Product News

January 2023

Bourns Expands High Power Thick Film Chip Resistor Line with Four New AEC-Q200 Compliant Series

Bourns® Model CRM-Q, CRS-Q, CMP-Q
and CHP-Q AEC-Q200 compliant high power thick film resistor series

Bourns Expands High Power Thick Film Chip Resistor Line with Four New AEC-Q200 Compliant Series

Bourns, Inc., expanded its industry-leading line of high power thick film resistors with four new AEC-Q200 compliant product series. The new Bourns® Model CRM-Q, CRS-Q, CMP-Q and CHP-Q Series are automotive grade and feature high rated power and superior pulse load surge ca

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Date:

01/30/2023

SCHURTER Receives PSE-JET Approval for High-Performance SMD Fuses

SCHURTER Receives PSE-JET Approval for High-Performance SMD Fuses

SCHURTER Receives PSE-JET Approval for High-Performance SMD Fuses

SCHURTER product family types UMZ 250, UMF 250, UMK 250 according to IEC 60127-4 have received the Japanese PSE-Jet approval. The newly marked packaging will be rolled out the first week of April 2023, date code 2314 or higher on the label. SCHURTER offers a wide range of circuit protection solutions

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Date:

01/30/2023

Cincon's PDF700S Series AC/DC Brick Power Supply Now Shipping from Sager Electronics

Cincon's PDF700S Series AC/DC Brick Power Supply Now Shipping from Sager Electronics

Cincon's PDF700S Series AC/DC Brick Power Supply Now Shipping from Sager Electronics

Sager Electronics is now stocking Cincon's PDF700S series AC/DC brick power supply. Cincon's PDF700S series are innovative, high density, 700W brick type AC-DC power modules with the input range of 90-264Vac, and output voltage of 12Vdc, 24Vdc, 28Vdc, 48Vdc, and 56Vdc. The PDF700S Class I powe

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Date:

01/30/2023

200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

EPC introduces the 200 V, 10 mΩ EPC2307 in a thermally-enhanced QFN in a tiny 3 mm x 5 mm footprint. The EPC2307 is footprint compatible with the previously released 100 V, 1.8 mΩ EPC2302, the 100 V 3.8 mΩ EPC2306, the 150 V, 3 mΩ EPC2305, the 150 V, 6 mΩ EPC2308, and the 200 V, 5 mΩ

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Date:

01/30/2023

STMicroelectronics Unveils World's First MCU Edge-AI Developer Cloud

STMicroelectronics Unveils World's First MCU Edge-AI Developer Cloud

STMicroelectronics Unveils World's First MCU Edge-AI Developer Cloud

STMicroelectronics is continuing to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud op

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Date:

01/30/2023

Teledyne LeCroy Extends CrossSync PHY Technology to USB4 and USB Type-C Connectors

Teledyne LeCroy Extends CrossSync PHY Technology to USB4 and USB Type-C Connectors

Teledyne LeCroy Extends CrossSync PHY Technology to USB4 and USB Type-C Connectors

Teledyne LeCroy announced the extension of their patented CrossSync™ PHY technology to USB4® signaling over USB Type-C® connectors. CrossSync PHY enables waveforms from Teledyne LeCroy oscilloscopes to be viewed alongside protocol analyzer traces, with complete time-correlation of electrical an

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Date:

01/27/2023

Isolated DC-DC Converters for xEVs Reduce Application Size and Minimize Noise Design Countermeasures

Isolated DC-DC Converters for xEVs Reduce Application Size and Minimize Noise Design Countermeasures

Isolated DC-DC Converters for xEVs Reduce Application Size and Minimize Noise Design Countermeasures

ROHM Semiconductor introduced the BD7Fx05EFJ-C isolated flyback DC-DC converter (BD7F105EFJ-C, BD7F205EFJ-C) optimized for gate drive power supplies in xEV applications, such as electric compressors and PTC heaters. In recent years, xEVs such as hybrid and electric vehicles have beco

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Date:

01/26/2023

All-in-One Hybrid Power Drive Module Solution is Designed for Electric Aviation Applications to Reduce Development Time and Weight

All-in-One Hybrid Power Drive Module Solution is Designed for Electric Aviation Applications to Reduce Development Time and Weight

All-in-One Hybrid Power Drive Module Solution is Designed for Electric Aviation Applications to Reduce Development Time and Weight

Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities. To meet the needs for an integrated and configurable power solution for aviation applications, Microchip Technology Inc. announces a

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Date:

01/26/2023

Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters

Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters

Renesas Introduces New Gate Driver IC for IGBTs and SiC MOSFETs Driving EV Inverters

Renesas Electronics Corporation announced a new gate driver IC that is designed to drive high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters. Gate driver ICs are essential components to EV inverters, providing

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Date:

01/26/2023

SiTime Expands Portfolio of Precision Timing Solutions for Aerospace and Defense with Two New Endura Oscillator Families

SiTime Expands Portfolio of Precision Timing Solutions for Aerospace and Defense with Two New Endura Oscillator Families

SiTime Expands Portfolio of Precision Timing Solutions for Aerospace and Defense with Two New Endura Oscillator Families

SiTime Corporation announced two new Endura precision timing oscillator families. These ruggedized devices are engineered to deliver high performance in extreme conditions in aerospace-defense applications such as Positioning, Navigation and Timing (PNT), tactical communications, network synchronization an

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Date:

01/26/2023

TDK Releases the Most Compact Safety Class S2 Motor-Run Capacitors

TDK Releases the Most Compact Safety Class S2 Motor-Run Capacitors

TDK Releases the Most Compact Safety Class S2 Motor-Run Capacitors

TDK Corporation presents its new B33331I6* series, compact EPCOS motor-run capacitors that comply with safety class S2 as well as the IEC 60335-2-24 standard, that will come onto the market in September 2023. The robust aluminum cans have extremely compact dimensions, making the series now the most compact mo

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Date:

01/24/2023

Industry's First Signal Processing Board To Feature Intel's Latest Direct RF Technology

Mercury Unveils the Industry’s First Signal Processing Board To Feature Intel’s Latest Direct RF Technology

Industry's First Signal Processing Board To Feature Intel's Latest Direct RF Technology

Mercury Systems, Inc., introduced a new COTS open-architecture board that delivers the latest commercial signal processing technology for aerospace and defense applications, driving higher performance from a smaller form factor. The DRF3182 Direct RF Processing Module is the first standard product purpose-built fo

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Date:

01/23/2023

Cornell Dubilier Introduces 105°C Flat Aluminum Electrolytic Capacitor Series

Cornell Dubilier Introduces 105°C Flat Aluminum Electrolytic Capacitor Series 

Cornell Dubilier Introduces 105°C Flat Aluminum Electrolytic Capacitor Series 

Cornell Dubilier Electronics, Inc. has released a new series of Flatpack, low-profile aluminum electrolytic capacitors, tested and rated for 10,000 hours at 105 °C. Type MLPS offers high capacitance density in a flat configuration, with voltage ratings up to 450 Vdc and a temperature range from -55 °C to 10

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Date:

01/23/2023

160 V 3-Phase Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection

160 V 3-Phase Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection

160 V 3-Phase Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection

The MOTIX family for automotive and industrial motor control applications from Infineon Technologies AG offers a broad product portfolio with various levels of integration. To further expand its offering, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) ga

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Date:

01/18/2023

Cornell Dubilier Responds to Needs of Next-Gen EV Charger Designers with Custom Capacitors

Cornell Dubilier Responds to Needs of Next-Gen EV Charger Designers with Custom Capacitors

Cornell Dubilier Responds to Needs of Next-Gen EV Charger Designers with Custom Capacitors

In response to the rapidly growing demand for higher-performance DC link capacitors for EV chargers, Cornell Dubilier Electronics (CDE) has expanded its standard-product offerings with devices issued through franchise distributor New Yorker Electronics. While the inverter circuitry at the heart of EV charging st

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Date:

01/18/2023

Vishay Intertechnology Launches New Gen 7 Platform of 1200 V FRED Pt Hyperfast Rectifiers With Two Devices in SMA (DO-214AC) Package

Vishay Intertechnology Launches New Gen 7 Platform of 1200 V FRED Pt Hyperfast Rectifiers With Two Devices in SMA (DO-214AC) Package

Vishay Intertechnology Launches New Gen 7 Platform of 1200 V FRED Pt Hyperfast Rectifiers With Two Devices in SMA (DO-214AC) Package

