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Powering Communications

 



 

 

Powering Communications

February 2014
AVX claims lowest-profile 0603 & 0805 diplexers available

AVX's 0603 and 0805 MLO diplexers

AVX, a leading manufacturer of advanced passive components and interconnect solutions, offers the lowest profile 0603 and 0805 multilayer organic diplexers available in the market.  Compared to equivalent low temperature co-fired ceramic (LTCC) products, AVX's 0603 and 0805 MLO diplexers exhibit superior
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Date:
02/28/2014
Fairchild’s 650V green-mode buck switches offer high efficiency and design scalability

FSL306 and FSL336 650V Green Mode AC Buck Switches

Home appliance, industrial motor and smart meter applications require solutions that provide low standby power in order to achieve energy efficiency for the end user. At the same time, designers need power scalability to increase the power rating of a device for additional system functionality while simplifying
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Date:
02/26/2014
In this episode of PSDtv Christian Gruber of Maxim describes their latest sub-metering solution to empower smart homes and other intelligent energy management solutions at the 2014
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Date:
02/26/2014

eConais, a leader in ultra low power miniature Wi-Fi module solutions for the Internet of Things, has announced the world’s smallest, most easily integrated, and lowest standby power single chip 802.11b/g/n Wi-Fi System In Package (SiP) modules for the Internet of Things. To help speed the design
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Date:
02/26/2014
AVX boosts 0603 MLOC family capacitance by 2X

AVX 0603 Multilayer Organic Capacitor (MLOC)

AVX, a leading manufacturer of passive components and interconnect solutions, has doubled the capacitance of its 0603 Multilayer Organic Capacitor (MLOC) Series, extending the highest-rated capacitance value from 2.5pF to 5.1pF. Ideal for applications including RF power amplifiers, low noise amplifiers, filter
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Date:
02/26/2014
Global electronic components distributor Digi-Key, a leader in electronic component selection, availability and delivery, has added suppliers in response to customer demand for Internet of Things (IoT) solutions. As device connectivity becomes more prevalent, embedded and wireless suppliers offering machine-to-machine
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Date:
02/26/2014
Tyson Tuttle of Silicon Labs on embedded systems

Tyson Tuttle, CEO of Silicon Laboratories

In this PSDcast Tyson Tuttle, CEO of Silicon Labs, talks to Alix Paultre of Power Systems Design at the Embedded World Conference in Nuremberg about the current issues and challenges in the embedded systems space. Silicon Labs recently released the latest version of version of their Simplicity Studio development
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Date:
02/26/2014
Vishay's P-Channel Gen III MOSFET offers RDS(on) Down to 0.0016 Ω at -10V in a PowerPA SO-8 Package

TrenchFET p-channel Gen III power MOSFETs

Vishay Intertechnology extended its offering of TrenchFET® p-channel Gen III power MOSFETs with a new device that offers the lowest on-resistance ever for a p-channel MOSFET. Designed to increase efficiency in mobile computing devices, the -20 V Vishay Siliconix Si7157DP offers on-resistance of 0.0016 Ω and
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Date:
02/25/2014
Nujira, a leader in Envelope Tracking (ET) technology, has announced the availability of EasyET, a development toolkit that radically simplifies the deployment of ET and enables handset designers to achieve maximum RF front end system performance with minimal design effort. Nujira will be showing EasyET at Mobile
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Date:
02/20/2014
Eltek announced a DC/DC converter designed for 380VDC input and 48VDC output, providing 3 kW at 48VDC with an industry-leading efficiency of 98.2%.   “This unit expands the market for 380VDC power distribution significantly as it offers an end-to-end DC solution for a wide range of IT
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Date:
02/19/2014
Nordic Semiconductor unveils smart Bluetooth solution for Rezence wireless charging

Rezence is a wireless power transfer technology and specification based on the principles of magnetic resonance.

