Powering Communications

February 2023
Developing a New Approach to Predicting the Behavior of GaN Devices

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Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices

­Introduction Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed. This has led to the development of models and equations for failure modes like time-de
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Date:
02/24/2023

Ultra-Low-Power Bi-Directional Wireless Mesh Network Modules from NeoCortec Available Through Endrich

Cato Skibsted Fagermo, Business Development Manager at NeoCortec

­NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has signed a new distribution agreement with service-oriented special distributor, Endrich Bauelemente Vetriebs GmbH. The new agreement enables Endrich to promote worldwide NeoCortec’s NeoMesh wireless mesh network modules to
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Date:
02/23/2023
Electronic Metadevices Break Barriers to Ultra-Fast Communications

Electronic Metadevices Break Barriers to Ultra-Fast Communications

­Until now, the ability to make electronic devices faster has come down to a simple principle: scaling down transistors and other components. But this approach is reaching its limit, as the benefits of shrinking are counterbalanced by detrimental effects like resistance and decreased output power. Elison Matioli o
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Date:
02/20/2023
Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

­Alliance Memory announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package. Providing the company's customers with a higher-density option for a wide range of applications, the AS4C1G16D4-062BCN delivers improved performance over previous-generation DDR
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Date:
02/14/2023
Single-Chip Antenna-Matching ICs for Easier, Faster Design with Bluetooth LE SoCs and STM32 Wireless Microcontrollers

Single-Chip Antenna-Matching ICs for Easier, Faster Design with Bluetooth LE SoCs and STM32 Wireless Microcontrollers

­STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers. The MLPF-NRG-01D3 for BlueNRG-LPS and MLPF-WB-02D3 for STM32WB integrate the compl
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Date:
02/02/2023
Elma Adds to Comprehensive Line of SOSA Aligned Backplanes That Enable Complex, High Speed Signal Processing in Rugged Applications

Elma Adds to Comprehensive Line of SOSA Aligned Backplanes That Enable Complex, High Speed Signal Processing in Rugged Applications

­Elma Electronic has now added six additional high-speed backplanes that align with The Open Group Sensor Open Systems Architecture (SOSA) Technical Standard 1.0 and incorporate the latest optical fiber and RF connectivity. With 2-, 4- and 6-slot options, the expanded 3U OpenVPX series of backplanes provides de
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Date:
02/02/2023
World's First 64 Gbps Fully Integrated Loopback Solution for High-Speed Data Connectivity

Block diagram of the Menlo Micro 5620 (Graphic: Business Wire)

­Menlo Microsystems, Inc. (Menlo Micro), introduced a new dual double-pole/triple-throw (2x DP3T) switch. The MM5620 switch provides the highest performance and data rates for high-speed differential data applications. It offers unprecedented levels of parallel testing on space-constrained final test and probe tes
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Date:
02/01/2023
Improving System-Level Performance and Robustness in Power Line Monitoring

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Figure 1. AD7606B in a typical power line monitoring application

­For many applications, monitoring powerlines implies the use of current transformers and resistor divider networks in order to sense the three phases and neutral voltages and currents, as shown in Figure 1. The AD7606B, due to its high input impedance, can directly interface with a sensor, easing the da
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Date:
02/01/2023
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