Vishay Intertechnology, Inc. introduced the first two devices in its new Gen 7 platform of 1200 V FRED Pt Hyperfast rectifiers. Offered in the SMA (DO-214AC) package, the 1 A rectifiers offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices in their class. Optimized fo

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Date:

01/17/2023

Teledyne LeCroy Supports PCI Express 6.0 Electrical Testing

Teledyne LeCroy Supports PCI Express 6.0 Electrical Testing

Teledyne LeCroy Supports PCI Express 6.0 Electrical Testing

Teledyne LeCroy announced support for PCI Express 6.0 electrical test and validation with QPHY-PCIE6-TX-RX fully automated test software, as well as SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages. The growth of new technologies, including artificial intelligence/machine learning (

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Date:

01/17/2023

Microchip Introduces New COTS RT Power Device for LEO/Space Applications

Microchip Introduces New COTS RT Power Device for LEO/Space Applications

Microchip Introduces New COTS RT Power Device for LEO/Space Applications

The commercialization of the Low-Earth Orbit (LEO) region is transforming space exploration and satellite communication at roughly 1,200 miles above Earth. For satellites to successfully operate and reach their destination, it is essential to select components that can withstand the harsh space environment. Bu

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Date:

01/17/2023

Industry's First Ultrasonic Lens Cleaning Chipset Enables Self-Cleaning Cameras and Sensors

Industry's First Ultrasonic Lens Cleaning Chipset Enables Self-Cleaning Cameras and Sensors

Industry's First Ultrasonic Lens Cleaning Chipset Enables Self-Cleaning Cameras and Sensors

Texas Instruments (TI) introduced the first purpose-built semiconductors with ultrasonic lens cleaning (ULC) technology, enabling camera systems to quickly detect and remove dirt, ice and water using microscopic vibrations. Removing contaminants from camera lenses traditionally requires manual cleaning, causing s

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Date:

01/17/2023

Automotive Intelligent Power Device Enables Safe and Flexible Power Distribution in Next-Generation E/E Architectures

Automotive Intelligent Power Device Enables Safe and Flexible Power Distribution in Next-Generation E/E Architectures

Automotive Intelligent Power Device Enables Safe and Flexible Power Distribution in Next-Generation E/E Architectures

Renesas Electronics Corporation announced a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures. The new RAJ2810024H12HPD is available in the small TO-252-7 pack

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Date:

01/17/2023

Dual-Channel Digital Isolators Cover Flexible Configurations

Dual-Channel Digital Isolators Cover Flexible Configurations

Dual-Channel Digital Isolators Cover Flexible Configurations

STMicroelectronics has extended its family of dual-channel high-speed digital isolators, enhancing flexibility for designers to optimize their board layout. The new STISO620 contains two channels of the same directionality, having all digital inputs on one side of the isolation barrier and all d

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Date:

01/16/2023

Magnetic Components are Dedicated to Harsh Environment Applications

Magnetic Components are Dedicated to Harsh Environment Applications

Magnetic Components are Dedicated to Harsh Environment Applications

Exxelia developed the CCM (Chameleon Concept Magnetics) family of products to withstand the harsh environments of aerospace and particularly of space applications. CCM technology is Exxelia’s response to the growing interest of electronic engineers for inductors and transformers with multiple outputs, high po

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Date:

01/16/2023

FTDI Chip FT4232HA USB-to-UART/MPSSE IC Provides High-Speed USB Support to Target Designs

FTDI Chip FT4232HA USB-to-UART/MPSSE IC Provides High-Speed USB Support to Target Designs

FTDI Chip FT4232HA USB-to-UART/MPSSE IC Provides High-Speed USB Support to Target Designs

Mouser Electronics, Inc., is now stocking the FT4232HA high-speed USB-to-UART/MPSSE IC from FTDI Chip. The FT4232HA is an automotive-qualified USB 2.0-to-UART converter that seamlessly provides high-speed USB support to target designs. Featuring four independent configurable interfaces, the FT4

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Date:

01/16/2023

Design Higher Density and Lower Cost Lidar Systems with New 80 V, 15 A GaN eToF Laser Driver IC

Design Higher Density and Lower Cost Lidar Systems with New 80 V, 15 A GaN eToF Laser Driver IC

Design Higher Density and Lower Cost Lidar Systems with New 80 V, 15 A GaN eToF Laser Driver IC

