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STMicroelectronics Reveals Automotive-Grade Inertial Modules for Cost-Effective Functional-Safety Applications up to ASIL B

STMicroelectronics Reveals Automotive-Grade Inertial Modules for Cost-Effective Functional-Safety Applications up to ASIL B

STMicroelectronics Reveals Automotive-Grade Inertial Modules for Cost-Effective Functional-Safety Applications up to ASIL B
­STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications. The ASM330LHBG1 is AEC-Q100 Grade-1 qualified for the ambient operating temperature range -40
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Date:
05/14/2024
FCL Components Releases Compact, Lightweight, Higher-Voltage DC Switching Relay for Power and Automotive Applications

FCL Components Releases Compact, Lightweight, Higher-Voltage DC Switching Relay for Power and Automotive Applications

FCL Components Releases Compact, Lightweight, Higher-Voltage DC Switching Relay for Power and Automotive Applications
­FCL Components America, Inc. introduced the FTR-E1-HC, a lightweight, 60A 400VDC higher voltage switching relay ideal for both power and automotive applications. With no specific polarity requirement for the connection of load terminals, and a low power consumption of approximately 1.2W at rated coil volt
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Date:
05/14/2024
Murata's New LCT Redefines Power Supply Noise Suppression, Reducing Component Count and Costs

Murata's New LCT Redefines Power Supply Noise Suppression, Reducing Component Count and Costs

Murata's New LCT Redefines Power Supply Noise Suppression, Reducing Component Count and Costs
­Murata unveils a significant advancement in the realm of electronic components with the launch of its innovative L Cancel Transformer (LCT). This remarkable product is the first of its kind and can neutralize the equivalent series inductance (ESL) of a capacitor, optimizing its noise-reducing capabilities. Ut
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Date:
05/14/2024
Littelfuse Unveils IX4352NE Low-side Gate Driver for SiC MOSFETs and High-power IGBTs

IX4352NE Low-side Gate Driver

Littelfuse Unveils IX4352NE Low-side Gate Driver for SiC MOSFETs and High-power IGBTs
­Littelfuse, Inc. is excited to announce the launch of the IX4352NE Low-side SiC MOSFET and IGBT Gate Driver. This innovative driver is specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in industrial applications. The key differentiator of the IX
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Date:
05/08/2024
Unlock Safety without Breaking the Bank: Position Sensing for Steer-by-Wire

Unlock Safety without Breaking the Bank: Position Sensing for Steer-by-Wire

Unlock Safety without Breaking the Bank: Position Sensing for Steer-by-Wire
­Melexis introduces the MLX90427 in its magnetic position sensor portfolio. The product is tailored for embedded position sensor applications requiring high functional safety levels. Next to offering customer stray field immunity and EMC robustness, the cost-effective MLX90427 features an SPI output with 4 di
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Date:
05/08/2024
Radiation-Tolerant DC-DC 50-Watt Power Converters Provide High-Reliability Solution for New Space Applications

Radiation-Tolerant DC-DC 50-Watt Power Converters Provide High-Reliability Solution for New Space Applications

Radiation-Tolerant DC-DC 50-Watt Power Converters Provide High-Reliability Solution for New Space Applications
­The Low-Earth Orbit (LEO) market is rapidly growing as private and public entities alike explore the new space region for everything from 5G communication and cube satellites to IoT applications. There is an increased demand for standard space grade solutions that are reliable, cost effective and configurable. To
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Date:
05/07/2024
Inductors Match Today's Data-Driven Application Performance Demands

Bourns® Model TLVR1005T and
TLVR1105T Series multiphase trans-inductor
voltage regulator (TLVR) inductors

Inductors Match Today's Data-Driven Application Performance Demands
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its Model TLVR1005T and TLVR1105T Series. Bourns’ new multiphase trans-inductor voltage regulator (TLVR) inductors deliver extremely high cu
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Date:
05/07/2024
Empower's New Ultra-low 1pH ESL Silicon Capacitor Tightens Voltage

