Wearables & Nanopower

March 2019

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Anup Bhalla, Ph.D., Vice President Engineering, UnitedSiC

By: Anup Bhalla, Vice President Engineering, UnitedSiC

SiC applications began in the 2000s with the adoption of SiC JBS diodes into PFC applications. This was followed by the use of SiC diodes and FETs in the PV industry. But the recent surge in applications relating to EV On-board chargers and DC-DC converters is driving SiC growth. The nascent adoption in the EV

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Date:

03/31/2019

Han ES Press HMC connector range allows fast installation

The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles. The quick connect technology used in the Han ES Press HMC involves the con

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Date:

03/06/2019

Industry’s smallest logic parts approved for automotive

Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’

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Date:

03/06/2019

Industry’s first automotive USB 3.1 SmartHub supports Type-C

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal conne

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Date:

03/06/2019

Ultra-Low Power Technology applied to Energy Harvesting

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology that is capable of extractin

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Date:

03/06/2019

BLE Wireless Multi-core MCUs set new standards

Dialog Semiconductor unveiled the SmartBond DA1469x family of Bluetooth low energy SoCs, its most advanced, feature-rich range of multi-core microcontroller units (MCUs) for wireless connectivity. The new product family which includes four variants, builds on the successes of Dialog’s SmartBond products addin

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Date:

03/06/2019

50-Watt, High Current Density, Non-isolated Digital DC-DC Modules

Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and configurable 25 amp, 50 watt outputs, which can

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Date:

03/06/2019