Consumer

July 2016

RUTRONIK now offers ARM-based starter kits from Advantech

ARM-based Starter Kits powered by NXP and TI processors

RUTRONIK now offers ARM-based starter kits from Advantech

With its new ARM-based Starter Kits powered by NXP and TI processors, Advantech provides a shortcut for ARM platform evaluation and development, and are now available through Rutronik. The ARM-based starter kit includes key elements of a development environment including main boards with CPU cables, adapter ca

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Date:

07/28/2016

Open-source Bluetooth low-energy beacon is simple to program and debug via the Cloud

Puck.js Bluetooth low-energy beacon

Open-source Bluetooth low-energy beacon is simple to program and debug via the Cloud

Nordic Semiconductor announced the availability on Kickstarter of a Nordic nRF52832 SoC based Bluetooth low energy (formerly Bluetooth Smart) beacon, named Puck.js, that is said to be so simple to program almost anyone can do it wirelessly from a website using a graphical editor or easy-to-learn JavaScript instead of

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Date:

07/28/2016

STMicro's STM32L4 ultra-low-power MCUs offer rationalized peripheral set to support cost-optimized solutions

Offering a rationalized peripheral set, two new ultra-low-power STM32L4 product lines from ST Microelectronics provide a cost-optimized solution. With up to 256 Kbytes of Flash memory, our new STM32L43x MCUs comprise variants with versatile combinations of an integrated USB controller and LCD controller, while ST

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Date:

07/27/2016

myDevices and Senet announce IoT tech partnership

myDevices, creators of Cayenne, the drag-and-drop IoT project builder, and Senet, a North American provider of public, low-power, wide-area networks (LPWANs) for long range-based (LoRa-based) Internet of Things (IoT) applications, announced their IoT technology partnership. The collaboration between the two co

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Date:

07/27/2016

Molex launches Transcend Alliance to promote network-connected lighting

Molex has announced that six partners have joined the new Transcend Alliance, a consortium of companies working together to expand and promote the use of network connected lighting in commercial buildings by developing and implementing new systems and protocols. New integrated lighting network solutions, su

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Date:

07/27/2016

Automotive 4.0 – the new revolution?

Patrick Le Fèvre, Powerbox

The automotive segment is often misunderstood, quickly being solely associated with cars and related applications. It is however much bigger than that, including a broad range of applications such as buses, trucks, industrial vehicles, mobile machinery and mining equipment, forklifts, cleaning automated machines, as

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Date:

07/27/2016

Driving infotainment systems

Driving infotainment systems

Takashi Kimura ROHM

As the use of electronics in automobiles increases steadily in recent years, there is a higher demand to improve fuel efficiency. Wide-ranging development efforts, such as reducing car body weight, improving tire performance, and raising the efficiency of electronic circuits are being made by automobile manufacturers as

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Date:

07/27/2016

ams acquires color and spectral sensing specialist MAZeT

ams, a leading provider of high-performance sensors and analog ICs, has closed the transaction to acquire 100% of the shares in the color and spectral sensing systems specialist MAZeT for an undisclosed amount in cash. The strategic acquisition extends ams’ market leadership in advanced optical sensors and st

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Date:

07/26/2016

Panasonic launches industry-thinnest aerogel thermal insulation solution

NASBIS is made of a material called aerogel

Panasonic launches industry-thinnest aerogel thermal insulation solution

Panasonic Automotive & Industrial Systems Europe has recently unveiled a thermal insulation sheet which is the thinnest insulation solution currently available on the market. The NASBIS (Nano Silica Balloon Insulation Sheet) high-performance thermal insulation sheet comes with a thickness of 50μm, 100 μm, 50

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Date:

07/26/2016

Power Integrations appoints Thomas Simonis VP of High-Power Products

Power Integrations, a leader in driver technology for high-voltage IGBTs and SiC MOSFETs, announced the appointment of Thomas Simonis as VP of high-power products with responsibility for product management, R&D and marketing. With over 25 years of service in the high-voltage motor-driver and semiconductor in

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Date:

07/26/2016

Toshiba helps downsize LED modules with single-wire input illumination LED driver

The TB62D786FTG has a single-wire Manchester-encoded interface

Toshiba helps downsize LED modules with single-wire input illumination LED driver

