Data Centers

August 2019

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Figure 1: Comparison of Superjunction transistor, SiC MOSFET, and GaN HEMT

The Road to Success for Power Semiconductors

By Dr. Gerald Deboy, Senior Principal Power Semiconductors and System Engineering and René Mente, MSc, Staff Application Engineer, Infineon Technologies

The commercial availability of Superjunction transistors 20 years ago, challenged and finally proved wrong the limitations of conventional silicon-based transistors with respect to on-state resistance. What was regarded as revolutionary at that time is standard today. Today there is not a single transistor from 25

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Date:

08/31/2019

Socket and Hardware Products Support Intel's Processors

HARRISBURG, Pa. -- TE Connectivity (TE) introduced its LGA 4189 socket and hardware products, which support Intel next-generation central processing units (CPUs) for higher performance and better system scaling. LGA 4189 sockets are designed for Intel's next-generation processors, which support PCIe Gen 4 and fou

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Date:

08/29/2019

Anup Bhalla, Vice President Engineering, UnitedSiC

Are you SiC of Silicon? – Part 5

By: Anup Bhalla, Vice President Engineering, UnitedSiC

Ultra-High Voltage SiC and Supercascodes New applications are emerging that require high voltage switch technology which is significantly lower in balance-of-system costs and operating losses than silicon IGBT and IGCT technology. This spans a wide range from solid state transformers, MW motor drives, to smart

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Date:

08/20/2019

High isolation, regulated DC/DC converters in compact package

The core characteristic of the TRI line is a sophisticated reinforced isolation system which is able to withstand high test voltages (9000 VDC for 1s and 5000 VAC for 60s) and working voltages (1000 VACrms). Complementing this isolation characteristic is a high Common Mode Transient Immunity of 15 kV/µs. The

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Date:

08/09/2019