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Design Tools and Resources Shorten Design Times
Anaheim, Calif., Applied Power Electronics Conference & Exposition (APEC) – GaN Systems is displaying a wide breadth of innovative design tools including new reference designs from partners at APEC 2019. Visitors to GaN Systems Booth #553 will find the multitude of unique design resources that make GaN
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Date:
03/19/2019
650V SiC Schottky Diodes with Current Ratings from 6A to 40A
CHICAGO — Littelfuse, Inc. introduced two additions to its expanding line of second-generation, 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. Both series offer power electronics system designers a variety of performance advantages over traditional silicon-based devices, including
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Date:
03/19/2019
UnitedSiC announces strategic investment by Analog Devices

Chris Dries, President and CEO at UnitedSiC

March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc.
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Date:
03/18/2019

Isolated ICs Ensure Precise Current and Voltage Measurements
ANAHEIM, Calif. (APEC) – Silicon Labs has introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed to provide accurate current and voltage measurement with very low drift across temperature. Based on Silicon Labs’ robust, third-generation
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Date:
03/18/2019
APEC Brings Wide-Bandgap Devices into Focus
I don’t have to tell you, dear reader, how vital wide-bandgap semiconductors are to this industry. If you haven’t encountered them on your workbench or heard our PSDcast with PowerAmerica,
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Date:
03/12/2019
For the better part of this decade, power electronics technologists have been enabling new topologies with GaN (gallium nitride) transistors. Similarly, system innovators have been creating new levels of performance in electric and autonomous vehicles, industrial machines, televisions, laptop adapters, data
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Date:
03/12/2019
Qualifying SiC Devices to Industrial and Auto Standards

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Figure 1: RUIS test setup and waveforms for the current and the voltage during a UIS pulse.

A recent trend in the semiconductor market is the widespread adoption of silicon carbide (SiC) devices, including both Schottky barrier diodes (SBD) and power MOSFETs, for industrial and automotive applications. At the same time, the long-term reliability of these devices is a hot topic that should
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Date:
03/11/2019
Wide-Bandgap Technology Gathers Pace
It barely feels we are past the Christmas holidays and yet here we are looking forward to the start of the exhibition season. Even although it’s only March, my colleagues in the US are currently gearing up for the biggest show of the year in that region. APEC sets the tone for the whole year in the power industry
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Date:
03/11/2019
Hybridization: Prospects for the Near Future of Automobiles

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Figure 1: Block diagram of an electric vehicle controller

New vehicle models with electric motors are automobile manufacturers’ lighthouse projects, even more so against the background of current arguments about combustion engines or, more specifically, diesel engines. In close alignment with policy makers, manufacturers are offering premiums to tempt
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Date:
03/11/2019
Two Steps to High Voltages

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Figure 1. Boost topology for generating a high voltage from a low voltage

If a high voltage needs to be generated from a low voltage, a boost converter can be used. This represents one of the three elementary switching regulator topologies and requires only two switches, an inductor, and input and output capacitors. Besides the boost converter, the other basic topologies are the buck
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Date:
03/08/2019
Wide Bandgap Semiconductors and Packaging - it’s happening

Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor

The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better
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Date:
03/08/2019
ADC Family Enables High-Res Analog-to-Digital Conversion
CHANDLER, Ariz. — To address applications that demand higher-speed and higher-resolution analog-to-digital conversion, Microchip Technology Inc. announced 12 new Successive Approximation Register (SAR) Analog-to-Digital
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Date:
03/07/2019
AEC-Q101 Qualified MOSFETs Use 50% Less Space Over DPAK
MALVERN, Pa. — Vishay Intertechnology, Inc. introduced new -30 V and -40 V Automotive Grade p-channel TrenchFET power MOSFETs in the PowerPAK SO-8L package with gullwing leads for increased board-level reliability. Providing more than a 50 % reduction in mounting area compared to devices in
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Date:
03/07/2019
TTI Stocks Littelfuse Automotive TVS Diodes
Fort Worth, Texas – TTI, Inc., is now stocking the Littelfuse TPSMB series AEC-Q101 qualified automotive TVS Diodes. The latest additions expand the series’ breakdown voltage range from 7.5V to 550V for unidirectional and 10V to 650V for bidirectional devices. These AEC-Q101 qualified TVS Diodes provide
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Date:
03/07/2019
Low-power, smallest-form-factor FPGA for 4K video
Microchip announces the new PolarFire FPGA imaging and video solution to address the challenges of developing complex computer algorithms which enable systems to capture and display information and high-resolution images. The PolarFire FPGA imaging and video solution
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Date:
03/06/2019
New SCALE-iDriver SiC-MOSFET Gate Driver
Power Integrations announced the SIC1182K SCALE-iDriver, a high-efficiency, single-channel SiC MOSFET gate driver that delivers the highest peak output gate current available without an external boost stage. Devices can be configured to support different gate-drive
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Date:
03/06/2019
VITA 62 compliant power supplies for MIL-COTS VPX applications
Vicor Power Systems new line of VITA 62 compliant power supplies are designed for 3U Open VPX systems and achieve high-efficiency and high-power density in a rugged, conduction-cooled chassis. The initial products operate from a nominal 28V or 270V DC input, with
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Date:
03/06/2019
RS Components adds Rexroth industrial frequency converters
RS Components has introduced an innovative frequency converter from Rexroth that delivers potential energy savings of up to 80% across industrial and automation applications. The EFC 5610 intelligent variable-frequency drive enables manufacturers and other industrial
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Date:
03/06/2019
BLE Wireless Multi-core MCUs set new standards
Dialog Semiconductor unveiled the SmartBond DA1469x family of Bluetooth low energy SoCs, its most advanced, feature-rich range of multi-core microcontroller units (MCUs) for wireless connectivity. The new product family which includes four variants, builds on the
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Date:
03/06/2019
Ultra-Low Power Technology applied to Energy Harvesting
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package,
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Date:
03/06/2019
24 - 44 GHz Wideband Integrated Microwave 5G Transceiver
These ICs operate over a very wide frequency range with 50 Ω-match from 24 GHz up to 44 GHz, facilitating ease of design and reducing the costs of building a single platform that can cover all 5G mm Wave frequency bands including 28 GHz and 39 GHz. Additionally,
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Date:
03/06/2019
Power solution for high speed e-commerce hub conveyers
Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W
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Date:
03/06/2019
Industry’s first automotive USB 3.1 SmartHub supports Type-C
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in
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Date:
03/06/2019
Industry’s smallest logic parts approved for automotive
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for
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Date:
03/06/2019
Han ES Press HMC connector range allows fast installation
The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles.
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Date:
03/06/2019
Tantalum Capacitors for Automotive & Industrial Applications
FOUNTAIN INN, S.C. – AVX Corporation released a new series of miniature, surface-mount, J-lead tantalum capacitors that deliver high reliability and high volumetric efficiency in high-temperature automotive and industrial applications. The new F9H Series meets AEC-Q200 requirements, is compliant with RoHS2
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Date:
03/05/2019
Thick Film Chip Resistors Deliver Power to 1.5 W
MALVERN, Pa. — Vishay Intertechnology, Inc. introduced a new series of high voltage thick film chip resistors that offer high power ratings up to 1.5 W and working voltages to 3000 V in five compact case sizes ranging from 1206 to 2512. For increased design flexibility, the Vishay Techno CRHP
. . . Read More
Date:
03/05/2019
 Reenvision Inductor Operation to Optimize New Applications

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Figure 1: Core material performance curves

What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application?   Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained
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Date:
03/01/2019

 



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