Acal BFi launches the Hectronic H6059 Qseven embedded computer module



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Acal BFi - a division of Acal plc (FTSE: ACL) - announces the launch of a new Hectronic embedded computer based on AMD Fusion G-series APUs. The H6059 Qseven module integrates the new AMD T40E and T40R ultra low-power dual-core and single-core accelerated processing units (APU), which combine a low-power CPU and an advanced graphics processing unit (GPU) into a single embedded device. The H6059 also integrates the A55E embedded chipset in the Qseven standard revision 1.2 compliant module measuring just 70 mm x 70 mm. As a sister company to Hectronic, Acal BFi will provide specialist technical support on the H6059 in addition to supporting Hectronic's full range of embedded computing modules. The combination of Acal BFi's expertise in design for harsh environments, with Hectronic's leading-edge embedded computing platforms, will enable OEMs to enrich their products with new levels of processing and graphics performance, combined with low power consumption and an extremely compact size. The integration of the Radeon 6250 GPU into the CPU, allows the H6059 to offer increased 2D/3D and motion-video acceleration performance for general purpose GPU (GPGPU) computing applications using AMD's Open CL support. The on-die GPU also helps to avoid the memory bus bottlenecks which can occur when using a discrete GPU. Applications which could benefit from the H6059's increased processing and graphics performance include digital signage, high-end HMIs, and portable test and measurement as well as in imaging and vision systems based on high-end cameras. The H6059 also offers a rich set of I/O interfaces which include four PCI Express ports; eight USB 2.0 ports; two SATA ports; LVDS and the new DVl, HDMI and DisplayPort digital display interfaces, as well as an on-board Intel 82583 Gigabit Ethernet controller. Legacy I/O is supported through the LPC bus and the module has BIOS support for Super I/O devices on the carrier board. Full legacy ISA bus features, such as I/O mapping in memory, are also supported to enable industrial customers to easily migrate their installed product base to the new performance levels enabled by the H6059. SDIO is provided through an onboard USB-to-SDIO controller. The H6059 supports up to 4GB of on-board soldered DDRIII DRAM, as well as an on-board soldered BGA SATA Flash SSD of up to 32GB. The BIOS is based on the new Phoenix SecureCore Tiano UEFI BIOS, with BSPs for XP Embedded, Windows Embedded Standard 7 and Linux. Acal BFi will sample the H6059 Qseven embedded computing module to lead OEM customers towards the end of the first quarter of 2012, with an industrial-grade version of the H6059 planned for introduction later this year. A starter kit is available to support development with this module. Hectronic is a member of the AMD Fusion Partner Program and a participating member of the Qseven Consortium. Both Hectronic and Acal BFi are divisions of Acal plc. For more information, please visit: About Acal BFi: Acal BFi is a pan-European technical distributor with specialist skills and in-house services which allow OEMs to minimise time-to-market during concept development, prototyping and manufacturing. Specialist teams help OEMs to create new revenue streams by using emerging technologies in a number of key vertical sectors: wireless machine-to-machine (M2M) networking, defence and aerospace, medical, industrial, telecommunications, offshore and security. A carefully-selected product portfolio combines electronic and photonics components. These include semiconductors and RF & microwave, frequency control and power management components as well as microsystems, electromechanical, interconnect, passive and magnetic devices. The photonics product range features electro-optics, imaging and fibre-optics, optical systems, assemblies and metals. Acal BFi's In-house design, manufacturing and logistics services include an EMC chamber, in-house programming, copper & fibre-optic cable assembly, quick-turn prototype PCB production, CAD and specialist test equipment, as well as logistics services such as VMI (Vendor Managed Inventory), EDI processing, tape and reeling, customer-specific bar-coding, Kan-Ban/ship-to-line, kitting and flexible shipping agreements.