Wide-Bandgap Semis

    August 2024
    ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely

    ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely

    ­ROHM Semiconductor announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker. Since 2023, these power modules have been mass produced an
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    Date:
    08/30/2024
    Infineon Opens the World's Largest and most Efficient SiC Power Semiconductor Fab in Malaysia

    Infineon CEO Jochen Hanebeck, Malaysian Prime Minister YAB Dato’ Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato’ Seri Haji Muhammad Sanusi Haji Mohd symbolically launched production of phase one of Infineon’s leading 200mm SiC Power Fab.

    ­As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies AG has officially opened the first phase of a new fab in Malaysia that will become the world’s largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YA
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    Date:
    08/08/2024
    Tests Demonstrate Performance of Silicon Carbide

    Click image to enlarge

    Figure 1: Example of threshold voltage as a function of temperature

    ­Wide bandgap semiconductor technology has given electronics designers new degrees of freedom in their approach to high-power electronic circuitry. Silicon carbide (SiC) transistors in particular promise the ability to operate reliably and efficiently at higher temperatures than is possible with conventional si
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    Date:
    08/01/2024
    Archive

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

    Mar 29,2026
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    Wide Bandgap Devices Deliver on Their Promise

    Jan 26,2026
    Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.

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