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    TURCK's rugged overmolded Mil-Spec cordsets handle harsh applications

    08/27/2013

    TURCK's overmolded Mil-Spec cordsets for rugged applications offer a robust connectivity solution and are 100 percent factory tested to ensure optimal performance for applications in harsh environments, including automotive, mobile equipment and oil and gas. Featuring a novel overmolded design, TURCK Mil-Spec cordsets eliminate field assembly, soldering and wiring-allowing operators to reduce downtime and maintenance labor and costs. Overmolded cordsets also provide the flexibly to seal to a wide variety of cable types. For easy application integration, these Mil-Spec cordsets are compatible with other TURCK products and standard Mil-Spec receptacles. "Designed with our new, rugged molding technology, Mil-Spec cordsets provide quick and easy connection for instrumentation and power applications," said Jay Bartsias, Product Manager, Connectivity, TURCK. "Plus, with the advantage of built-to-order, custom capabilities, our customers can employ a complete, turnkey solution no matter what their application demands." TURCK overmolded Mil-Spec cordsets are available in shell sizes 8-24, in addition to threaded, bayonet and reverse bayonet connector styles. They meet NEMA 1, 3, 4 and 6P and are rated IP67 and IP68. Cable options include NEK 606, ABS and IEEE 1580. TURCK

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    Power Systems Design

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    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.