The First Fully Integrated Active Clamp Flyback Controller



The SZ1101 combines the design simplicity of flyback controllers with power density enabled by active clamp flyback controllers, delivering over 93% efficiency with an all-silicon design and 15W/in  power density at 30W for AC/DC power adapters.

For High Power Density AC/DC Power Adapters

SZ1101 Flyback PWM Controller integrates four key ACF controller building blocks. These include an advanced ACF controller and three ultra-high-voltage components; an active clamp driver, an active clamp FET and a startup voltage regulator. This unprecedented level of integration facilitates designing efficient, high-power-density adapters with low bill-of-material cost to satisfy power-hungry mobile phones, tablets, notebooks and video game consoles.

Key Specs:

  • Input: 90 – 265 VAC

  • Output: 3.3V, 5V, 9V, 11V, 12V, 15V, 20V

  • Output Current: 3A Max

  • Output Power: 30W Max

  • Output Port: USB-PD 3.0 or PPS

  • Efficiency: > 93% full power efficiency with an all silicon design

Key Features:

  • Integrated ultra-high-voltage active clamp FET/ driver/startup voltage regulator

  • Advanced adaptive digital controller 

  • Tight switching frequency regulation for improved input EMI filter utilization

  • Up to 140kHz switching frequency

  • Cycle-by-cycle adaptive digital control (OptiMode)

  • Up to 30W output power

  • Capable of over 15W/in  power density 

To support the ever-increasing energy and fast charging needs of mobile devices, designers today are challenged to deliver increasing amounts of power in a travel adapter while also keeping it cool to the touch and maintaining the small size consumers have come to expect. High efficiency, or reducing power loss, is key to achieving the power density without overheating the adapter’s case. For example, delivering 30W today without increasing the volume beyond the 2.4 cu-inch adapter that delivered only 15W a few years ago requires a minimum of 93.2% efficiency to ensure that the case stays under the desired limit of 50 degrees Celsius when operating at room temperature.

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  • 16-pin SOIC package