Test & Measurement
June 2018
Brighton: Advanced Material Development (AMD) has raised a total of £750,000 in funding, as the company launches its plan to exploit the commercial potential of applications for graphene and other 2D nanomaterials. The company will contribute £600,000 to fund several distinct research projects conducted by th
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Date:
06/28/2018
Cleveland, Ohio, USA – MB Dynamics, Inc. announced its non-hydraulic Steering Module Test Simulator (SMTS).
The SMTS is used by automotive, autonomous, construction and off-highway vehicle OEMs and their associated steering suppliers for accurate, reliable and repeatable in-laboratory simulati
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Date:
06/20/2018
CARSON CITY, Nev. — Ametherm introduced a new NTC thermistor probe assembly for high-accuracy temperature sensing and measurement in Li-ion battery power applications. The device combines a specially designed ring lug for battery mounting with a high dielectric voltage rating of 4000 VAC.
Ametherm's NTC thermi
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Date:
06/19/2018
Shigenao Ishiguro, President and CEO of TDK Corporation, and Yoshiko Tanahashi, Director of Clarivate Analytics Japan
TDK Corporation announced that it has been selected as one of the 2017 Top 100 Global Innovators (http://top100innovators.clarivate.com/content/tdk) by Clarivate Analytics (formerly the Intellectual Property and Science business of Thomson Reuters). This is the fourth time TDK has been named to the prestigious lis
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Date:
06/19/2018
The capacitive isolation concept board from Helix Semiconductors has passed UL testing required under the IEC 60950-1:2005 standard.
IRVINE, Calif. -- Fabless power semiconductor company Helix Semiconductors announced that its patent-pending approach to capacitive isolation, implemented in the company’s capacitive isolation concept board, has passed UL testing required under the IEC 60950-1:2005 standard. The successful completion of UL t
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Date:
06/19/2018
Global energy efficiency standards often prohibit manufacturers from importing or selling products that do not meet these standards. In order to comply with specific minimum requirements, energy losses have to be reduced by using the latest technology. Infineon Technologies now offers the IM512 and IM513 series of the CIP
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Date:
06/18/2018
Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. (NASDAQ: MXIM). The compact converters, which offer the industry’s lowest EMI performance for low-voltage point-of-load applications, are
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Date:
06/18/2018
KEMET has expanded its industry-leading X7R 250 volt multilayer ceramic capacitor series to include smaller case sizes and increased capacitance values. These compact surface mount technology footprints benefit designers in saving printed circuit board space while reaching capacitance values up to 0.47 mic
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Date:
06/18/2018
Infineon Technologies expands its product portfolio of the thin-wafer technology TRENCHSTOP™5 IGBT. The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK. The new TRENCHSTOP 5 IGBT in D2PAK package serves the growing deman
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Date:
06/18/2018
Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in Nürnberg. The new packaging has been developed to further improve the rupture resistance of the device, thereby reducing the likelihood of damage to surrounding componen
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Date:
06/18/2018
KEMET introduced its first 150°C Automotive KO-CAP capacitor. The T599 KO-CAP High Humidity/High Temperature Performance Polymer series delivers stability and endurance under harsh humidity and temperature conditions.
Building on the success of the T598 series, KEMET further refined the design, mate
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Date:
06/18/2018
Analog Devices announced its latest generation of reinforced isolated power converters, setting a new benchmark for low component-level radiated emissions allowing systems to meet EN 55022/CISPR 22 Class B Electromagnetic Interference (EMI) standard requirements. The ADuM5020/6020 and ADuM5028/6028 series eliminate the n
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Date:
06/18/2018
FormFactor introduced the TESLA200 high power semiconductor probing system. Designed specifically for IGBT and power MOSFET device measurements, the TESLA200 provides accurate data at up to 10,000 V and up to 600 A current. Combining next-generation test capabilities, with anti-arcing solutions and wafer automation,
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Date:
06/18/2018
HBM’s new Z6R bending beam load cell has been designed for maximum capacities ranging from 20 to 200 kg. It is outstanding for its extremely robust enclosure, dirt-repellent design, and compatibility with the Z6 load cell. Typical fields of application can be found in the packaging or food-processing industries.