Toshiba Electronics Europe has introduced a 9-channel output LED driver IC that will save board space and reduce the size of LED modules in a variety of lighting and illumination applications. The TB62D786FTG has a single-wire Manchester-encoded interface, which is often used for wireless communication. Bu

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Date:

07/26/2016

Fairchild’s active bridge solution enhances performance for PoE-based IoT devices

GreenBridge active bridge quad MOSFET FDMQ8205

Fairchild’s active bridge solution enhances performance for PoE-based IoT devices

Fairchild, a leading supplier of high-performance semiconductor solutions, enhanced its industry-leading GreenBridge active bridge quad MOSFET technology with FDMQ8205, the first member of its next-generation GreenBridge series for applications that receive power via Power Over Ethernet (POE), such as security ca

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Date:

07/25/2016

Verizon to acquire Yahoo’s operating business

Verizon Communications and Yahoo! announced they have entered into a definitive agreement under which Verizon will acquire Yahoo’s operating business for approximately $4.83 billion in cash, subject to customary closing adjustments. Yahoo informs, connects and entertains a global audience of more than 1 bi

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Date:

07/25/2016

AVX's latest locking plug contacts suit B2B apps

70-9159 Series single two-piece contacts

AVX's latest locking plug contacts suit B2B apps

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has added a locking plug to its low-profile 70-9159 Series single two-piece contacts for high current, coplanar PCB mating applications, which deliver the industry’s smallest profile capable of supporting a full 5A. The la

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Date:

07/25/2016

GCT launches high-performance USB type-C connector family

GCT USB Type-C connector

GCT launches high-performance USB type-C connector family

Global Connector Technology (GCT), a leading global supplier of PCB connection solutions, has introduced a range of high-performance USB Type-C connectors that sets new market standards in design flexibility, transfer speed, power and usability. Designed for mobile and smart devices, the USB Type-C connect

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Date:

07/25/2016

Wuerth unveils mix-and-match power coil selection tool

Mix and Match precise AC loss calculator for power inductors

Wuerth unveils mix-and-match power coil selection tool

Wuerth Elektronik eiSos makes a broad product spectrum of wireless power charging coils. Now the company provides developers with a tool to simplify selection of the right transmitter and receiver coils. Mix and Match, like the world's most precise AC loss calculator for power inductors, is another offering fro

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Date:

07/25/2016

Conductive inks: big players forced to go niche

Dr Khasha Ghaffarzadeh, Research Director, IDTechEx

IDTechEx Research believes the conductive inks and pastes market is subject to major change with long-lasting consequences on the business models of many large incumbent suppliers. The decline and/or sluggish growth coupled together with intense competition in core markets has forced many suppliers to re-think the

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Date:

07/25/2016

KEMET unveils advanced high-stability ceramic dielectric capacitor tech

Advanced U2J Class-I ceramic dielectric capacitor

KEMET unveils advanced high-stability ceramic dielectric capacitor tech

KEMET, a leading supplier of electronic components, introduced its advanced U2J Class-I ceramic dielectric capacitors. This U2J surface mount platform offers more than twice the capacitance available in C0G/NP0. It also provides superior temperature performance over X7R, X8R and X5R, rendering it an ideal capacitor sol

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Date:

07/22/2016

Power Integrations' TRIAC-dimmable LYTSwitch-7 LED driver ICs can cut the BOM by 40%

LYTSwitch-7 single-stage, non-isolated, TRIAC-dimmable, buck topology LED driver IC

Power Integrations' TRIAC-dimmable LYTSwitch-7 LED driver ICs can cut the BOM by 40%

Power Integrations, a leader in high-efficiency, high-reliability LED driver ICs, announced its LYTSwitch-7 single-stage, non-isolated, TRIAC-dimmable, buck topology LED driver IC family. Capable of delivering up to 22 watts without a heatsink in a very small SO-8 footprint, these high-efficiency devices are su

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Date:

07/22/2016

A mid-year checkup on 2016 GaN tech predictions

Xray-in-a-pill colonoscopies will gain European approval in 2016 and will eliminate the key barriers to early detection of Colon Cancer

A mid-year checkup on 2016 GaN tech predictions

Alex Lidow, CEO and Co-founder of Efficient Power Conversion

Prognosticators do not often risk their reputations by giving their predictions a “checkup” midway through the period of their predictions. But, I am going to give it a shot and here we go… Wireless Power Will Become Mainstream Wireless power will continue to gain traction with increased consumer demand c