Ultra low power (ULP) RF specialist Nordic Semiconductor announced the immediate availability of the S120 8-link central protocol stack and the nRF51 Wireless Charging Software Development Kit (SDK) for wireless charging applications based on the Rezence™ standard, developed and maintained by the Alliance
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Date:
02/19/2014
David Mazur of Hitec on industrial UPS and power quality

David Mazur of Hitec

In this PSDcast David Mazur, Chief Technologist for Hitec Power Protection, talks to Alix Paultre of Power Systems Design about the current industrial UPS systems and the challenges and opportunities facing engineers in the space. UPS isn't just for power backup, a major benefit today is also power quality,
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Date:
02/19/2014
Delivering more than 200mA of output current can be a serious challenge for many high-voltage operational amplifiers. But for high voltage applications requiring as much as 1A of current, it is possible to meet this spec by pairing a current buffer with the op amp. What the current buffer brings to this arrangement
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Date:
02/18/2014
Given the range of industrial applications is extremely diversified  – from very small sensors powered by energy harvesting to mega processors used for process control and huge data computing capabilities required by some industrial equipment – the challenge for power designers remains the selection
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Date:
02/18/2014
Lattice Semiconductor will demonstrate new USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference taking
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Date:
02/17/2014
Intermediate bus voltages from 24V to 28V (nominal) are commonplace in industrial, aerospace and defense systems, where series-connected batteries may be a backup power source and 12V bus architectures tend to be impractical due to distribution losses. The widening voltage gap between the system bus and the
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Date:
02/17/2014
Designers of power control devices and those that combine control with power FET functionality are finding that FIB circuit edit techniques proven at older process nodes are delivering even greater benefits when used at advanced technology nodes.   It is also expected that FIB circuit edit techniques
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Date:
02/17/2014
Life to Return to the Power Supply Industry in 2014

Jonathon Eykyn, IHS Technology

The global market for power supplies crashed in 2012 as economic uncertainties led to low consumer demand and the postponement of large industrial projects. Whilst 2013 bought growth, it was limited to a few markets and the overall market grew by just 2.4%. However, the outlook for the global power supply market
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Date:
02/17/2014
Packaging for power electronics has evolved from simple metal bending to advanced materials and thermo-mechanical design, and from freestanding supply to integrated power management. System-size reductions made possible by higher switching frequencies and semiconductor miniaturization drove the early part of
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Date:
02/16/2014
We here at Ridley Engineering recently conducted a survey with a group of almost 3,000 active power supply design engineers to discover the various reasons and circumstances they have encountered power supplies that failed. The experiences the engineers shared with us were very enlightening, and this article
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Date:
02/15/2014
CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology. The device, produced by ST in their 28nm UTBB fully depleted SOI process technology,
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Date:
02/14/2014
Jumpstart IoT designs with STMicro's NFC Discovery Kit

ST’s M24SR Discovery Kit

At Embedded World 2014, STMicroelectronics will unveil an easy-access development platform for its M24SR dynamic NFC tags that are now entering volume production in all memory densities and package options. Accelerating the design of IoT applications, ST’s M24SR Discovery Kit contains everything engineers
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Date:
02/13/2014
Switching regulators are an excellent replacement for linear regulators in areas where low heat dissipation and high efficiency are valued. The switching regulator is typically the first active component on the input power bus line, and therefore has a significant impact on the EMI performance of the complete
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Date:
02/11/2014
AVX's polymer tantalum chip capacitors with undertab terminations target high-energy applications

TCN PulseCap tantalum solid-electrolytic chip capacitors

AVX, a leading manufacturer of passive components and interconnect solutions, has released its TCN PulseCap™ Series of tantalum solid-electrolytic chip capacitors, a polymer electrode version of AVX’s industry-favorite, high capacitance, and high energy TLN PulseCap Series. Available in the same single,
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Date:
02/10/2014
Introduced by Ericsson in 2008, 3E (Enhanced performance, Energy management and increased End-user value) digital power products and solutions became the reference, and preferred
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Date:
02/04/2014

 



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