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Date:
06/18/2018
ON Semiconductor has announced a new range of ultra-low noise LDO regulators with the industry’s best power supply rejection ratio (PSRR), enabling better performance in noise sensitive analog designs. The new NCP16x series, along with the AEC-Q100 qualified NCV81x automotive variants, delivers improved performance in
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Date:
06/18/2018
TUCSON, Arizona, U.S.A. ––The new PA194 from Apex Microtechnology is a refined implementation of the Apex PA94, extending slew rate capabilities by +1,000 V/μs. The PA194
has a typical slew rate of 1700 V/μs to enable fast rise and fall times on supply voltage operation of
up to 900 V, and a very low noi
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Date:
06/13/2018
Lowell, Massachusetts–MACOM Technology Solutions Inc. (“MACOM”) announced a new portfolio of wideband double-balanced mixers, covering the 8 – 43 GHz and 18 – 46 GHz frequency ranges. Delivering low conversion loss, high linearity and a wide intermediate frequency (IF) bandwidth, the new MAMX Series mi
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Date:
06/13/2018
Beaverton, OR - RIGOL Technologies expands its portfolio of RF Test Instrumentation with the introduction of the New RSA3000 Real-Time Spectrum Analyzer.
RIGOL introduced our Real-Time Analysis solutions with the RSA5000 earlier this year. It combined the power of a high performance swept spectrum analyzer
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Date:
06/13/2018
Powerbox announces the introduction of its supercapacitor boost technology, S-CAP BOOST, offering backup and peak power solutions to industrial and medical applications. Based on the latest supercapacitor technology combined with intelligent control and monitoring, S-CAP BOOST offers a solution to equipment manuf
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Date:
06/13/2018
Rigol Technologies EU GmbH introduces four new high-end oscilloscopes with a large 10,1“ touch-color display.
The MSO/DS7000 is a versatile mixed-signal high-performance oscilloscope that incorporates many of the latest Rigol own designed ChipSet ASIC technology and integrated processes. With b
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Date:
06/13/2018
TDK Corporation is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative system-in-package solution for PCB-less applications. It includes two full TMR bridges, a dedicated ASIC for signal conditionin
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Date:
06/13/2018
Ultra fast acquisition rate of one million waveforms per second, realtime compensation of transmission losses (deembedding) between the signal source and oscilloscope, and silent operation even at full load – these are just some of the benefits of the high-performance R&S RTP oscilloscope family.
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Date:
06/13/2018
Würth Elektronik eiSos expands its product family of MagI³C power modules with the compact MagI³C VDRM (Variable Step Down Regulator Module) in a LGA-16EP package. The module has an input voltage range of 4 to 18 V for converting voltages from the 5 V, 9 V or 12 V bus. The very compact component (9 x 9
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Date:
06/13/2018
IQD Frequency Products are pleased to announce that they have signed a global distribution agreement with Digi-Key Electronics, one of the world’s leading distributors of electronic components. Through this agreement, Digi-Key will distribute IQD’s frequency products worldwide. The IQD product line, availa
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Date:
06/13/2018
HARTING has developed a range of miniaturised power interfaces with integrated electro-optical conversion, enabling customers to save time and money by combining electrical connectivity and optical transmission in the same module.
The new interfaces are designed for use with powerful electric drives controlle
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Date:
06/13/2018
Nexperia, today announced that two of its LFPAK56-packaged portfolio of MOSFETs are now available with improved creepage and clearance to meet UL2595 requirements for battery-powered equipment rated between 15 and 32 V. Devices are 100% compatible with the industry-standard Power-SO8 footprint; no other compact, surface-m
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Date:
06/13/2018
Hoffman Estates, IL. – Industrial automation solutions provider Omron Automation Americas recently announced the 2017 fiscal year’s winners of the prestigious Distributor of the Year award at its FY18 Sales Conference during the week of May 21st. Over 650 persons representing Omron and its channel pa
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Date:
06/12/2018
FOUNTAIN INN, S.C. – AVX Corporation has joined the Electronics Representatives Association (ERA) as a manufacturer member.
“AVX is proud to become a member of the ERA,” said Alex Schenkel, vice president of global sales, AVX. “The ERA is one of the most respected international trade organizations in the gl
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Date:
06/08/2018
In some ways digital designers have it easier than their analogue and mixed signal compatriots. They have many more tools at their disposal to verify and validate designs before they go to fabrication, which can bring a reasonable measure of assurance that they have their design right, as well as tools that ca
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Date:
06/05/2018
KYOTO, Japan and OTTAWA, Canada – ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.
This strategic partnership leverages GaN Systems’ industry leading capabilit
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Date:
06/04/2018
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