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Mouser Electronics Announces Global Agreement with Quantic Evans to Distribute High-Energy Density Capacitors

Eric Wendt, Vice President of Supplier Management at Mouser

Mouser Electronics Announces Global Agreement with Quantic Evans to Distribute High-Energy Density Capacitors
­Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Quantic Evans, an industry leader in high-energy density capacitors for demanding mission-critical applications. Quantic Evans' hybrid capacitors, kno
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Date:
09/26/2025
Infineon Introduces OptiMOS 7 Application-Optimized MOSFETs for Industrial and Consumer Applications

The Infineon OptiMOS 7 family offers products specifically for high performance switching.

Infineon Introduces OptiMOS 7 Application-Optimized MOSFETs for Industrial and Consumer Applications
­The rapid growth of power-hungry applications across various industries is placing unprecedented demands on power electronics in terms of power density, efficiency and reliability. Discrete power MOSFETs play a pivotal role in that context. An application-optimized approach opens new possibilities to further im
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Date:
09/26/2025
Advanced Energy Launches Medically Certified USB-C Power Adapter with Level VII Efficiency

Advanced Energy Launches Medically Certified USB-C Power Adapter with Level VII Efficiency

Advanced Energy Launches Medically Certified USB-C Power Adapter with Level VII Efficiency
­Advanced Energy Industries, Inc., a global leader in highly engineered, precision power conversion, measurement and control solutions, announced SLE33SPD, a new series of 33 W USB-C wall-mount adapters designed for medical and industrial devices. Engineered for safety and efficiency, these adapters meet the fo
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Date:
09/25/2025
Four-Channel Thermocouple Measurement with Integrated Conditioning Now Possible with ±1.5°C System Accuracy

Four-Channel Thermocouple Measurement with Integrated Conditioning Now Possible with ±1.5°C System Accuracy

Four-Channel Thermocouple Measurement with Integrated Conditioning Now Possible with ±1.5°C System Accuracy
­Precision four-channel temperature measurement is critical for production-line applications ranging from chemical and food processing, manufacturing process control and medical and HVAC equipment to refrigerated, cryogenic and other carefully controlled environments. With the introduction of the MCP9604 in
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Date:
09/25/2025
Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2

Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2

Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2
­Morse Micro, the world’s leading provider of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC).This milestone represents a major leap-forward for Wi-Fi HaLow, bringing unparalleled data throughput at range, which wi
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Date:
09/23/2025
Littelfuse Launches Industry-First AEC-Q200-Compliant High-Voltage Fuses Rated Up to 1,000 VDC

Littelfuse Launches Industry-First AEC-Q200-Compliant High-Voltage Fuses Rated Up to 1,000 VDC

Littelfuse Launches Industry-First AEC-Q200-Compliant High-Voltage Fuses Rated Up to 1,000 VDC
­Littelfuse, Inc. announced the release of the 828 and 827 Series High Voltage Cartridge Fuses. These new fuses are the first AEC-Q200-compliant fuses rated at 1,000 VDC (828 Series) and 800 VDC (827 Series), offering a compact and reliable circuit protection solution for next-generation automotive el
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Date:
09/22/2025
SVS-Vistek SWIR Cameras Identify Subsurface Defects in Semiconductor Wafers

SVS-Vistek SenSWIR FXO cameras have an extended wavelength range from 400 to 1700 nm

SVS-Vistek SWIR Cameras Identify Subsurface Defects in Semiconductor Wafers
­Optical inspection systems used in semiconductor fabrication must be capable of identifying both surface and subsurface flaws in wafers, ingots and semiconductor die. If not detected, these flaws can severely degrade the electrical properties, structural integrity, and downstream performance of the packaged ch
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Date:
09/19/2025
Infineon Releases 12 kW High-Density Power Supply Unit Reference Design for AI Data Centers and Servers

The Infineon 12 kW PSU reference design leverages all relevant semiconductor materials silicon (Si), silicon carbide (SiC) and gallium nitride (GaN).