EPC announces the introduction of the EPC21701, a laser driver that monolithically integrates an 80 V, 40 A FET with gate driver and 3.3 logic level input into a single chip for time-of-flight lidar systems used in robotics, surveillance systems, and vacuum cleaners. It is tailored to lidar sy

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Date:

01/16/2023

STMicroelectronics Brings 32-bit Kick to Cost-Sensitive 8-bit Applications with STM32C0 Series Microcontrollers

STMicroelectronics Brings 32-bit Kick to Cost-Sensitive 8-bit Applications with STM32C0 Series Microcontrollers

STMicroelectronics Brings 32-bit Kick to Cost-Sensitive 8-bit Applications with STM32C0 Series Microcontrollers

STMicroelectronics is again broadening access to its STM32 microcontroller (MCU) family by introducing the most affordable series yet: the STM32C0. STM32 MCUs are used in billions of smart industrial, medical, and consumer products worldwide. With thousands of existing STM32 part numbers, product d

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Date:

01/12/2023

Signatec Adds New Features to Its DsScope Signal Recording Software

Signatec Adds New Features to Its DsScope Signal Recording Software

Signatec Adds New Features to Its DsScope Signal Recording Software

Signatec announces three significant feature additions to its DsScope Windows-based signal recording software. DsScope is a Windows-based PC oscilloscope application that requires no programming and allows the operator to: view/edit all digitizer hardware settings, display the acquired signal data for ana

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Date:

01/12/2023

Flex Power Modules' BMR473 Digital PoL Regulator now Available as SMD Horizontal-Mount Version

Flex Power Modules' BMR473 Digital PoL Regulator now Available as SMD Horizontal-Mount Version

Flex Power Modules' BMR473 Digital PoL Regulator now Available as SMD Horizontal-Mount Version

The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering. Dimensioned just 19 x 13 x 7.5 mm, the device operates from 6 – 15 V input an

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Date:

01/12/2023

Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family

Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family

Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family

Renesas Electronics Corporation introduced a new general-purpose microcontroller (MCU) in the low-power RL78 Family, with small package sizes that target 8-bit MCU applications. The versatile RL78/G15 packs many peripheral functions and 4-8KB of code flash memory in package sizes ranging from 8 to 20 pin

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Date:

01/12/2023

Menlo Micro Introduces Integrated Low-Power Solution for MEMS Switches and High-Voltage Driver Applications

Menlo Micro Introduces Integrated Low-Power Solution for MEMS Switches and High-Voltage Driver Applications

Menlo Micro Introduces Integrated Low-Power Solution for MEMS Switches and High-Voltage Driver Applications

Menlo Micro announced the formal qualification and production release of the MM101, an 8-channel, low-voltage to high-voltage driver with an integrated charge pump. The MM101 driver provides a cost-effective solution for microelectromechanical system (MEMS) devices and other high-voltage driving ap

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Date:

01/12/2023

High-Performance / Low-Cost 240 Watt UPS Module

High-Performance / Low-Cost 240 Watt UPS Module

High-Performance / Low-Cost 240 Watt UPS Module

TRACO POWER announces its new TIB 240-124BCMU module that turns any existing AC/DC 24 VDC power source into full-fledged uninterruptible power supply (UPS) system supporting up to 240 watts of power, optimally charging and protecting connected lead acid batteries. An integrated microprocessor ensures that the c

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Date:

01/12/2023

Richtek and EPC Collaborate to Create Small 140 Watt Fast-charging Solution

Richtek and EPC Collaborate to Create Small 140 Watt Fast-charging Solution

Richtek and EPC Collaborate to Create Small 140 Watt Fast-charging Solution

EPC & Richtek announces the availability of a 4-switches bidirectional buck-boost controller reference design board that converts an input voltage of 12 V - 24 V to a regulated 5 V - 20 V output voltage and delivers up to 5 A continuous current and 6.5 A maximum current. The combination of the new Richtek RT

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Date:

01/11/2023

Automotive-Grade Devices Run Cooler in Surface-Mount ACEPACK SMIT Package

STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package

Automotive-Grade Devices Run Cooler in Surface-Mount ACEPACK SMIT Package

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages. Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ul

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Date:

01/09/2023

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

Simon Keeton, executive vice president and general manager, Power Solutions Group, onsemi

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

onsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi’s N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies, in its DC string optimizers for critical power switching applications. Ampt string op

