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Lighting & Illumination

 




 

 

Lighting & Illumination

December 2016
Mouser now ships Cree’s high-power, high-efficacy XLamp MHB-B LEDs

Cree XLamp MHB-B LED

Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the Cree XLamp MHB-B LEDs. These new high-power LEDs enable designers to more effectively deliver lower system costs for high-lumen, high-efficiency applications
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Date:
12/26/2016
Harwin launches EZ-Boardware SMT spring-contact dev kit

Spring Contact Development Kit

Harwin, the leading hi-rel connector and SMT board hardware manufacturer, is showcasing its new Spring Contact Development Kit for electronic design engineers and design houses at SPS IPC Drives. Harwin Spring Contacts are single contact, surface mount PCB devices with multiple uses including general electrical
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Date:
12/13/2016
In today’s data acquisition systems (DAQs), performance boundaries are continually being pushed.  System designers require higher speed, lower noise, and better total harmonic distortion (THD) performance; all of which are possible but none of which are free.  These performance improvements typically
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Date:
12/07/2016

Safety vs. performance

The creepage distance is the shortest path between two conductors along the surface of an isolator (typically a PCB)

When designing a switch-mode power supply (SMPS) operating losses and the ability to dissipate heat are critical selection criteria for MOSFETs. The standard TO-220 package is generally good at dissipating heat and the wide range of heatsinks and forced-air cooling options available can easily improve this.
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Date:
12/04/2016
TE Connectivity launches press-fit board stacking connector

Press-fit stacking connector

TE Connectivity, a leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging. Suited
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Date:
12/01/2016

 



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