Wide-Bandgap Semis

    November 2022
    Optimizing Drive-Cycle Simulations for Automotive Applications

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    Figure 1. EAB450M12XM3 automotive qualified 1200 V, 450 A all-Silicon Carbide conduction-optimized, half-bridge module by Wolfspeed®

    ­Silicon Carbide (SiC) has transformed power delivery and management in a number of industries, especially electric vehicle (EV) charging and on-board power conversion. This is due to its superior thermal characteristics, low losses, and power density, which result in higher efficiency and reliability when com
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    Date:
    11/30/2022
    EPC Launches a New Generation of eGaN Technology that Doubles Performance

    EPC Launches a New Generation of eGaN Technology that Doubles Performance

    EPC launches the 80 V, 4 mOhm EPC2619. This is the lead product for a new generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of th
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    Date:
    11/15/2022
    Bring Your Next Battery Charger Project to Life with Minimum Design Risks

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    Figure 1. Infineon offering cover key components in chargers (colored in green)

    ­Every day more and more of the devices and equipment used in our daily life are powered by batteries. For example, we can find electronic equipment with batteries around the house, such as cordless power tools, drones, and other domestic robots (e.g., robotic vacuum cleaners, lawnmowers, etc.). At the same time, due to rising fuel prices, government incentives, and rising awareness about air pollution, common modes of transportation such as bicycles, scooters, and mopeds have now also turned into electrical vehicles. All of these applications are
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    Date:
    11/01/2022
    Archive

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

    Mar 29,2026
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    Wide Bandgap Devices Deliver on Their Promise

    Jan 26,2026
    Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.

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