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Date:

01/05/2023

Smarter Digital Transformation Module Includes Machine Learning-Enabled ICM-45686-S IMU

TDK announces SmartBug 2.0 – a smarter digital transformation module, now with machine learning enabled ICM-45686-S IMU

Smarter Digital Transformation Module Includes Machine Learning-Enabled ICM-45686-S IMU

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug in 2019. “SmartBug 2.0 will take digital transformation to the next level by not only be

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Date:

01/05/2023

Advanced Energy Launches Medical and Industrial Power Conversion Platforms with Leading Power Density

Advanced Energy Launches Medical and Industrial Power Conversion Platforms with Leading Power Density

Advanced Energy Launches Medical and Industrial Power Conversion Platforms with Leading Power Density

Advanced Energy Industries, Inc. introduced two new ranges of AC-DC power supplies with industry-leading power densities for critical medical and industrial equipment. The SL Power™ NGB800 800 W and NGB1200 1200 W families are optimized to address the performance, power, size, reliability and compliance re

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Date:

01/05/2023

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems. The new SAF85xx one-chip family combines NXP’s high performance radar sensing and processing technologies into a single device, offering tier ones and OEMs new flexibility in

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Date:

01/05/2023

Infineon, Green Hills Software to Deliver Comprehensive Automotive Safety and Security Solutions for the TRAVEO T2G MCU Families

The combination of Infineon’s TRAVEO T2G microcontrollers and Green Hills’ complete production-proven software solutions is tailored for a broad range of automotive applications such as electrification, body control modules, gateway and infotainment.

Infineon, Green Hills Software to Deliver Comprehensive Automotive Safety and Security Solutions for the TRAVEO T2G MCU Families

Infineon Technologies AG and Green Hills Software will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry. This collaboration combines Infineon’s cutting-edge TRAVEO T2G Body and TRAVEO T2G Cluster microcontrollers (M

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Date:

01/05/2023

TI Enables Automakers to Take Full Advantage of EV Range with the Industry's Most Accurate Battery Cell and Pack Monitors

TI Enables Automakers to Take Full Advantage of EV Range with the Industry's Most Accurate Battery Cell and Pack Monitors

TI Enables Automakers to Take Full Advantage of EV Range with the Industry's Most Accurate Battery Cell and Pack Monitors

Texas Instruments (TI) introduced new automotive battery cell and pack monitors with the most accurate measurement capability available on the market, maximizing electric vehicle (EV) drive time and enabling safer operation. As EVs grow in popularity, advanced battery management systems (BMS) are helping o

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Date:

01/05/2023

Low-Cost RF Power Transmitter to Bring Convenient Over-the-Air Wireless Charging into Homes

Powercast shows its easy-to-integrate, drop-in embeddable Ubiquity module in an acrylic case.

Low-Cost RF Power Transmitter to Bring Convenient Over-the-Air Wireless Charging into Homes

Powercast Corporation has unveiled its Ubiquity transmitter, an ultra-low-cost RF power transmitter which was selected as a CES 2023 Innovation Award Honoree in three categories: Smart Home Embedded Technologies Sustainability, Eco-Design & Smart Energy Designe

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Date:

01/05/2023

Bourns' Highest Current Carrying PTVS Diode Series in a Compact DFN Package

Bourns' Highest Current Carrying PTVS Diode Series in a Compact DFN Package

Bourns' Highest Current Carrying PTVS Diode Series in a Compact DFN Package

Bourns, Inc., released Bourns' highest current carrying bidirectional Power Transient Voltage Suppressor (PTVS) Diode series that is available in a compact surface mount DFN package. Bourns Model PTVS20-015C-H is capable of handling 20 kA, 8/20 µs current surge at a low voltage of 15 V. These feat

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Date:

01/04/2023

TDK Announces Thermally Stable Industrial IMU for Tilt and Stabilization Applications

TDK Announces Thermally Stable Industrial IMU for Tilt and Stabilization Applications

TDK Announces Thermally Stable Industrial IMU for Tilt and Stabilization Applications

TDK Corporation announces the expansion of the InvenSense SmartIndustrial sensor platform family. With its support for an extended temperature range of -40°C to 105°C, this new 6-axis IMU targets industrial applications that require extreme stability over temperature and great vibration immunity. The IIM-20670

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Date:

