Product News

Current
SemiQ Establishes Distribution Partnership with NAC Semi to Expand Global Reach for Silicon Carbide Solutions

SemiQ Establishes Distribution Partnership with NAC Semi to Expand Global Reach for Silicon Carbide Solutions

­SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced a distribution agreement with NAC Semi (NAC Group, Inc.), a global electronic component design services and distribution company.  This partnership
. . . Learn More
Date:
02/12/2026
Toshiba Introduces 40V eFuse ICs in Small TSOP6F Packages for Power Line Circuit Protection in Industrial and Consumer Applications

Toshiba Introduces 40V eFuse ICs in Small TSOP6F Packages for Power Line Circuit Protection in Industrial and Consumer Applications

­Toshiba Electronics Europe GmbH (“Toshiba”) expands its electronic fuse (eFuse) lineup with the introduction of the 40V TCKE6 series. The five new products are the TCKE601RA, TCKE601RL, TCKE602RM, TCKE603RA, and TCKE603RL. The eFuse ICs are suitable for use in industrial equipment, such as robots and programmable lo
. . . Learn More
Date:
02/12/2026
TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

­TDK Corporation announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable en
. . . Learn More
Date:
02/11/2026
Vacuum Interrupters Introduces RVI-PV-74A Replacement Vacuum Interrupter

Vacuum Interrupters Introduces RVI-PV-74A Replacement Vacuum Interrupter

­Vacuum Interrupters, a leading manufacturer of replacement vacuum interrupters, pole assemblies, parts, and components for medium-voltage vacuum circuit breakers and contactors, introduces the RVI-PV-74A replacement vacuum interrupter. This direct fit-and-function replacement unit for General E
. . . Learn More
Date:
02/11/2026
Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era

Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era

Exponential AI growth is outpacing utility expansion and available generation capacity, creating a growing gap that limits where AI infrastructure can be built and how quickly it can be powered. Endeavour today announced TurboCell, a rapidly deployable, scalable power system that accelerates time-to-compute wh
. . . Learn More
Date:
02/11/2026
EPC Announces Strategic GaN Technology Licensing and Second Sourcing Agreement with Renesas

EPC Announces Strategic GaN Technology Licensing and Second Sourcing Agreement with Renesas

­Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced a comprehensive licensing agreement with Renesas Electronics Corporation, a premier global supplier of advanced semiconductor solutions and high-voltage GaN transistors. Under the agree
. . . Learn More
Date:
02/11/2026
Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

­Silanna Semiconductor, a global provider of high-performance mixed-signal solutions, today announced its FirePower™ laser firing system ICs for smaller, more efficient LiDAR and rangefinder applications are available in production quantities.  These devices have been developed to significantly reduc
. . . Learn More
Date:
02/11/2026
Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise

Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise

­Keysight Technologies, Inc. announced SOS Enterprise, an advanced edition of its engineering data management platform. The solution builds on the SOS Core software and automates engineering data governance and traceability to prepare for AI adoption at scale. As semiconductor and electronics dev
. . . Learn More
Date:
02/11/2026
Thermal-Magnetic Protection in an 8-mm Package

Thermal-Magnetic Protection in an 8-mm Package

­Phoenix Contact introduces the PTCB TM, the smallest pluggable thermal-magnetic circuit breakers on the market. Measuring just 8 millimeters wide, the individual circuit breakers feature both protection and signaling in a single module. The narrow design saves up to 65% space compared with other thermal-magnetic ci
. . . Learn More
Date:
02/11/2026
Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

­Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The new EC
. . . Learn More
Date:
02/10/2026
Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

­Allegro MicroSystems, Inc., a global leader in power and sensing solutions for motion control and energy-efficient systems, today introduced the ACS37017, a new Hall-effect current sensor that sets the industry benchmark for accuracy. With the launch of the ACS37017, Allegro completes a strategic expansion of
. . . Learn More
Date:
02/10/2026
Cree LED Unveils OptiLamp LEDs With Active Intelligence in Every Pixel

Cree LED Unveils OptiLamp LEDs With Active Intelligence in Every Pixel

­Cree LED®, a Penguin Solutions brand, today announced OptiLamp™ LEDs, a new display technology that integrates driver and control intelligence directly into every LED pixel. Built on patented Cree LED technology, the OptiLamp portfolio advances LED display design by delivering superior image quality wi
. . . Learn More
Date:
02/09/2026
Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers

Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers

­Navitas Semiconductor, a leader in GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, unveiled a breakthrough 10 kW DC-DC power platform delivering up to 98.5% peak efficiency and 1 MHz switching frequency, enabling unprecedented power density to support the rapid, la
. . . Learn More
Date:
02/09/2026
Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

­Microchip Technology announced a collaboration with Hyundai Motor Group (HMG) to explore the adoption of advanced in-vehicle network solutions based on 10BASE-T1S Single Pair Ethernet (SPE) technology. This cooperation effort is intended to support the development of more efficient, reliable and scalable ve
. . . Learn More
Date:
02/06/2026
TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

­TDK Corporation expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling se
. . . Learn More
Date:
02/05/2026
GE Vernova Expands its Grid Automation Portfolio with a new Solution for Modern Grids

GE Vernova Expands its Grid Automation Portfolio with a new Solution for Modern Grids

­GE Vernova Inc. announced the launch of a new solution designed to simplify grid operations and protection as electricity networks expand globally and become more complex. GridBeats™ APS (Automation and Protection System) is a new product within GE Vernova’s GridBeats™ portfolio of software-
. . . Learn More
Date:
02/03/2026
STMicroelectronics' Space-Grade Driver Supports High-Speed Data and Low-Voltage Logic

STMicroelectronics' Space-Grade Driver Supports High-Speed Data and Low-Voltage Logic

­Supporting faster data speeds in space applications, ST’s RHFLVDS41 Low-Voltage Differential Signaling driver sets a new performance benchmark among QML-V qualified devices for data exchanges at up to 600Mbps. Having a wide operating-voltage range, from 2.3V-3.6V, the driver is compatible with th
. . . Learn More
Date:
02/03/2026
Archives