Microchip Boosts IGBT7 Performance With New Packaging

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A few months ago, I talked with Microchip at the launch of the company’s IGBT7 products. The IGBT7 range was introduced to penetrate the general market, after the company had previously focused mainly on niche markets, such as military and aerospace, for its high-power products. To continue that expansion into a broader range of applications, including electric vehicles, renewable energy systems, industrial drives, and UPS, it has now integrated IGBT7 dies into DualPack3 (DP3) packaging. DP3 is Microchip’s take on the industry standard EconoDUAL package. Although the form factor has been around for over 20 years, it has been consistently updated over that time to provide better heat management, integrate new materials, and provide more convenience features, such as ‘press to fit’. Amit Gole, Product Marketing Manager at Microchip talked to PSD about the new packaging and the reasons for its introduction.

PSD – What are the main advantages of DP3 packaging?

AG - Although the form factor has been around for some time, it remains popular as it's pretty sleek with high power density. Over the last two decades, engineers have designed driver boards, and even overall power systems around this package, so it's familiar to most designers. The IGBT7 range was initially launched in the 62mm package, but the overall market for DP3 packaging is much larger than for 62mm and smaller modules. For example, in 2022, the market for DP3-type modules was around 600 million units compared to 40 million 63mm modules shipped. The initial DP3 designs that Microchip is launching are pretty simple – in a dual half bridge configuration. The nodes that we have released are 1200V and 1700V with current ratings of 300A, 600A and 900A, so six individual parts.

PSD - Can you give us a quick reminder of the advantages of IGBT7?

AG - IGBT7 technology has up to 50% higher current handling capability compared to the previous IGBT4 generation. The higher density minimizes complexity, as there is less need to parallel modules. Another big advantage is the reduction in Vce(sat), which is around 15% lower than the IGBT4 range. In practice, that means that conduction losses are lower, and efficiency is therefore higher. That is very important for most of the applications that we are targetting – those with mainly low to medium switching frequency where the key losses are static, mainly conduction losses. Most of these applications also require an overload specification. IGBT7 technology is capable of handling up to 175^oC for short periods of time, meaning there is no need to over-design, which saves on cost. Other benefits include compatibility with existing drivers, a less snappy freewheeling diode for lower overshoot and a slew rate that can be controlled by a gate resistor. For applications that require higher switching frequencies, the company has SiC solutions that perform better in that role.

PSD - There are several companies that already offer packages similar to DP3, is Microchip’s offering more of the same, or does the company add value in any way?

AG - There are companies that provide high-power electronics in similar packaging, but the main differentiation that Microchip offers is flexibility. The company provides products that range from standard to fully customized. Microchip’s experience in niche markets, such as the space industry, and its control of the full supply chain, mean that it has lots of experience in delivering low volume designs. When it comes to packaging, the company has both industry standard packages, as well as its own packages that can add value in terms of lower inductance, for example.

https://www.microchip.com/en-us/products/power-management/power-modules/igbt