New ATS Heat Sinks Designed for NVIDIA Jetson Thor Modules

­Advanced Thermal Solutions, Inc. (ATS) has introduced a line of high-performance heat sinks engineered for NVIDIA Jetson Thor modules, providing robust thermal management for next-generation edge computing, physical AI, and robotics platforms. The new heat sinks include active and passive cooling options, giving developers flexible, ready-to-deploy thermal solutions for sustained, intense workloads.

One active Jetson Thor heat sink features a frameless fan embedded within its aluminum fin field. This fansink can cool 95W TDP devices at 50°C. Dimensions are 87 x 100.8 x 20 mm (L x W x H), with a weight of 104g.

The other active heat sink uses a powerful, top-mounted ATS blower capable of cooling 175W TDP devices at 50°C. It is dimensioned 92 x 100.8 x 28.6 mm (L x W x H), including the blower.  It weighs 174g.

The passive aluminum heat sink provides up to 100W of cooling at 50°C with 500 LFM system airflow. Dimensions are 87 x 100.8 x 20 mm (L x W x H), and weight is 168g.

All versions of NVIDIA Jetson Thor supported heat sinks ship with a pre-assembled, high performance thermal interface material (TIM) to enhance thermal transfer.

The unprecedented compute density of Jetson Thor pushes thermal requirements beyond what traditional embedded cooling solutions can support. The new ATS heat sinks are engineered to maintain performance stability under continuous high-power operation, ensuring AI workloads run at full throttle without sacrificing thermal performance.

The NVIDIA Jetson Thor series modules deliver up to 2070 FP4 TFLOPS of AI compute and 128 GB of memory in a 40–130 W power envelope, providing a major leap for physical AI and robotics.

ATS provides cooling solutions for all Jetson SOMs. For detailed specifications on the ATS heat sinks for Jetson Thor modules, available for immediate shipping, go here.