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Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag

Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag

Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag
­In the current marketplace, Bill of Material (BOM) costs are continuing to rise and developers must work to optimize performance and budgets. Recognizing that a significant portion of the mid-range FPGA market does not require integrated serial transceivers, Microchip Technology is releasing PolarFire® Core Field-Programmable Ga
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Date:
05/20/2025
Melexis Empowers Industrial Controllers with Cost-Effective Position Sensor

Melexis Empowers Industrial Controllers with Cost-Effective Position Sensor

Melexis Empowers Industrial Controllers with Cost-Effective Position Sensor
­Melexis is broadening the use of the MLX90427, an embedded position sensor with SPI communication, to joystick and Human-Machine Interface (HMI) applications in industrial, construction, agriculture and medical sectors. Its cost-effective design and on-chip DSP offer a significant advantage, wh
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Date:
05/15/2025
Mercury Introduces First Safety-Certifiable, SOSA-aligned Mission Computer for Aviation Platforms

Mercury Introduces First Safety-Certifiable, SOSA-aligned Mission Computer for Aviation Platforms

Mercury Introduces First Safety-Certifiable, SOSA-aligned Mission Computer for Aviation Platforms
­Mercury Systems, Inc. introduced the first safety-certifiable, SOSA-aligned aviation mission computer, which will allow government and commercial organizations to field and modernize aircraft that support next-generation applications such as those enabled by 5G communications and artificial intelligence. Mercury’s new 
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Date:
05/14/2025
Schneider Electric Unveils Industrial Gen AI Copilot in Collaboration with Microsoft

Aurelien LeSant, Chief Technology Officer, Schneider Electric, Industrial Automation

Schneider Electric Unveils Industrial Gen AI Copilot in Collaboration with Microsoft
­Schneider Electric, a leader in energy management and automation, introduces its industrial copilot, developed in collaboration with Microsoft. Designed to boost productivity and enhance workforce efficiency it integrates Microsoft Azure AI Foundry with Schneider Electric's advanced and sec
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Date:
05/14/2025
Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control

Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control

Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control
­STMicroelectronics’ new high-voltage half-bridge gate drivers for GaN applications add extra flexibility and features for greater efficiency and robustness. The latest STDRIVEG610 and STDRIVEG611 give designers two options to manage GaN devices in power conversion and motion applications for great
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Date:
05/14/2025
Compact 8:1 Fixed Ratio Digital IBC Boosts Power Efficiency in AI Data Centers

Compact 8:1 Fixed Ratio Digital IBC Boosts Power Efficiency in AI Data Centers

Compact 8:1 Fixed Ratio Digital IBC Boosts Power Efficiency in AI Data Centers
­Flex Power Modules announces the launch of the BMR323 — a new generation of non-isolated, unregulated Intermediate Bus Converters (IBCs) designed to meet the growing low-voltage, high-power demands of AI and cloud computing applications. Delivering up to 1.2 kW peak power with a peak efficiency of 97.8%,
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Date:
05/13/2025
EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines

EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines

EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines
­TDK Corporation has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025. These 1608-size chip beads for power supply lines achieve a rated current o
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Date:
05/13/2025
Alpha and Omega Semiconductor Introduces AMD SVI3 Multiphase Controller with Low Quiescent Power for Graphics and Desktop Systems

Alpha and Omega Semiconductor Introduces AMD SVI3 Multiphase Controller with Low Quiescent Power for Graphics and Desktop Systems

Alpha and Omega Semiconductor Introduces AMD SVI3 Multiphase Controller with Low Quiescent Power for Graphics and Desktop Systems
Alpha and Omega Semiconductor Limited (AOS) announced its AOZ98252QI 2-output, 8-phase controller with low 2.5 mA quiescent power. Featuring AMD SVI3 high-speed and SMBus digital interfaces, the AOZ98252QI is engineered as a key component in a complete system power solution with AOS’ DrMOS products fo
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Date:
05/13/2025
RJ45 Jacks with Magnetics

RJ45 Jacks with Magnetics

RJ45 Jacks with Magnetics
­Phoenix Contact now offers RJ45 jacks with integrated magnetics. The integrated magnetics within the RJ45 jacks improve electromagnetic interference (EMI) noise shielding and ensure reliable data connections in industrial environments. Because the magnetics are integrated, the RJ45 jacks simplify the Ether
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Date:
05/12/2025
Infineon Introduces CoolGaN Bidirectional Switch 650 V G5 for Enhanced Efficiency and Reliability in Power Systems

Infineon’s CoolGaN bidirectional switch (BDS) 650 V G5 can replace two conventional switches, reducing component count, cost, size, and overall power losses.

Infineon Introduces CoolGaN Bidirectional Switch 650 V G5 for Enhanced Efficiency and Reliability in Power Systems
­Infineon Technologies AG is introducing the CoolGaN™ bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a common-drain design and a double-gate structure, it leverages Infineon's robust gate injection transistor (GI
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Date:
05/12/2025
Pulsiv Announces the World’s Lowest Temperature 65-70W USB-C Modules for Installed Applications

Pulsiv Announces the World’s Lowest Temperature 65-70W USB-C Modules for Installed Applications

Pulsiv Announces the World’s Lowest Temperature 65-70W USB-C Modules for Installed Applications
­Pulsiv, the UK innovator of power electronics technology, announce the release of a series of 65W-70W USB-C modules. Aimed at installed applications such as wall sockets, desks, and furniture, these ultra-compact and fully assembled modules achieve the world’s lowest operating temperature of just 32°C above am
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Date:
05/08/2025
B511-1C Evaluation Board from Panasonic Industry Available now for Rapid Testing and Prototyping

B511-1C Evaluation Board from Panasonic Industry Available now for Rapid Testing and Prototyping

