Consumer

February 2017

TDK's PiezoHapt thin actuator touts low driving voltage

PiezoHapt actuator

TDK's PiezoHapt thin actuator touts low driving voltage

TDK has expanded its portfolio of haptic components with the new ultra-thin PiezoHapt actuator featuring a very short response time of just 4 ms. PiezoHapt has a unimorph design consisting of a multilayer piezo element bonded to one side of a vibration plate. With a thickness of a mere 0.35 mm the new haptic ac

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Date:

02/28/2017

Rosenberger's magnetic connectors serve multiple apps

Rosenberger magnetic connectors

Rosenberger's magnetic connectors serve multiple apps

Rosenberger has developed a product family which offers an intelligent alternative to mechanical connecting. Our magnetic connectors support all standard functions, including a high number of mating cycles and vibration resistance. They are also suitable for power and signal transmission. Furthermore, they come co

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Date:

02/28/2017

Toshiba launches IoT dev kit for Bluetooth wearables

EBTZ1041-SK-A1 ‘starter kit’ supports the prototyping of highly integrated IoT wearable applications

Toshiba launches IoT dev kit for Bluetooth wearables

Toshiba Electronics has announced a comprehensive development kit that provides the hardware and software needed to create wearable devices that handle multiple sensor inputs. The EBTZ1041-SK-A1 ‘starter kit’ supports the prototyping of highly integrated IoT wearable applications featuring the Toshiba TZ1000 Ap

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Date:

02/28/2017

Increasing power density

Y. Iwasaki, M. Chounabayashi, M. Nakazawa, S. Iwamoto, Y. Oonishi, M. Hori, H. Kakiki and O. Ikawa

Current market requirements are trending towards further downsizing and increased efficiency of power conversion systems. For this reason, enhanced power density of the power modules will be critical in order to respond to the evolving needs of the market. In order to increase the power density, All-SiC modules wi

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Date:

02/28/2017

AT&S advances PCB, module and packaging tech

11 key European actors are collaborating on the GaNonCMOS project

AT&S advances PCB, module and packaging tech

For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in various research and development programmes. One current example is the Horizon 2020 EU

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Date:

02/28/2017

Igor and Ellipz to create novel PoE and LED intelligent lighting solution

The integrated technology provides a complete PoE and LED package solution

Igor and Ellipz to create novel PoE and LED intelligent lighting solution

Incorporating Igor technology, Ellipz will provide an intelligent light management solution for the commercial lighting industry. The integrated technology provides a complete PoE and LED package solution to the marketplace. By combining both company’s unique technologies, the Ellipz smart lighting solution ca

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Date:

02/24/2017

Arrow to show Microsemi’s Everest Board for PolarFire Low-power devices at Embedded World

Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Arrow Electronics announced Arrow’s upcoming training sessions for the new Everest Evaluation Board designed specifically for Microsemi’s recently launched PolarFire mid-range field pr

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02/21/2017

Qualcomm unveils tri-mode system-on-chip for IoT

Qualcomm Technologies announced two new System-on-chips (SoCs), the QCA4020 and QCA4024. Qualcomm Technologies is the first to announce a tri-mode SoC QCA4020, integrating Bluetooth Low Energy 5, Dual-band Wi-Fi, and 802.15.4-based technologies, including ZigBee and Thread, while QCA4024 integrates Bluetooth Lo

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Date:

02/21/2017

STMicro's STM32 LoRaWAN discovery board now at Mouser

STM32 LoRaWAN Discovery Board

STMicro's STM32 LoRaWAN discovery board now at Mouser

Mouser Electronics, with the newest semiconductors and electronic components, is the first to stock the STM32 LoRaWAN Discovery Board from STMicroelectronics (ST). The new Discovery Kit and I-NUCLEO-LRWAN1 STM32 LoRa Arduino-compatible extension board — available to order from Mouser — provide a development pl

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Date:

02/20/2017

New chip may thwart battery charger counterfeiting

Counterfeit chargers for portable electronics are a major problem

New chip may thwart battery charger counterfeiting

Larry Hardesty

Counterfeit chargers for portable electronics are a major problem. At the end of 2016, Apple claimed that of 100 Apple-branded charging accessories it bought on Amazon, 90 were counterfeits. Around the same time, Britain’s Chartered Trading Standards Institute reported that of 400 counterfeit chargers it bought fr

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02/17/2017

STM32 proto boards from STMicro support long-range low-power IoT

B-L072Z-LRWAN1 Discovery kit and I-NUCLEO-LRWAN1

STM32 proto boards from STMicro support long-range low-power IoT

Two new ready-to-use prototype boards available from STMicroelectronics slash the cost for developers to start evaluating LoRaWAN and other Low-Power Wide Area Network (LPWAN) technologies including WM-Bus and 6LoWPAN. The boards are based on the smallest and lowest-power LoRaWAN modules that exist on the market to

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Date:

02/17/2017

Analog Devices' smart engineering solutions come to embedded world

At embedded world 2017, we will have working demos on A2B automotive audio, advanced personal healthcare monitoring, TSN, ultralow power ARM microprocessor unit, and 24 GHz radar for automotive and industrial applications, just to name a few. Meet with our analog experts, who can answer your specific design qu

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Date:

02/16/2017

Microsemi claims lowest-power cost-optimized FPGA product family

PolarFire FPGA

Microsemi claims lowest-power cost-optimized FPGA product family

Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new cost-optimized PolarFire field programmable gate array (FPGA) product family, delivering the industry’s lowest power at mid-range densities with 12

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Date:

02/14/2017

German flex+ Project ends on positive note for flexible devices

Demonstration objects from the Insect Project

German flex+ Project ends on positive note for flexible devices

The flex+ Project, funded by the German Federal Ministry of Education and Research (BMBF), has successfully come to the end of ist planned two-year duration and will leave its mark on the future as well: flexible electronics as a comprehensive approach. Fraunhofer FEP is one of the leading research and devel

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Date:

02/14/2017

Intersil claims smallest isolated RS-485 transceiver for industrial IoT

ISL32704E isolated RS-485 transceiver

Intersil claims smallest isolated RS-485 transceiver for industrial IoT

Intersil, a leading provider of innovative power management and precision analog solutions, announced the industry’s smallest isolated RS-485 differential bus transceiver designed to provide 4Mbps bidirectional data transmission for Industrial Internet of Things (IIoT) networks. The high-speed ISL32704E delivers in

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Date:

02/13/2017

ITO challenged as a transparent conductor by novel technologies

(Left): An example of the hybrid process for manufacturing metal mesh. (Right) examples of O-Film metal mesh TCFs.

ITO challenged as a transparent conductor by novel technologies

The transparent conductive film (TCF) industry has witnessed upheaval in recent years. On the one hand, multiple technologies have been developed as alternatives to the incumbent solution, whilst the incumbent suppliers slashed their prices to protect their share in sluggish markets. Our report Transparent Conductiv

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Date:

02/13/2017

TE Connectivity to showcase tech to mitigate device design challenges at MD&M West

TE Connectivity (TE), a leader in connectivity and sensor solutions, will showcase technologies designed to mitigate medical device design challenges at MD&M West this month, Booth #3149. Product experts from TE will be on site to discuss how TE’s customized sensing, connectivity and minimally invasive de

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Date:

02/13/2017

PSMA to hold APEC 2017 session on energy harvesting

At APEC 2017, the PSMA's (Power Sources Manufacturers Association’s) Energy Harvesting Committee will host an Industry Session featuring five industry experts who will cover such topics as real-world applications, conditional monitoring, energy harvesting systems, PMICs (Power Management ICs) and low-power IoT

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Date:

02/09/2017

FLINGO project seeks to advance LED performance

Given the growing demands placed on the electrical, optical and thermal functionality of LEDs, engineers are paying more and more attention to the advancement of new material properties. To this end, the FLINGO project (Functional Inorganic Layers for Next Generation Optical Devices) was established to develop ne

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Date:

02/09/2017

EnOcean to show low-energy LED controls at Strategies in Light

At Strategies in Light 2017 (Anaheim, February 28 – March 2, 2017), EnOcean, a leader in energy harvesting wireless technology, will present self powered wireless LED control for multiple wireless protocols. At booth #107, the company will be exhibiting their extensive Dolphin portfolio, including self-powered sw

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02/08/2017

Qualcomm and TDK announce joint venture

Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules an

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Date:

02/06/2017

Octavo Systems’ OSD3358 SiP of BeagleBone Black wireless, now at Mouser

OSD3358 SiP device

Octavo Systems’ OSD3358 SiP of BeagleBone Black wireless, now at Mouser

Mouser Electronics, a product introducton leader that empowers innovation, is now stocking the OSD3358 system-in-package (SiP) from Octavo Systems. The OSD3358 SiP device makes it easier for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara AM3358 processor with an

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Date:

02/06/2017

Qualcomm extends offer for all outstanding shares of NXP

Qualcomm announced that Qualcomm River Holdings, an indirect wholly owned subsidiary of Qualcomm, has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors. The tender offer is being made pursuant to the Purchase Agreement, da

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02/03/2017

element14 launches ‘Upcycle it’ design challenge with Intel Edison

element14, a leading electronic design community, has launched a new Design Challenge for designers and engineers called ‘Upcycle it’. Sponsored by Intel, element14 will challenge 15 community members to Upcycle an unwanted or waste product to give it a new or enhanced lease of life. Upcycling is a conc

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Date:

02/02/2017

Qorvo claims smallest and most power-efficient family of Wi-Fi front-end modules

Qorvo Wi-Fi FEM family

Qorvo claims smallest and most power-efficient family of Wi-Fi front-end modules

Qorvo, a leading provider of innovative RF solutions to connect the world, has introduced a new family of 5 GHz and 2.4 GHz Wi-Fi Front-End Modules (FEMs) that pave the way for smaller, more energy-efficient wireless routers, gateways and other networked devices in the home. The seven new FEMs support high-bandwidth th

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Date:

02/01/2017

Analog Devices announces changes to Board of Directors

Mark M. Little

Analog Devices announces changes to Board of Directors

Analog Devices, a leader in high-performance semiconductors for signal processing applications, announced that Mark M. Little, former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, has been elected as a Director of the Company, and that the Board of Directors of

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Date:

02/01/2017

Empowering wireless charger design

Eko Lisuwandi, Linear Technology

The use of batteries in everyday devices is getting more ubiquitous. In many of these products, a charging connector is difficult or impossible to use. For example, some products require sealed enclosures to protect sensitive electronics from harsh environments and to enable for convenient cleaning or st

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Date:

02/01/2017

The design explosion

Alix Paultre, Editorial Director, PSD

Let’s continue the thought we began with at the front of the issue, as simply saying that it’s good to have a lot of product development, even if some of it is on stuff that is a little crazy, leaves a lot to be said. How does a laundry-folding robot help humanity? Will having a toothbrush that sends me em

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Date:

02/01/2017

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