Test & Measurement
March 2018
SAN DIEGO – AMETEK Programmable Power has introduced the Sorensen SGX Series with touch screen display. This new feature makes the Sorensen SG family of programmable DC power supplies even easier to use.
The SGX Series is the next generation of the successful SG line of programmable DC power suppl
. . . Learn More
Date:
03/27/2018
The first beam of light leaves the test beamline at its end.
Increasing miniaturization in the microelectronic sector has created inevitable facts: In the future, structures on microchips and on other components will have to be manufactured by means of lithography in the EUV range, which means using extremely short wavelengths of just 13.5 nm. For test measurements, the Ph
. . . Learn More
Date:
03/26/2018
Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, has joined the partner program of STMicroelectronics. The goal of the initiative set up by ST, a global semiconductor leader serving customers across the spectrum of electronics applications, is to speed customer development e
. . . Learn More
Date:
03/21/2018
San Jose, Calif. – At the Open Compute U.S. Summit 2018, four leading suppliers of power solutions announced a new alliance, the Power Stamp Alliance, to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules - or ‘power stamps’ -
. . . Learn More
Date:
03/20/2018
NORWOOD, MA - Analog Devices announces the Power by Linear LTM4662, a dual 15A or single 30A step-down µModule regulator in a BGA package with an exposed stacked inductor for improved thermal dissipation properties. The remaining components, the MOSFETs, DC/DC controller and supporting components, are overmolded and
. . . Learn More
Date:
03/08/2018
Power Integrations announced the release of its InnoSwitch3-Pro family of configurable off-line CV/CC and CP flyback switcher ICs. Capable of delivering up to 65 W and achieving up to 94% efficiency across line and load conditions, the new devices permit precise, dynamically adjustable, control of voltage (10 mV
. . . Learn More
Date:
03/07/2018
Toshiba Electronics Europe has announced a new series of TVS diodes that protect USB power lines and power supply connectors used in mobile devices.
Toshiba’s DF2SxxP2 series protects the power lines of smartphones and tablets by suppressing malfunctions and damage from ESD, noise from induced lightning that enters
. . . Learn More
Date:
03/07/2018
KEMET announced new patented KONNEKT technology enabling high power density by combining multiple components into a single surface mountable package. This technology is designed for use by power electronics engineers where high-power density in a small form factor is critical.
Developed in partnership with p
. . . Learn More
Date:
03/07/2018
Nexperia announced its NextPower 100 V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package.
NextPower 100 V MOSFETs are Nexperia’s latest generation parts recommended for high efficiency switching and high
. . . Learn More
Date:
03/07/2018
SAIC Motor Corporation Limited and Infineon Technologies AG today announced the establishment of a joint venture to manufacture power modules for the dynamically developing electric vehicle market in China. SAIC Motor holds a stake of 51 percent of the JV and Infineon 49 percent, respectively. The partners have rece
. . . Learn More
Date:
03/07/2018
EpiGaN has a key position in the new EU research project SERENA ("gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration platform"). SERENA sets out to develop a beamforming system platform for mm-wave multi-antenna arrays and to enable the functional performance of a hybrid analog/digital signal pro
. . . Learn More
Date:
03/07/2018
ON Semiconductor has extended its SiC diode portfolio by introducing its newest family of 650 V silicon carbide (SiC) Schottky diodes. The diodes’ cutting edge, silicon carbide technology provides higher switching capabilities with lower power losses and effortless paralleling of devices.
ON Semiconductor’s
. . . Learn More
Date:
03/07/2018
Archive