B511-1C Evaluation Board from Panasonic Industry Available now for Rapid Testing and Prototyping
­Panasonic Industry has recently introduced the new B511-1C Evaluation Board (ENW89861AXKF). It features a PAN B511-1C (ENW89861A3KF) module which is based on the Nordic Semiconductor nRF54L15 single-chip controller.  The evaluation board features a pin header in Arduino UNO footprint configurable as shield
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Date:
05/08/2025
Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs
­Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced five new reference designs targeting 800 V automotive applications based on the company’s 1700 V InnoSwitch™3-AQ flyback switcher ICs. Spanning power levels from 16 W to 120 W,
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Date:
05/08/2025
SemiQ Expands Gen3 SiC MOSFET Offering, Launches 1200 V TSPAK Series with Top-Side Cooling and Isolated Thermal Path

SemiQ Expands Gen3 SiC MOSFET Offering, Launches 1200 V TSPAK Series with Top-Side Cooling and Isolated Thermal Path

SemiQ Expands Gen3 SiC MOSFET Offering, Launches 1200 V TSPAK Series with Top-Side Cooling and Isolated Thermal Path
SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced the expansion of its Gen3 SiC MOSFET offering, launching a 1200 V TSPAK-packaged series. The four-strong series of Gen3 MOSFET
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Date:
05/07/2025
New 40 V GaN Power Transistor from EPC Targets Low-Voltage Silicon Strongholds

New 40 V GaN Power Transistor from EPC Targets Low-Voltage Silicon Strongholds

New 40 V GaN Power Transistor from EPC Targets Low-Voltage Silicon Strongholds
­Efficient Power Conversion (EPC), the leader in enhancement-mode gallium nitride (GaN) power transistors and ICs, announces the availability of the EPC2366, a 40 V, 0.8 mΩ device designed to displace legacy low-voltage silicon MOSFETs in demanding applications such as high-performance DC-DC converters and sy
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Date:
05/07/2025
Mahr Inc. Introduces Mar4D PLQ 4200 Cylinder Coordinate Measuring Machines for Complex Symmetrical Workpieces

Nick Russo, Product Manager at Mahr Inc

Mahr Inc. Introduces Mar4D PLQ 4200 Cylinder Coordinate Measuring Machines for Complex Symmetrical Workpieces
­Mahr Inc., a leading provider of dimensional metrology solutions, announced the Mar4D PLQ 4200 line of cylinder coordinate measuring machines. This innovative solution offers workpiece flexibility and multisensory technology, making it ideal for a wide range of applications. The Mar4D PLQ
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Date:
05/07/2025
Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias

Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias

Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias
­Inertial Labs, a VIAVI Solutions Inc. Company, today introduced the IMU-H100, a micro-electromechanical systems (MEMS) inertial measurement unit (IMU) developed to enhance tactical guidance and navigation capabilities of unmanned aerial vehicles (UAVs), short-range missiles and precision gu
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Date:
05/06/2025
Infineon Introduces new CoolSiC JFET Technology for Smarter and Faster Solid-State Power Distribution

To enable the next generation of solid-state power distribution systems, Infineon is expanding its SiC portfolio with the new CoolSiC™ JFET product family.

Infineon Introduces new CoolSiC JFET Technology for Smarter and Faster Solid-State Power Distribution
­To enable the next generation of solid-state power distribution systems, Infineon Technologies AG is expanding its silicon carbide (SiC) portfolio with the new CoolSiC™ JFET product family. The new devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal fo
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Date:
05/06/2025
CISSOID’s Inverter Control Modules achieve ISO26262 ASIL-C Ready Certification for Functional Safety

CISSOID’s Inverter Control Modules achieve ISO26262 ASIL-C Ready Certification for Functional Safety

CISSOID’s Inverter Control Modules achieve ISO26262 ASIL-C Ready Certification for Functional Safety
­CISSOID, a leader in high-performance power solutions, proudly announces that its CxT-ICM3S series of Inverter Control Modules (ICMs) have been successfully certified by SGS-TÜV Saar for functional safety, achieving ISO26262 ASIL-C Ready status. This certification underscores CISSOID's commitment to
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Date:
05/05/2025
Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package

Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package

Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package
­Navitas Semiconductor introduces a new level of reliability to meet the system lifetime requirements of the most demanding automotive and industrial applications. Navitas’ latest generation of 650 V and 1200 V ‘trench-assisted planar’ SiC MOSFETs combined with an optimized, HV-T2Pak top-side cooled pa
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Date:
05/05/2025
Infineon Expands its GaN Power Portfolio with EasyPACK CoolGaN Power Modules for High-Voltage Applications

With the introduction of CoolGaN power semiconductors in the EasyPACK package, Infineon is now expanding the range of applications for gallium nitride.

Infineon Expands its GaN Power Portfolio with EasyPACK CoolGaN Power Modules for High-Voltage Applications
­With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG is introducing the EasyPACK™ CoolGaN™ Transistor 65
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Date:
05/02/2025
Navitas GaNSense Motor Drive ICs Deliver Industry-Leading Performance, Efficiency, & Robustness in Home Appliances & Industrial Applications

Navitas GaNSense Motor Drive ICs Deliver Industry-Leading Performance, Efficiency, & Robustness in Home Appliances & Industrial Applications

Navitas GaNSense Motor Drive ICs Deliver Industry-Leading Performance, Efficiency, & Robustness in Home Appliances & Industrial Applications
­Navitas Semiconductor has announced a new family of GaNSense™ Motor Drive ICs targeting home appliances and industrial drives up to 600 W.  Specifically designed for motor drive applications, this fully integrated solution combines two GaN FETs in a half-bridge configuration with drive, control, se
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Date:
05/01/2025
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