Powering Communications
August 2024
KYOCERA AVX Releases Miniature RF MLCCs for Communications Applications
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new ultra-low-ESR KGU Series C0G (NP0) RF multilayer ceramic chip capacitors (MLCCs).
Inspired by growing communications market demand for small
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Date:
08/28/2024
ABLIC Launches S-34HTS08AB, DDR5 SPD IC for Client/Server DIMM — I3C High-Speed Communication Standard Compliant
ABLIC a group company of MinebeaMitsumi Inc., launched the S-34HTS08AB SPD IC for DDR5 memory modules.
The amount of communication data handled by client PCs and data center servers has been growing at a rapid rate, resulting in demand for higher level data processing capacity in memory modules. In additi
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Date:
08/27/2024
Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability
The automotive and industrial markets are widely adopting Single Pair Ethernet (SPE) solutions for network connectivity because of the system level benefits of reducing cost, weight and cable complexity. SPE, with its proven performance and reliability in automotive applications, is now also being deployed in
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Date:
08/23/2024
NeoMesh Wireless Sensor Networks Enable Easy Monitoring of Remote Australian Farm Assets
NeoCortec, the experts on wireless connectivity and providers of ultra-low-power bi-directional wireless mesh network hardware and software solutions, is working together with Australian company farmIT to enable easy monitoring of remote Australian farm assets like livestock water troughs, boundary gates, wa
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Date:
08/22/2024
Taiwan Semiconductor's New ESD Protection Devices are Optimized for High-Density Electronics
Taiwan Semiconductor – global supplier of discrete power electronics devices, LED drivers, analog ICs and ESD devices – introduces a new series of new ultra-small ESD protection devices optimized for wearables and other high-density electronic products. All DFN0603-packaged models in the 3.3V and 5.0V TE
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Date:
08/19/2024
WE-RFI can be used as an inductor for HF applications or as a ferrite for interference suppression.
Würth Elektronik now offers its WE-RFI inductors in sizes 0402 and 0603, which can be used as inductors for HF applications or as ferrites for interference suppression. Here the manufacturer responds to increasing miniaturization and complements the existing sizes 0805 and 1008. The components are suitable as
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Date:
08/08/2024
Extended NextPower 80/100V MOSFET Portfolio from Nexperia Offers Increased Design Flexibility
Nexperia announced that the ongoing expansion of its NextPower 80 V and 100 V MOSFET portfolio is continuing apace with the release of several new LFPAK devices in industry-standard 5x6 mm and 8x8 mm footprints. These new NextPower 80/100 V MOSFETs are optimized for low RDS(on) and low Qrr, to deliver high efficienc
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Date:
08/06/2024
Navitas Powers Expanded Samsung Galaxy Smartphone Portfolio
Navitas Semiconductor announced that Samsung had expanded adoption of Navitas’ GaNFast ICs from the original flagship Galaxy S22, S23 and S24 to the mainstream Galaxy A, and revolutionary Galaxy Z Fold6 and Galaxy Z Flip6 smartphones with enhanced Galaxy AI features.
GaN runs up to
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Date:
08/05/2024
Click image to enlarge
Figure 1. Wyebot's sensors
Every manufacturer and charging facility want to optimize its environment for all users. In today’s digital world, this means providing the best WiFi network possible. While everyone agrees this is a priority, several misconceptions abound when it comes to accurately determining the network speed needed by
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Date:
08/01/2024
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