The products are suitable for high-density applications such as ADAS and automotive ECUs.
The continuing electrification of vehicles in recent years has significantly increased the number of electronic and semiconductor components used per vehicle. Consequently, the need for a dramatic increase in component density has become even more important. For example, the average number of multilayer ceramic capacitors and semiconductor components installed in a single automotive ECU is expected to increase by 30%, from 186 in 2019 to 230 in 2025. At the same time, for high density automotive applications that demand greater miniaturization, studies are currently underway on bottom electrode packages that can achieve excellent heat dissipation in a compact form factor.
For automotive parts, automated optical inspection (AOI) is performed after mounting to ensure reliability, but with bottom electrode components the solder joint cannot be verified since the terminals are not visible, making it difficult to conduct visual inspection that meets automotive standards. ROHM has solved these issues with its original Wettable Flank technology that ensures an unprecedented side electrode height of 125µm in the 1.0mm × 1.0mm size, and leading to increased adoption by a number of vehicle manufacturers.
Extremely high solder mounting reliability is achieved during AOI in automotive systems that require high quality. In addition, the new bottom electrode package simultaneously provides both breakthrough miniaturization and high heat dissipation, making it ideal for ADAS and automotive ECUs featuring higher board densities.