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Date:

07/21/2016

ams' latest light sensors can shrink smart phone apertures up to 50%

TMD2725 combined proximity and ambient light sensor

ams' latest light sensors can shrink smart phone apertures up to 50%

ams, a leading provider of high performance sensors and analog ICs, introduced new proximity sensing and proximity/ambient light sensing modules which enable android smartphone manufacturers to reduce the sensor aperture in the display’s cover glass to its smallest diameter. Use of the TMD2620 proximity sensor or

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Date:

07/19/2016

Renesas and SEGGER collaborate to accelerate expansion of RX Ecosystem

Renesas Electronics Europe and SEGGER announced their collaboration to facilitate expansion of the ecosystem of Renesas’ RX Family of 32-bit microcontrollers (MCUs) through adoption of SEGGER’s newly-released SystemView software. Forthwith SystemView will support streaming over J-Link, as well as real-time an

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Date:

07/19/2016

Murata introduces thin laminate energy storage device

UMAL low-profile high capacity energy device

Murata introduces thin laminate energy storage device

Murata announced the UMAL, a low-profile high capacity energy device. Designed to meet the demand for a slim high capacity energy source with a maintenance-free extended life cycle in wireless sensor nodes, the UMAL has charge/discharge and life-cycle characteristics superior to conventional secondary batteries. The UMAL has a

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Date:

07/19/2016

TI claims fastest isolated gate driver

Texas Instruments introduced the industry’s fastest 5.7-kVRMS isolated dual-channel gate driver, the first of a new gate driver family in TI’s isolation portfolio. The UCC21520’s flexible, universal compatibility enables its use as an isolated driver in low-side, high-side, high-side/low-side or half-bridge pow

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Date:

07/19/2016

Arrow signs agreement for Cypress Semi's IoT portfolio

WICED Cypress' IoT platform

Arrow signs agreement for Cypress Semi's IoT portfolio

Arrow Electronics will distribute Cypress Semiconductor’s newly acquired Internet of Things (IoT) portfolio, comprising state-of-the-art Wi-Fi, Bluetooth and ZigBee RF technologies capable of connecting nearly every emerging product category in the IoT ecosystem – including home appliances, health and fitness mo

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Date:

07/15/2016

Indium’s ITO and IGZO Reclaim and Recycle Program helps increase ROI

Indium's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials

Indium’s ITO and IGZO Reclaim and Recycle Program helps increase ROI

Indium's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials. ITO and IGZO targets are widely used for coating glass and display surfaces. Since not all the material is consumed in the deposition process, Indium Cor

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Date:

07/14/2016

Murata launches compact low-cost standalone LoRa module

LoRaWAN long range wireless module

Murata launches compact low-cost standalone LoRa module

Murata announced the launch of a compact low-cost low power wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol. This standalone compact module measures just 12.5 x 11.6 x 1.76 mm, is constructed in a metal shielded package and comprises a Semtech SX1276 ultra long ra

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Date:

07/14/2016

Rutronik and Nanya sign franchise contract

Nanya Technology and Rutronik Elektronische Bauelemente have concluded a Europe-wide franchise contract, that covers the entire Nanya product portfolio of SDRAM memory. Nanya develops, produces and distributes standard and mobile SDRAM memory. The Taiwanese manufacturer is specifically targeting the automotive an

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Date:

07/12/2016

Allegro's DMOS microstepping driver offers translator, overcurrent protection

A5985 stepper motor driver IC

Allegro's DMOS microstepping driver offers translator, overcurrent protection

Allegro MicroSystems Europe announced a new integrated bipolar stepper motor driver IC with built-in translator for easy operation. Allegro’s A5985 is designed to operate bipolar stepper motors from full-step up to 1/32 step modes that are selectable by MSx logic inputs. This new device has an output drive cap

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Date:

07/12/2016

Diodes' mini secondary-side MOSFET driver reduces BOM cost in 5V to 12V supplies

APR345 secondary-side MOSFET driver

Diodes' mini secondary-side MOSFET driver reduces BOM cost in 5V to 12V supplies

The APR345 secondary-side MOSFET driver introduced by Diodes Incorporated delivers the smallest size, lowest BOM cost solution for synchronous rectification in 5V to 12V power supplies. This device is suitable for line-powered adapters and chargers for consumer products such as smartphones and tablets, PVRs an

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Date:

07/12/2016

Nordic Semi unveils product roadmap for low-power cellular IoT

Nordic Semiconductor announced the development of a low-power LTE technology for cellular IoT.

