Wide-Bandgap Semis

May 2018

Rogers Corporation's Power Electronics Solutions Group to Introduce ROLINX CapLink Solutions at PCIM 2018

Eschenbach, Germany – Rogers Corporation’s Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and introducing ROLINX CapLink Solutions. PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion,

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Date:

05/29/2018

Low-Inductance Package Enabling High Current, High Switching Frequency, and High Efficiency

ALISO VIEJO, Calif.—Microsemi Corporation announced its extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules. The new package, developed specifically for the company’s SP6LI product family, is designed to offer 2.9 nanohenry

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Date:

05/29/2018

PSDcast - SiC MOSFETS for Automotive and Industrial Applications

In this episode of the PSDcast, we're chatting with Microsemi's Avi Kashyap about SiC MOSFETs and their use in automotive and industrial applications.

Date:

05/24/2018

TI’s LMZM3360x Power Modules, Now at Mouser, Integrate 36V Buck Converter and Power Circuitry in a Compact Package

Mouser Electronics is now stocking the LMZM33602 and LMZM33603 power modules from Texas Instruments (TI). These completely integrated 4 V–36 V power module solutions combine a step-down DC-to-DC converter with power MOSFETs, a shielded inductor, and passive components in a compact, low-profile package. To simplify d

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Date:

05/23/2018

Infineon prepares for long-term growth and invests €1.6 billion in new 300-millimeter chip factory in Austria

Infineon Technologies is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300-millimeter thin wafers will be constructed at the Villach location in A

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Date:

05/23/2018

RS Components now stocking new series of high-efficiency fans and controllers from ebm-papst

RS Components (RS) has announced the availability of new energy-efficient fan controllers together with the 4300N series of fans from ebm-papst, one of the world’s leading makers of high-efficiency fans and motor products. The latest fan controller solutions are low-cost, credit-card-sized devices. Th

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Date:

05/23/2018

Würth Elektronik successfully completing research project of assistance system with adaptive human-machine interaction .

To make physically strenuous works easier was one of the aims. To give to the craftspeople additional information about the upcoming works, was another aim. The „third arm“ for craftsmen makes both possible: Effective support of the craftsman on the one hand and computer-generated additional information di

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Date:

05/23/2018

Gresham Power Electronics introduces a low profile 225 Watt Ultra High Density AC/DC ITE and Medical Power Supply

Gresham Power Electronics announces the introduction of its latest micro-footprint, Ultra High Density (UHD) 225W output power supply the OF(M)225. The OF(M)225 Series of open frame switching power supplies utilises a highly advanced circuit topology to deliver 225 Watts with fan cooling and 120 Watts convectio

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Date:

05/23/2018

Jason Lomberg, North American Editor, PSD

May We Discuss GaN and SiC?

Jason Lomberg, North American Editor, PSD

Our May issue deals with Wide-Bandgap Semiconductors + Packaging Technologies, a compound topic that comprises two of the hottest themes in the industry – Gallium Nitride (GaN) and Silicon Carbide (SiC). If APEC was any indication, 2018 will be a SiC year, with GaN a close second. These topics are absolutel

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Date:

05/16/2018

Advanced packaging methods for modern power supplies

Stefan Preimel, Concept and Application Engineer, Infineon Technologies

No matter the technical innovation or application, all modern technologies have one thing in common; they rely on a reliable, small and high performance power supply to be able to function and meet their specification. As end products become more complex, the design parameters for the power supply become more ch

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Date:

05/11/2018

Wide-Bandgap Semiconductors and Packaging

Kevin Parmenter, Field Applications Engineering – North America, Advanced Energy

It’s forward thinking and necessary to have the terms “wide-bandgap semiconductors” and “packaging” in the same sentence. Several years ago, I was involved in the emerging stages of wide-bandgap semiconductor devices. In a meeting, I mentioned that device success in the marketplace required a focus on

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Date:

05/09/2018

PSDcast - The Perks of SiC MOSFETs

In this episode of the PSDcast, we're talking to Levi Gant from Littelfuse about arguably the hottest topic in power electronics, silicon carbide. Littelfuse put out a comprehensive white paper titled "State of the SiC MOSFET: Device evolution, technology merit, and commercial prospects." ...

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Date:

05/08/2018