01/04/2023

New Smart Sensor System is More Than Just a Digital Fitness Coach in Miniature Size

New Smart Sensor System is More Than Just a Digital Fitness Coach in Miniature Size

New Smart Sensor System is More Than Just a Digital Fitness Coach in Miniature Size

Today’s consumers want portable and smart devices that have high performance and a full set of features, yet provide a long battery life. For product designers, this means making difficult decisions to minimize power consumption without affecting the user experience. Bosch Sensortec announces a new smart

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Date:

01/04/2023

Family of Applications Processors Delivers Safe, Secure and Scalable AI-enabled Edge Platforms

Family of Applications Processors Delivers Safe, Secure and Scalable AI-enabled Edge Platforms

Family of Applications Processors Delivers Safe, Secure and Scalable AI-enabled Edge Platforms

NXP Semiconductors announced the i.MX 95 family, the newest addition to its i.MX 9 series of applications processors. The new i.MX 95 family combines high-performance compute, immersive Arm® MaliTM-powered 3D graphics, an innovative new NXP accelerator for machine learning, and high-speed data processing. To

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Date:

01/04/2023

Morse Micro and AzureWave Deliver the World's Smallest Wi-Fi HaLow Module

Morse Micro and AzureWave Deliver the World's Smallest Wi-Fi HaLow Module

Morse Micro and AzureWave Deliver the World's Smallest Wi-Fi HaLow Module

Morse Micro announced a partnership with AzureWave Technologies, Inc., a worldwide leading provider of wireless connectivity and image processing solutions. Paving the way for broad implementation of Wi-Fi HaLow in Internet of Things (IoT) environments, the partnership sees AzureWave design and manufacture tw

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Date:

01/03/2023

TDK SmartSound MEMS Microphones and SmartSound One Development Platform Now Available

TDK SmartSound MEMS Microphones and SmartSound One Development Platform Now Available

TDK SmartSound MEMS Microphones and SmartSound One Development Platform Now Available

TDK Corporation announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform. These MEMS microphones push the boundaries of microphone acoustic performance, power efficiency, and advanced feature sets all in small package footprints. SmartSound One of

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Date:

01/03/2023

Owl Autonomous Imaging Launches Monocular 3D Thermal Ranger Computer Vision for ADAS and Autonomous Vehicles

Owl Autonomous Imaging Launches Monocular 3D Thermal Ranger Computer Vision for ADAS and Autonomous Vehicles

Owl Autonomous Imaging Launches Monocular 3D Thermal Ranger Computer Vision for ADAS and Autonomous Vehicles

Owl Autonomous Imaging announced the availability of an Evaluation Kit for their new Thermal Ranger ADAS & Autonomous Navigation Development Platform. This hardware and software kit enables Tier 1 and OEM automotive companies to easily evaluate Owl AI’s Thermal Ranger imaging solution for use i

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Date:

01/03/2023

Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

onsemi introduced “EliteSiC” as the name of its silicon carbide (SiC) family. The company is set to showcase three new members of the family – the 1700 V EliteSiC MOSFET and two 1700 V avalanche-rated EliteSiC Schottky diodes. The new devices provide reliable, high-efficiency performance for energy in

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Date:

01/03/2023

Nichia and Infineon Launch Industry's First High-Definition Micro-LED Matrix Solution

The new 16,384 pixel µPLS micro-Pixelated Light Solution from Nichia and Infineon combines high-definition resolution with industry’s highest light output.

Nichia and Infineon Launch Industry's First High-Definition Micro-LED Matrix Solution

Automotive LED lighting technology has developed rapidly in recent years as a means for vehicle manufacturers to enhance driving comfort and road safety. In this regard, matrix LED technology for adaptive driving beam has become an important headlight feature for selective road illumination. Three years ago

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Date:

01/03/2023

Eggtronic Unveils Advanced Power Conversion Architecture for High-Power PFC Applications

Eggtronic Unveils Advanced Power Conversion Architecture for High-Power PFC Applications

Eggtronic Unveils Advanced Power Conversion Architecture for High-Power PFC Applications

Eggtronic has launched a high-performance AC/DC converter technology that provides industry-leading efficiency, reduced component count and improved EMI performance in high-power applications requiring power factor correction (PFC). Derived from the traditional boost PFC + LLC resonant power converter,

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Date:

01/03/2023

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