Automotive & Transportation

    May 2025
    Optimizing Flying Capacitor Multilevel Converters for GaN Technology

    Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter

    Introduction Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it
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    Date:
    05/30/2025
    15W AC/DC Power Modules feature Widest Input Range

    RECOM’s versatile and cost-effective ultra-wide input AC/DCs do not compromise on performance

    ­  RECOM has again pushed the boundaries of AC/DC performance with a miniature15W part that operates over a wide input range of 18-264VAC or 18-375VDC.   The board-mount RAC15-K/WI is just 1.5” x 2” (52.5mm x 40mm) footprint with an industry-standard pinout or optionally flying wires, and provides a range o
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    Date:
    05/29/2025
    Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag

    Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag

    ­In the current marketplace, Bill of Material (BOM) costs are continuing to rise and developers must work to optimize performance and budgets. Recognizing that a significant portion of the mid-range FPGA market does not require integrated serial transceivers, Microchip Technology is releasing PolarFire® Core Field-Programmable Ga
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    Date:
    05/20/2025
    PSDcast – Power Interconnects for EVs

    Ennovi’s Dominik Pawlik

    ­With hybrid and electric vehicles growing in complexity, every component within them must also evolve. Power interconnects, for instance, and how power busbars have become preferable over traditional wiring systems. Ennovi recently wrote an article for us addressing this very topic -- Power Interconnects from Hybrids to Electric Vehicles – and on the line to discuss it is Ennovi’s Dominik Pawlik.
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    Date:
    05/15/2025
    Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control

    Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control

    ­STMicroelectronics’ new high-voltage half-bridge gate drivers for GaN applications add extra flexibility and features for greater efficiency and robustness. The latest STDRIVEG610 and STDRIVEG611 give designers two options to manage GaN devices in power conversion and motion applications for great
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    Date:
    05/14/2025
    EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines

    EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines

    ­TDK Corporation has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025. These 1608-size chip beads for power supply lines achieve a rated current o
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    Date:
    05/13/2025
    Infineon and Visteon Collaborate on Advanced Power Conversion Systems for Next-Generation Electric Vehicles

    Peter Schaefer, Chief Sales Officer Automotive, Infineon Technologies AG

    ­Infineon Technologies AG, the leading provider of automotive semiconductors, and Visteon Corporation, a global leader in automotive cockpit electronics, today announced the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains. In this join
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    Date:
    05/09/2025
    Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

    Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

    ­Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced five new reference designs targeting 800 V automotive applications based on the company’s 1700 V InnoSwitch™3-AQ flyback switcher ICs. Spanning power levels from 16 W to 120 W,
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    Date:
    05/08/2025
    Infineon Introduces new CoolSiC JFET Technology for Smarter and Faster Solid-State Power Distribution

    To enable the next generation of solid-state power distribution systems, Infineon is expanding its SiC portfolio with the new CoolSiC™ JFET product family.

    ­To enable the next generation of solid-state power distribution systems, Infineon Technologies AG is expanding its silicon carbide (SiC) portfolio with the new CoolSiC™ JFET product family. The new devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal fo
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    Date:
    05/06/2025
    Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias

    Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias

    ­Inertial Labs, a VIAVI Solutions Inc. Company, today introduced the IMU-H100, a micro-electromechanical systems (MEMS) inertial measurement unit (IMU) developed to enhance tactical guidance and navigation capabilities of unmanned aerial vehicles (UAVs), short-range missiles and precision gu
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    Date:
    05/06/2025
    Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package

    Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package

    ­Navitas Semiconductor introduces a new level of reliability to meet the system lifetime requirements of the most demanding automotive and industrial applications. Navitas’ latest generation of 650 V and 1200 V ‘trench-assisted planar’ SiC MOSFETs combined with an optimized, HV-T2Pak top-side cooled pa
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    Date:
    05/05/2025
    The Daily Use of EV Chargers: Human Interface Technology

    Click image to enlarge

    Figure 1: EV parked outside residential home

    ­Automotive manufacturers are increasingly offering a wider selection of EVs to their fleet, which requires a larger quantity of easy-to-use chargers for customers. There are several types of chargers that are currently in use including Level 1, Level 2 and DC fast chargers depending upon their size and capacity. Ho
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    Date:
    05/01/2025
    Archive

    Power Systems Design

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    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.