Empower's New Ultra-low 1pH ESL Silicon Capacitor Tightens Voltage

Empower's New Ultra-low 1pH ESL Silicon Capacitor Tightens Voltage
­Empower Semiconductor unveiled the largest silicon capacitor in its ECAP product family for high frequency decoupling. The new EC1005P is a single 16.6-microfarad (μF) capacitance device suitable for the most demanding power integrity targets as often found in high-performance systems-on-chip (SoCs). It
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Date:
05/06/2024
Bourns Introduces Shielded Power Inductor Series with Extremely High Current Capability

Bourns® Model SRP1060VR High Current Shielded
Power Inductor Series

Bourns Introduces Shielded Power Inductor Series with Extremely High Current Capability
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its new shielded power inductor series with extremely high current capability, low buzz noise and low DCR. A growing group of data-driven applications now require th
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Date:
05/06/2024
Infineon Provides a Broad Range of Products for Xiaomi's new SU7 Smart Electric Vehicle

Xiaomi SU7: Infineon Technologies AG provides a broad range of products, including silicon carbide (SiC) power modules, for Xiaomi’s new SU7 smart electric vehicle (Copyright: Xiaomi)

Infineon Provides a Broad Range of Products for Xiaomi's new SU7 Smart Electric Vehicle
­Infineon Technologies AG, a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027. Infineon’s CoolSiC-based power modules allow for higher operating te
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Date:
05/06/2024
Introducing X1/Y1 Safety Certified Multilayer Ceramic Capacitors

Introducing X1/Y1 Safety Certified Multilayer Ceramic Capacitors

Introducing X1/Y1 Safety Certified Multilayer Ceramic Capacitors
­Holy Stone Enterprise Co., Ltd. is an industry leader for Safety Certified ceramic capacitors (our SCC Series). The existing product line includes NPO and X7R T.C.’s X2 and Y2 classes rated at 250Vrm and 305Vrm which are compliant to IEC60384-14, UL60384-14, and UL60950-1 and CSA60384-14 standards.
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Date:
05/02/2024
Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz
­Alliance Memory announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package. With low-voltage operation of 0.6V, the 16Gb AS4C512M32MD4V-046BIN and 32Gb
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Date:
05/02/2024
Renesas Launches Integrated Code Generator Support for new 32-bit RISC-V MCU with SEGGER Embedded Studio

Daryl Khoo, Vice President of the Embedded Processing 1st Business Division at Renesas

Renesas Launches Integrated Code Generator Support for new 32-bit RISC-V MCU with SEGGER Embedded Studio
­In collaboration with Renesas, SEGGER announces that Embedded Studio has now been integrated into the Renesas code generator known as Smart Configurator. This brings end-to-end SEGGER support for the new R9A02G021 group of MCUs, Renesas’ first 32-bit RISC-V devices for general purpose applications. The Renesas Smart Con
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Date:
05/02/2024
PowiGaN Enables Simple and Efficient 28 V USB PD EPR Adapter Designs – Design Kit Available

PowiGaN Enables Simple and Efficient 28 V USB PD EPR Adapter Designs – Design Kit Available

PowiGaN Enables Simple and Efficient 28 V USB PD EPR Adapter Designs – Design Kit Available
­With the increasing power level requirements of fast charging protocols like USB PD Extended Power Range (EPR) and UFCS in China, it’s hard to keep chargers small and minimize the use of many discrete components, which need independent specification and sourcing. Power Integrations offers the ideal solution fo
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Date:
05/02/2024
New Models Added to CUI Devices' Line of BGA Heat Sinks

New Models Added to CUI Devices' Line of BGA Heat Sinks

New Models Added to CUI Devices' Line of BGA Heat Sinks
­CUI Devices’ Thermal Management Group today announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. All BG
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Date:
05/01/2024
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