Power Systems Design (PSD) Information to Power Your Designs

CPP Investments and Equinix join forces to acquire atNorth to further accelerate growth in the Nordics

CPP Investments and Equinix Join Forces to Acquire atNorth to Further Accelerate Growth in the Nordics

atNorth, the leading Nordic high-density colocation and built-to-suit data center provider, today announced that Canada Pension Plan Investment Board (CPP Investments), and Equinix have entered into a joint agreement to acquire atNorth from Partners Group. The US$4 billion enterpris

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Date:

02/27/2026

BeyondMath Completes $18.5 Million Seed Round to Scale World's Largest Foundational Physics AI Model

BeyondMath, a deeptech company that has developed a first-of-its-kind generative physics model, has closed a $10 million Seed extension led by Cambridge Innovation Capital, alongside existing investors including UP.Partners, Insight Partners, and InMotion Ventures. This closes the Seed Round at $18.5 million. Engineering and indus

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Date:

02/26/2026

Ventiva Zoned Cooling Design Enables Targeted Air Cooling for AI Edge Devices

Ventiva®, a leader in thermal solutions, introduces a new architectural approach to thermal management that can transform how heat is managed in electronic devices. Ventiva's Zoned Cooling™ design uses the company’s ionic cooling technology to position airflow by zone and reduce system imp

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Date:

02/26/2026

First Fully Integrated, Highly Configurable 80 Gbps Differential DP3T Switch for Advanced AI Device Validation

Menlo Microsystems, Inc. announced the MM5627, the first switch in its category to combine 80 Gbps performance with high configurability, integrated DP3T logic, and fully integrated on-chip components. Designed for high-speed test and validation of AI GPUs, CPUs, and advanced semiconductor ICs, the MM5627 en

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Date:

02/24/2026

KIOXIA Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications

KIOXIA Europe, a world leader in memory solutions, today announced that KIOXIA Corporation has begun shipping evaluation samples of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC. UFS 5.0 is a new standard for embed

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Date:

02/24/2026

Navitas Unveils 5th Generation SiC Trench-Assisted Planar Technology

Navitas Semiconductor announced the launch of its 5th-generation GeneSiC technology platform. The High Voltage (HV) SiC Trench-Assisted Planar (TAP) MOSFET technology represents a significant technological leap over previous generations and will deliver an industry leading 1200V line of MOSFETs. It complements Na

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Date:

02/13/2026

Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise

Keysight Technologies, Inc. announced SOS Enterprise, an advanced edition of its engineering data management platform. The solution builds on the SOS Core software and automates engineering data governance and traceability to prepare for AI adoption at scale. As semiconductor and electronics dev

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Date:

02/11/2026

Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era

Exponential AI growth is outpacing utility expansion and available generation capacity, creating a growing gap that limits where AI infrastructure can be built and how quickly it can be powered. Endeavour today announced TurboCell, a rapidly deployable, scalable power system that accelerates time-to-compute wh

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Date:

02/11/2026

Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The new EC

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Date:

02/10/2026

Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers

Navitas Semiconductor, a leader in GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, unveiled a breakthrough 10 kW DC-DC power platform delivering up to 98.5% peak efficiency and 1 MHz switching frequency, enabling unprecedented power density to support the rapid, la

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Date:

02/09/2026

TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

TDK Corporation expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling se

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Date:

02/05/2026

Dijam Panigrahi, COO of GridRaster

PSDcast – Agentic AI and the Smart Factory

And in order for smart factories to truly evolve, they may need to embrace the insights and preemptive capabilities provided by artificial intelligence. In this way, they can move from the "experimental pilots" of 2025 into a landscape of integrated, agentic autonomy. And on the line to discuss th

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Date:

02/04/2026

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Figure 1: Side-by-side comparison of cloud-based vision processing vs the instant result of an Edge AI camera

Ultra-Low-Power Edge Processing: Redefining What's Possible in Always-On Intelligence

Dr. Mohamed M. Sabry Aly, CTO & Founder, EMASS

Since the global mainstreaming of generative AI in late 2022, AI now curates TikTok and Instagram, personalizes shopping on Amazon, helps us navigate in Google Maps, powers real-time translation, enables biometric authentication, and flags fraud in financial systems. AI is a daily utility, silently shaping our ch

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Date:

02/01/2026

Powering AI