Infineon Releases 12 kW High-Density Power Supply Unit Reference Design for AI Data Centers and Servers
­Infineon Technologies AG is introducing a 12 kW reference design for high-performance power supply units (PSUs), specifically designed for AI data centers and server applications. The reference design offers high efficiency and high-power density, and leverages all relevant semiconductor materials silicon (S
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Date:
09/19/2025
GAIA Launches Family of 500 W Integrated Power Supplies for High-Reliability Applications

GAIA Launches Family of 500 W Integrated Power Supplies for High-Reliability Applications

GAIA Launches Family of 500 W Integrated Power Supplies for High-Reliability Applications
­GAIA Converter, a leading provider of high-efficiency, high-reliability DC/DC converters and modular power solutions, has announced the launch of the GRD-50A-M series of scalable 500 W integrated power supplies for high-reliability markets such as military and aerospace.  This new family of commerc
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Date:
09/19/2025
TDK Launches Industry-Leading Low-Resistance Soft-Termination C0G MLCCs with 22 nF at 1000 V in the 3225 Case Size

TDK Launches Industry-Leading Low-Resistance Soft-Termination C0G MLCCs with 22 nF at 1000 V in the 3225 Case Size

TDK Launches Industry-Leading Low-Resistance Soft-Termination C0G MLCCs with 22 nF at 1000 V in the 3225 Case Size
­TDK Corporation announced today it expanded its CN series of low-resistance soft-termination MLCCs. This product achieves an industry-leading* 22 nF capacitance in the 3225 case size (3.2 x 2.5 x 2.5 mm – L x W x T) and C0G characteristics at 1000 V. Mass production of the product series began in September 20
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Date:
09/18/2025
Value-Optimized Power-Management IC for Automotive Applications

Value-Optimized Power-Management IC for Automotive Applications

Value-Optimized Power-Management IC for Automotive Applications
­The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameters and qualified to AEC-Q100, the SPSA068 supports ISO 26262 functional safety (FuSa) approval up to ASIL-B. Designed for use with micr
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Date:
09/18/2025
Alpha and Omega Semiconductor Unveils Powerful Duo of Protection Switches that Support Type-C EPR 3.1 Extended Power Levels

Alpha and Omega Semiconductor Unveils Powerful Duo of Protection Switches that Support Type-C EPR 3.1 Extended Power Levels

Alpha and Omega Semiconductor Unveils Powerful Duo of Protection Switches that Support Type-C EPR 3.1 Extended Power Levels
­Alpha and Omega Semiconductor Limited (AOS) announced two powerful Type-C sink and source protection switches. AOS designed these switches to increase the power delivery capability of USB Type-C ports to 240W, paving the way for Type-C extended power range (EPR) implementations. The AOZ13058DI offers ov
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Date:
09/17/2025
New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration

New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration

New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration
­The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power density and simplify system design. Microchip Technology announces a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology av
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Date:
09/17/2025
Offering High Current and Impedance Over a Broad Frequency Range, Bourns Releases Two High-Current Common Mode Choke Models

Bourns® SRF1206A-501Y and SRF1206A-172Y High Current Common Mode Chokes

Offering High Current and Impedance Over a Broad Frequency Range, Bourns Releases Two High-Current Common Mode Choke Models
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today released two new high current common mode choke models, the SRF1206A-501Y and SRF1206A-172Y. Designed to provide more impedance and current options for designers, these mo
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Date:
09/15/2025
Kaman Measuring Highlights High Precision Displacement Sensors for Extreme Environments

Kaman Measuring Highlights High Precision Displacement Sensors for Extreme Environments

Kaman Measuring Highlights High Precision Displacement Sensors for Extreme Environments
­The Measuring Division of Kaman Precision Products, Inc., the world leader in the design and manufacture of high-performance position measurement systems, highlights the availability of high precision displacement sensors for extreme environments such as power generation including nuclear and aerospace propulsion, ma
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Date:
09/15/2025
Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System

Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System

Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System
­Power Up Connect has introduced the MBESS 90 kWh, recognized as the world's first International Fire Code compliant Mobile Battery Energy Storage System. This milestone represents the result of a three-year collaboration between Power Up Connect and Dominion Energy. Currently, the MBESS 90 kWh is the only MBE
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Date:
09/11/2025
SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs
SEGGER's market-leading J-Link debug probes and Flasher in-system programmers can now be used with Geehy's G32R50x series of real-time microcontroller units (MCUs). G32R50x MCUs are based on the Arm® Cortex®-M52 core and deliver real-time control capabilities. Offering computational efficiency,
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Date:
09/11/2025
Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package

Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package

Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package
­Littelfuse, Inc. announced the launch of the DFNAK3 Series of High-Power TVS Diodes. These compact surface mount devices deliver 3 kA (8/20 µs) surge current protection—the highest available in such a small footprint—making them ideal for safeguarding DC-powered systems and Power over Ethernet (PoE) app
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Date:
09/10/2025
ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current

ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current

ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current
­ROHM Semiconductor announced the development of the TLR1901GXZ, an ultra-compact CMOS operational amplifier (op amp) that achieves the industry’s lowest operating circuit current. Optimized for use as a sensing amplifier, this IC is ideally suited for space-constrained applications su
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Date:
09/10/2025
Chromasens Launches New Flagship of allPIXA evo Line-Scan Camera Series

Chromasens allPIXA evo 32k

Chromasens Launches New Flagship of allPIXA evo Line-Scan Camera Series
­Chromasens unveiled its new allPIXA evo 32k line-scan camera, which achieves an amazing 73 kHz line rate at full resolution by combining a CoaXPress CXP-12 four-lane interface with a CMOS multi-line 32768-pixel monochrome sensor. The new flagship to the company's allPIXA evo Series, the
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Date:
09/10/2025
TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications
TDK Corporation introduces the B3270xP, a series of ultra-small, metallized polypropylene (MKP) film capacitors tailored for power factor correction (PFC) stages in power supplies for consumer electronics. With their compact design and self-healing properties, these components are engineered for use in adapters an
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Date:
09/09/2025
SEGGER’s Ozone is now Available for Simulators and Third-Party Probes

SEGGER’s Ozone is now Available for Simulators and Third-Party Probes

SEGGER’s Ozone is now Available for Simulators and Third-Party Probes
­SEGGER’s powerful Ozone debugger and performance analyzer, long trusted by users of J-Link and J-Trace, is now available for third-party debug probes and simulators.  Using the industry-standard GDB Remote Protocol, Ozone is now accessible to a much broader range of developers. “After listening to req
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Date:
09/09/2025
KYOCERA AVX Releases Novel Stacked Capacitors

KYOCERA AVX Releases Novel Stacked Capacitors

KYOCERA AVX Releases Novel Stacked Capacitors
­KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new DSCC 25007 Mini BME Stacks — miniature, high-CV stacked X7R capacitors equipped with base metal electrodes (BME) and subjected to 100% Gr
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Date:
09/08/2025
Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management

Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management

Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management
­Pfannenberg, Inc., a global leader in thermal management and signaling technologies, is proud to announce the launch of its latest innovation in battery energy storage system (BESS) solutions: the award-winning VLV 4-12 and DMC 8.0 Chillers, engineered specifically for the demanding needs of today’s BE
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Date:
09/08/2025
Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications

Patrick Will, Senior Director and Head of Software Product Marketing and Management at Infineon

Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications
­Infineon Technologies AG has launched a comprehensive software portfolio designed specifically for the latest AURIX™ TC4x microcontroller (MCU) family. It enables automotive safety applications with production ready ASIL D drivers for the AUTOSAR MCAL and safety software. By reducing efforts for software pa
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Date:
09/04/2025
Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series
­Heilind Electronics, a leading global distributor of interconnect, electromechanical, and sensor solutions, is pleased to announce that it now stocks the 3M™ Four-Wall Header 2500 Series, a versatile 100″ × .100″ wire-to-board connector designed to deliver space-saving performance, reliable mating, an
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Date:
09/04/2025
iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance
­iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching
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Date:
09/04/2025
SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation
­Effective immediately, SEGGER programming support is available for selected SPI flash-memory devices from Winbond Electronics Corporation. SEGGER’s highly regarded J-Link and Flasher product lines are now fully compatible with Winbond's high-performance W25H, W25Q, and W25X SpiFlash® multi-input/-output (I/O)
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Date:
09/04/2025
Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package
­Toshiba Electronics Europe GmbH (“Toshiba”) announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and are designed to reduce switching losses in
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Date:
09/02/2025
Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia
­Anglia Components is now stocking an extensive range of PCB Prototyping aids and accessories from UK company Vero Technologies Ltd. The two companies have signed an agreement covering the UK and the EU, giving Anglia’s customer base access to a wide range of products and accessories for PCB prototyping, te
. . . Learn More
Date:
09/02/2025
Bourns Miniature Thermal Cutoff Mini-Breaker Series Supports New 240 Watt USB Power Delivery Standard Limit

Bourns® SE Series resettable miniature Thermal Cutoff (TCO) Mini-Breakers

Bourns Miniature Thermal Cutoff Mini-Breaker Series Supports New 240 Watt USB Power Delivery Standard Limit
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its SE Series miniature Thermal Cutoff (TCO) Mini-Breaker devices that are designed to support 240 W, which meets the upper limit of the USB Power Delivery (P
. . . Learn More
Date:
09/02/2025
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