Indium to show Heat-Spring thermal interface material for LEDs at Strategies in Light

Date
01/07/2015

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Heat-Spring compressible, recyclable, metal thermal interface material

Indium will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev. The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

Indium Corporation’s Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.

Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.

Heat-Spring is just one of a wide range of Indium Corporation materials for the LED assembly industry, from PCB assembly to die-attach to technology-enabling TIM, that combines superior performance with ease of placement. This reduces cost, increases first-pass yield, reduces field failures, and contributes to the optimization of profit.

Visit Indium Corporation at booth 623 at Strategies in Light.

Heat-Spring

Indium

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