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    September 2024
    Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe IP Subsystem with TSMC CoWoS Technology

    Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe IP Subsystem with TSMC CoWoS Technology

    Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe IP Subsystem with TSMC CoWoS Technology
    ­Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology. This complete PHY and controller subsystem,
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    Date:
    09/30/2024
    Archive

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