The four new multilayer chip inductor series are optimized for RF applications and deliver high-frequency performance with a compact, low‑profile design
Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction
Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G, CE0603M, CE1005Q, and CE1608Q Series. These new inductors feature a monolithic structure achieved through advanced multilayer technology giving power electronics designers a high-reliability, stable and superior signal integrity solution. These four series are available in compact form factors ranging from 1608 and 1005 down to the smallest 0603 mm, providing designers with more options in smaller sizes.
Helping to enable enhanced performance in high-frequency circuits, the new chip inductors feature high Self-Resonant Frequency (SRF) values of up to 20,000 MHz with tight inductance tolerance and rated current values from 100 to 1000 mA. All four high-SRF inductor series feature an operating temperature range from -55 to +125 °C, and have been optimized for use in RF amplifiers, low-voltage power supply modules, radio transmitters, radar, wireless communication and various mobile electronic devices.
Bourns® CE0603G, CE0603M, CE1005Q, and CE1608Q Series Multilayer Chip Inductors are available now and are RoHS compliant*. For more detailed product information, please go here.