Nordic Semi unveils product roadmap for low-power cellular IoT

Nordic Semiconductor, a leading provider of ultra low power wireless connectivity, announced the development of a low power LTE technology for cellular Internet of Things (IoT). This development leverages Nordic Semiconductor's more than 10 years of leadership in ultra low power (ULP) wireless and its recruitment of

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Date:

07/12/2016

KOA Speer expands molded current-sense resistor line

SLN5 current sense resistors

KOA Speer expands molded current-sense resistor line

KOA Speer Electronics introduced the SLN5 Molded Current Sense Resistor, featuring a 7 Watt power rating in 4527 size. The SLN5 offers a terminal port temperature of 70°C. This is a molded resin resistor designed for current detection and provides excellent dimension accuracy, mountability, and shock resistance. In

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Date:

07/11/2016

Analogy Devices’ D/A converter empowers next-gen television

AD9162 converter

Analogy Devices’ D/A converter empowers next-gen television

Analog Devices, Inc. (ADI) today introduced a D/A converter that brings the future of television to today's home viewers, enabling them to enjoy ultra–high-definition (UHD) and 4K television across more channels at unprecedented streaming and download speeds. The new AD9162 D/A converter represents a breakthrough for t

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Date:

07/11/2016

PSDcast - Wenjun Sheng of Telink Semi on IoT connectivity

Wenjun Sheng, CEO of Telink Semiconductor

PSDcast - Wenjun Sheng of Telink Semi on IoT connectivity

In this PSDcast Wenjun Sheng, CEO of Telink Semiconductor, talks to Alix Paultre of Power Systems Design about the infrastructure of the IoT, especially in the devices themselves. Connectivity is a part of the description of the IoT, yet device wireless protocols and systems are still in flux. Telink Semiconductor an

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Date:

07/11/2016

STMicro releases dev ecosystem, adds low-power STM32L4 Micros

the slim-form-factor NUCLEO-L432KC board

STMicro releases dev ecosystem, adds low-power STM32L4 Micros

STMicroelectronics has introduced the development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers (MCU) and expanded the series with five new product lines comprising a range of package and memory-density options. The expanded STM32L4 ecosystem builds on ST’s free and easy-

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Date:

07/07/2016

SEGGER’s debug tech now available for Zilog’s ZNEO32! family

SEGGER has introduced J-Link support for Zilog’s ZNEO32! Cortex-M3 based family of MCUs

SEGGER’s debug tech now available for Zilog’s ZNEO32! family

SEGGER has introduced J-Link support for Zilog’s ZNEO32! Cortex-M3 based family of microcontrollers (MCUs). This includes support for debug, as well as Flash-based programming. Production line programming is also available via the SEGGER Flasher family. Projects using the ZNEO32! MCUs can now take advan

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Date:

07/07/2016

ERG Lighting introduces eLumination driverless AC LED light engines

eLumination driverless AC LED light engine

ERG Lighting introduces eLumination driverless AC LED light engines

The eLumination Series from ERG Lighting is a family of driverless AC LED light engines for architectural, display and down lighting that have a flicker index of only 0.15 – less than half of the 0.34 offered by the competition. They are U.S. made and offered in 4” and 6” round versions for downlights an

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Date:

07/06/2016

Infineon backs European Commission in developing cybersecurity guidelines

Infineon Technologies is taking an active role in the development of European-level cybersecurity guidelines, now that the European Commission signed the contract for a Public-Private-Partnership (PPP) with the European Cyber Security Organisation (ECSO) ASBL. Representing the private sector, ECSO will work di

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Date:

07/06/2016

AR Systems appoints new Japan Country Manager

Hiroshi Ishikawa

AR Systems appoints new Japan Country Manager

IAR Systems announces that the company has appointed Hiroshi Ishikawa as Country Manager for Japan. Kiyofumi Uemura, who has been acting as both APAC Director and Japan Country Manager, will focus on his role as APAC Director as well as a new role as globally responsible for IAR Systems automotive business. “Our business

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Date:

07/06/2016

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