-line CV/CC and CP flyback switcher ICs. Capable of delivering up to 65 W and achieving up to 94% efficiency across line and load conditions, the new devices permit precise, dynamically adjustable, control of voltage (10 mV

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Date:

03/07/2018

Toshiba Launches High Peak Pulse Current TVS Diodes for Power Line Protection

Toshiba Electronics Europe has announced a new series of TVS diodes that protect USB power lines and power supply connectors used in mobile devices. Toshiba’s DF2SxxP2 series protects the power lines of smartphones and tablets by suppressing malfunctions and damage from ESD, noise from induced lightning that enters

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Date:

03/07/2018

KEMET Introduces KONNEKT Technology Enabling Higher Power Densities in Smaller Form Factors

KEMET announced new patented KONNEKT technology enabling high power density by combining multiple components into a single surface mountable package. This technology is designed for use by power electronics engineers where high-power density in a small form factor is critical. Developed in partnership with p

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Date:

03/07/2018

NextPower 100V power MOSFETs from Nexperia feature low Qrr, and high 175°C rating

Nexperia announced its NextPower 100 V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package. NextPower 100 V MOSFETs are Nexperia’s latest generation parts recommended for high efficiency switching and high

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Date:

03/07/2018

Infineon Technologies and SAIC Motor establish power module joint venture SIAPM in China to power the largest market for electric vehicles in the world

SAIC Motor Corporation Limited and Infineon Technologies AG today announced the establishment of a joint venture to manufacture power modules for the dynamically developing electric vehicle market in China. SAIC Motor holds a stake of 51 percent of the JV and Infineon 49 percent, respectively. The partners have rece

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Date:

03/07/2018

EpiGaN GaN/Si RF Material Technology at the Core of EU 5G Project SERENA

EpiGaN has a key position in the new EU research project SERENA ("gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration platform"). SERENA sets out to develop a beamforming system platform for mm-wave multi-antenna arrays and to enable the functional performance of a hybrid analog/digital signal pro

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Date:

03/07/2018

ON Semiconductor’s SiC diodes offer higher efficiency, power density and lower system costs

ON Semiconductor has extended its SiC diode portfolio by introducing its newest family of 650 V silicon carbide (SiC) Schottky diodes. The diodes’ cutting edge, silicon carbide technology provides higher switching capabilities with lower power losses and effortless paralleling of devices. ON Semiconductor’s

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Date:

03/07/2018