The DesignCon 2015 Call for Technical Papers, Panels and Tutorials is closing soon - submit your proposal to speak now! DesignCon gives the chip, board & systems design engineering community the unique opportunity to gather for four days and learn the latest design techniques, methodologies and tools around SI & PI, high-speed serial design, PCB design tools, test & measurement and more.
Be a pivotal member of the electronics engineering community - submit your abstract for the chance to share your expertise in the areas of signal and power integrity, test & measurement and verification.
Deadline to submit is Friday, July 18, 2014.
The 2015 Topic Categories
The 2015 technical program will consist of 14 tracks:
Optimize Chip-Level Designs for Signal and Power Integrity
Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
Wireless and Photonic Integration
System Co-Design: Chip/Package/Board: Modeling and Simulation
Characterize PCB Materials and Processing Characterization
Apply PCB Design Tools
Design Parallel and Memory Interfaces
Optimize High-Speed Serial Design
Detect and Mitigate Jitter, Crosstalk, and Noise
Leverage High-Speed Signal Processing for Equalization and Coding
Ensure Power Integrity in Power Distribution Networks
Achieve Electromagnetic Compatibility and Mitigate Interference
Apply Test and Measurement Methodology
Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques
Who Should Submit?
Past DesignCon speakers include: Analog Engineers, Application Engineers, CTOs, Design Engineers, Directors of Engineering, Editors, EMC Engineers, Engineering Managers, Fellows, Hardware Engineers, Members of Technical Staff, Principal Engineers, Product Engineers, Professors, R&D Engineers, Signal Integrity Engineers, Systems Engineers, Technical Directors, VPs of Engineering and more.
Deadline to submit: July 18, 2014
Final papers will be due November 10, 2014.
