Powering Communications
April 2013
A comparison of alternative on-board power solutions is rarely at the top of the agenda for a board designer. Often designers will use a previous solution because all available resources and time
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Date:
04/30/2013
Texas Instruments announced several design updates to TI E2ETM Community, its popular engineer-to-engineer online design community that now connects more than 120,000 engineers. TI has expanded
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Date:
04/30/2013
Semir Haddad from Renesas' microcontroller products and solutions division
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Date:
04/30/2013
EM Microelectronic, the semiconductor company of the Swatch Group and a leading supplier for RFID circuits, released the EM4325V11, a versatile and multipurpose, battery-assisted passive (BAP)
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Date:
04/30/2013
Maxim Integrated Products announced that it is now sampling the MAX77301 Li+ battery charger. It integrates the intelligence to enumerate with the host device, automatically identify the adapter
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Date:
04/30/2013
Vishay Intertechnology released an n-channel TrenchFET® power MOSFET in the thermally enhanced PowerPAK® SO-8 package that extends the company's ThunderFET® technology to 150 V. The SiR872ADP
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Date:
04/29/2013
Eltek, a leader in high-efficiency power systems for telecommunications, industrial applications and renewable energy projects, announced the availability of the Flatpack S, a new high-efficiency
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Date:
04/29/2013
Ido Sarig, Wind River's vice president of product marketing, demonstrates
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Date:
04/29/2013
The first in a platform of new high energy thick film resistors from Ohmite is now available from TTI, a leading specialist distributor of passive, connector, electromechanical and discrete components.
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Date:
04/29/2013
Alec Melnick, ROHM's Sr. Product Marketing Manager, describes the company's
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Date:
04/26/2013
Atmel, a leader in microcontroller (MCU) and touch technology solutions, today announced it has further simplified the MCU design process with the launch of its integrated development tools platform,
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Date:
04/26/2013
Mentor Graphics accelerates SoC and embedded development with a native embedded software environment
Mentor Graphics announced release of the Mentor® Embedded SourceryTM CodeBench Virtual Edition product, a native software environment for developing embedded systems pre- and post-silicon.
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Date:
04/26/2013
Analog Devices and Bourns have co-developed the first externally-certified EMC-compliant interface design tool for RS-485 circuits to protect against electromagnetic compatibility events in industrial
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Date:
04/26/2013
Amantys® and EMEF (Empresa de Manutenção de Equipamento Ferroviário, S.A), the leading operator in the Portuguese railway maintenance sector, has announced the deployment of Amantys Power InsightTMtechnology
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Date:
04/25/2013
Eltek announced the first delivery of a rectifier with an efficiency of up to 97.2 percent. The unit provides 3 kW at 48VDC and accepts a wide input voltage range. The rectifier can also be operated
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Date:
04/25/2013
Alpha and Omega Semiconductor, a designer and developer of power semiconductors and power ICs, announced the release of AON6250, the flagship device in its new 150V AlphaMOS™ medium voltage portfolio.
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Date:
04/25/2013
Yageo's AHA and AHP Series aluminium housed power resistors are now available from TTI, a leading specialist distributor of passive, discrete, connector and electromechanical components. Designed
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Date:
04/25/2013
LAPIS Semiconductor, a ROHM Group Company, is pleased to introduce the ML610Q100 series of low-cost, feature-rich, low-power microcontrollers. The new Mini Low Power Microcontrollers are especially
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Date:
04/24/2013
With BeagleBone Black, the next-generation offering from BeagleBoard.org, everyone from electronic artists to engineers has access to a ready-to-use, 1-GHz computer for only $45. This credit-card-sized,
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Date:
04/23/2013
Date:
04/22/2013
Panasonic has launched a new CSP MOSFET featuring Power Mount CSP Packaging (PMCP) with a unique pad design and drain clip technology that enables thermal dissipation to be improved by 5% in an 80%
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Date:
04/22/2013
Richardson RFPD announced its attendance and participation at the 25th International Exhibition for Telecommunications, Control Systems, IT and Communication Services—SVIAZ-Expocomm 2013. Sviaz-Expocomm
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Date:
04/19/2013
IR engineering and sales staff will demonstrate IR's latest energy-saving and high power density enabling technologies and products at the IR booth, Hall 9, Stand 413. The IR booth will feature
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Date:
04/19/2013
Date:
04/18/2013
Date:
04/17/2013
Linear Technology released the LT6110 cable drop compensator, a device that improves voltage regulation at remote loads without the need for Kelvin sense wires. The LT6110, a new component for
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Date:
04/17/2013
M/A-COM Technology Solutions, a leading supplier of high performance analog semiconductor solutions, introduced a single-channel CMOS Driver for Microwave Switching Applications. The MADR-009269
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Date:
04/17/2013
Linear Technology introduced the LTC3863, a high-voltage inverting DC/DC controller that uses just a single inductor to produce a negative voltage from a positive input voltage. Most low to medium
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Date:
04/16/2013
Date:
04/15/2013
Considering that almost 60 percent of total electric energy produced worldwide is used to run motors of every size, shape and efficiency, the adoption of variable speed drives can save as much as 70 percent of energy costs by controlling the speed of the load. New energy efficiency standards for compressors an
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Date:
04/15/2013
Many high power systems require the use of a hot-swap device to safely control of the inrush currents at powerup and provide fault protection.
These circuits are commonly found in systems such as servers, network switches, redundant-array-of-independent-disk (RAID) storage, and other forms of communications infrastru
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Date:
04/15/2013
Advanced Power Electronics, a leading Taiwanese manufacturer of MOS power semiconductors for DC-DC power conversion applications, has introduced the APE8968MP-HF3, a new series of 3A, ultra-low
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Date:
04/15/2013
Texas Instruments introduced a synchronous step-down DC/DC converter with integrated MOSFETs in a very small 3.5-mm by 3.5-mm HotRod™ QFN package. The SWIFT™ 10-A TPS54020 features the highest power
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Date:
04/15/2013
HP introduces its latest HP Basic Power Distribution Units (PDU).
HP Basic PDUs are designed for simple installation, reliability,
and cost-effective power distribution. HP Basic PDUs provide
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Date:
04/15/2013
Tad Keeley from Renesas describes Renesas' latest miniPOL devices for
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Date:
04/11/2013
Toshiba Electronics Europe has extended its family of high-speed photocouplers* for industrial applications. Supplied in a DIP8 package, the new TLP2955 and TLP2958 low-current drive devices provide
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Date:
04/10/2013
Texas Instruments introduced a family of lithium-ion battery charger ICs that reduce charge time by up to 50% in smartphones and tablets compared to other charger solutions. The bq2419x family of
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Date:
04/10/2013
Riedon is a specialist manufacturer and supplier of advanced resistive solutions, providing the advantages of precision wirewound resistor technology along with designs that are easily customized
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Date:
04/09/2013
TTI, a leading specialist distributor of passive, discrete, connector and electromechanical components, has introduced Bourns® TCS™ DL Series High-Speed Protectors. Incorporating dual well-matched
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Date:
04/08/2013
Nitronex, a leader in the design and manufacture of gallium nitride (GaN) based RF solutions for high performance applications in the defense, communications, broadband, and industrial & scientific
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Date:
04/04/2013
Mark Smith of Microsemi demonstrates the performance aspects of their
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Date:
04/04/2013
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