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    XpressConnect PCIe 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers

    XpressConnect PCIe 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers

    ­As AI workloads continue to scale, data center architects are increasingly constrained by limited signal reach and rising latency, which can leave valuable memory resources underutilized across large GPU clusters. These challenges are amplified as interconnect speeds increase. At 64 GT/s (giga transfers per sec
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    Date:
    06/02/2026
    Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center

    Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center

    ­Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced two new ultra-slim, compact auxiliary power supply reference designs for 800 VDC AI data centers. The single-output, 15 W design is only 30 mm by 30 mm with a 7 mm profile, while the isolated, si
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    Date:
    06/01/2026
    VIAVI Introduces GNSS-Disciplined Oscillator for Precision Timing in Size, Weight and Power-Constrained Platforms

    VIAVI Introduces GNSS-Disciplined Oscillator for Precision Timing in Size, Weight and Power-Constrained Platforms

    ­VIAVI Solutions Inc. (VIAVI) has announced the launch of the µPNT GDO-1000, a new GNSS-disciplined oscillator built in the M.2 B-key form factor. Measuring just 22mm x 42mm, the size of a postage stamp, and weighing less than 4 grams, the GDO-1000 is designed for platforms requiring accurate timing in places wh
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    Date:
    06/01/2026
    MH3261‑T Series High Current Chip Ferrite Beads for EMI Suppression in High‑Density Power

    Bourns® MH3261-T Series Ferrite Beads for high-current EMI suppression

    ­Bourns announced the MH3261‑T Series High Current Chip Ferrite Beads, designed to address EMI suppression challenges in high‑density PCB layouts where current capacity and board space are constrained. The series combines a compact 3.2 × 1.6 mm footprint with low DC resistance and rated current capability up
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    Date:
    06/01/2026
    Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption

    Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption

    ­Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced the MM8108-M20, a high-power Wi-Fi HaLow module designed to help product teams in the US and Canada bring long-range, low-power Wi-Fi HaLow devices to market faster. Built around Morse Micro’s second-generation MM8108 Wi-Fi HaL
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    Date:
    06/01/2026
    Marvell Announces Availability of Industry's First 102.4 Tbps Switch Purpose-Built for AI and Cloud Data Center Infrastructure

    Marvell Announces Availability of Industry's First 102.4 Tbps Switch Purpose-Built for AI and Cloud Data Center Infrastructure

    ­Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today introduced Marvell Teralynx T100, the industry’s first 102.4 Tbps switch silicon purpose-built for the AI era. Unlike legacy switching platforms designed for traditional enterprise and cloud data centers, the Teralynx T1
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    Date:
    06/01/2026
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    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.