Wide-Bandgap Semis
May 2018
Eschenbach, Germany – Rogers Corporation’s Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and introducing ROLINX CapLink Solutions.
PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion,
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Date:
05/29/2018
ALISO VIEJO, Calif.—Microsemi Corporation announced its extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules. The new package, developed specifically for the company’s SP6LI product family, is designed to offer 2.9 nanohenry
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Date:
05/29/2018
In this episode of the PSDcast, we're chatting with Microsemi's Avi Kashyap about SiC MOSFETs and their use in automotive and industrial applications.
Date:
05/24/2018
Mouser Electronics is now stocking the LMZM33602 and LMZM33603 power modules from Texas Instruments (TI). These completely integrated 4 V–36 V power module solutions combine a step-down DC-to-DC converter with power MOSFETs, a shielded inductor, and passive components in a compact, low-profile package. To simplify d
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Date:
05/23/2018
Infineon Technologies is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300-millimeter thin wafers will be constructed at the Villach location in A
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Date:
05/23/2018
RS Components (RS) has announced the availability of new energy-efficient fan controllers together with the 4300N series of fans from ebm-papst, one of the world’s leading makers of high-efficiency fans and motor products.
The latest fan controller solutions are low-cost, credit-card-sized devices. Th
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Date:
05/23/2018
To make physically strenuous works easier was one of the aims. To give to the craftspeople additional information about the upcoming works, was another aim. The „third arm“ for craftsmen makes both possible: Effective support of the craftsman on the one hand and computer-generated additional information di
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Date:
05/23/2018
Gresham Power Electronics announces the introduction of its latest micro-footprint, Ultra High Density (UHD) 225W output power supply the OF(M)225.
The OF(M)225 Series of open frame switching power supplies utilises a highly advanced circuit topology to deliver 225 Watts with fan cooling and 120 Watts convectio
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Date:
05/23/2018
Jason Lomberg, North American Editor, PSD
Our May issue deals with Wide-Bandgap Semiconductors + Packaging Technologies, a compound topic that comprises two of the hottest themes in the industry – Gallium Nitride (GaN) and Silicon Carbide (SiC).
If APEC was any indication, 2018 will be a SiC year, with GaN a close second. These topics are absolutel
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Date:
05/16/2018
No matter the technical innovation or application, all modern technologies have one thing in common; they rely on a reliable, small and high performance power supply to be able to function and meet their specification. As end products become more complex, the design parameters for the power supply become more ch
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Date:
05/11/2018
It’s forward thinking and necessary to have the terms “wide-bandgap semiconductors” and “packaging” in the same sentence. Several years ago, I was involved in the emerging stages of wide-bandgap semiconductor devices. In a meeting, I mentioned that device success in the marketplace required a focus on
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Date:
05/09/2018
In this episode of the PSDcast, we're talking to Levi Gant from Littelfuse about arguably the hottest topic in power electronics, silicon carbide. Littelfuse put out a comprehensive white paper titled "State of the SiC MOSFET: Device evolution, technology merit, and commercial prospects." ...
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Date:
05/08/2018
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