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Renesas Brings USB-C Rev. 2.4 Support to New Ultra-Low-Power RA2L2 Microcontroller Group

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, th

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Date:

06/10/2025

High-Efficiency GaN Inverter Brings GaN Power to Medium-Voltage Motor Drives

Efficient Power Conversion Corporation (EPC) announces the release of the EPC9196, a high-performance 25 ARMS, 3-phase BLDC motor drive inverter reference design powered by the EPC2304 eGaN® FET. The EPC9196 is specifically designed for medium-voltage (96 V – 150 V) battery-powered motor drive applications, in

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Date:

06/10/2025

FCL Components Launches Tab Terminal, High Voltage DC Switching Relay

FCL Components America, Inc., has released the FTR-E1J 20A, a tab terminal-type high voltage DC switching relay, based on its FTR-E1 series. It is screw mounted and does not use printed circuit boards. This new relay delivers 20A 800 VDC, 10A 1,000VDC higher voltage switching with no specific polarity requireme

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Date:

06/10/2025

Quantic X-Microwave Expands X-MWblocks Catalog with New UMS Amplifier Family

Quantic X-Microwave®, a business of Quantic Electronics® (“Quantic”) and leading provider of modular RF and microwave solutions, today announced the immediate availability of over twelve new high-performance amplifier products from United Monolithic Semiconductors (UMS), integrated into th

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Date:

06/10/2025

STMicroelectronics Reveals Space-Saving, High-Frequency Digital Automotive Audio Amplifiers for Smart-Cockpit Applications

STMicroelectronics has revealed new class-D automotive audio amplifiers for smart-cockpit applications, engineered for tiny overall dimensions and with a digital input that simplifies circuit design. The new HFDA80D and HFDA90D extend ST’s family of high-frequency automotive amplifiers, complemen

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Date:

06/10/2025

Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers can now use a complete HIL simulation and test solution using Typhoons HIL simulator.

Infineon Collaborates with Typhoon HIL to Accelerate Development of xEV Power Electronic Systems using Real-Time Hardware-in-the-loop Platform

Infineon Technologies AG announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working wi

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Date:

06/05/2025

ROHM Develops Breakthrough AI-Equipped MCU

ROHM Semiconductor announced they have developed AI-equipped MCUs (AI MCUs) – ML63Q253x-NNNxx / ML63Q255x-NNNxx – that enable fault prediction and degradation forecasting using sensing data in a wide range of devices, including industrial equipment such as motors. These MCUs are the

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Date:

06/05/2025

STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm

STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity. The module is the first product of ST’s collaboration with Qualcomm Technologies, Inc. anno

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Date:

06/04/2025

Product-related service: A dedicated evaluation board and various software tools are available for the Skoll-I wireless module.
Image source: Würth Elektronik

Würth Elektronik Presents its Skoll-I Bluetooth Module

Manufacturer of electronic and electromechanical components, introduces Skoll-I, a compact wireless module that combines both Bluetooth® Classic and Bluetooth® LE (Low Energy) version 5.4 in a single solution. Measuring just 16.6 × 12 × 1.7 mm, the module is already certified for conformity in

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Date:

06/03/2025

Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components

Rhopoint Components, specialist distributor of precision electronic components, sensors, connectors and modular systems, announces the availability of the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module. Applications include power systems for Electric Vehicles

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Date:

06/02/2025

Bourns® Model PCP300-T414250S Current Transformer

Bourns Unveils Current Transformer Line with New Model that Features High Turns Ratio with Permalloy T-Core Construction

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today unveiled the Company’s new current transformer line with its Model PCP300-T414250S Transformer. The new model is made with high-efficiency permalloy material th

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Date:

06/02/2025