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    Product News

    August 2026
    Anglia and Silanna Partner to Deliver Lower-Cost, High-Performance ADCs Across Europe

    Anglia and Silanna Partner to Deliver Lower-Cost, High-Performance ADCs Across Europe

    Anglia and Silanna Partner to Deliver Lower-Cost, High-Performance ADCs Across Europe
    ­Anglia Components, one of Europe’s longest-established, independent, authorised distributors of electronic components, has signed a pan-European franchise agreement with Silanna, makers of laser driver products and configurable analog-to-digital converters that are pin-for-pin compatible with industry st
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    Date:
    08/10/2026
    Nordic's nRF9151 Opens Satellite and Cellular IoT to a New Class of Connected Devices

    Nordic's nRF9151 Opens Satellite and Cellular IoT to a New Class of Connected Devices

    Nordic's nRF9151 Opens Satellite and Cellular IoT to a New Class of Connected Devices
    ­Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announced a faster path to satellite and cellular IoT. Embedded modem innovator LooUQ's MTC2-N9151 has earned Skylo Non-Terrestrial Network (NTN) certification, building on Nordic's own Skylo-certified nRF9151 to reduce time
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    Date:
    08/10/2026
    Antaira Launches New AC-Powered PoE Injector Supporting PoE, PoE+, and PoE++, Delivers Up to 100W in Wide Temperature Extremes

    With up to 100W of PoE++ power, Antaira INJ-0201G-bt-AC-100-T PoE injectors match the requirements of power-intensive devices such as PTZ cameras, Wi-Fi 6/7 access points, and industrial sensors without the need for electrical rewiring.

    Antaira Launches New AC-Powered PoE Injector Supporting PoE, PoE+, and PoE++, Delivers Up to 100W in Wide Temperature Extremes
    ­Antaira Technologies unveils the INJ-0201G-bt-AC-100-T, a high-power PoE injector engineered to deliver the robust, reliable power today's mission-critical Powered Devices demand. Featuring an integrated AC power input, this injector delivers reliable, high-wattage performance in the toughest environments and
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    Date:
    08/07/2026
    Automotive AEC-Q100 Grade 1 Compliant High-Voltage 36V/600mA Compact Step-Down DC/DC Converter

    Automotive AEC-Q100 Grade 1 Compliant High-Voltage 36V/600mA Compact Step-Down DC/DC Converter

    Automotive AEC-Q100 Grade 1 Compliant High-Voltage 36V/600mA Compact Step-Down DC/DC Converter
    ­Torex Semiconductor Ltd. has launched the XD9704/XD9705 series, a new series of step-down DC/DC converters compliant with the automotive standard AEC-Q100 Grade 1. The XD9704/XD9705 series is a low-power, synchronous step-down DC/DC converter that achieves space savings while supporting a high withst
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    Date:
    08/07/2026
    Atlas Introduces Ci5000E Weather-Ometer for Testing Powered Electronics

    Atlas Introduces Ci5000E Weather-Ometer® for Testing Powered Electronics.

    Atlas Introduces Ci5000E Weather-Ometer for Testing Powered Electronics
    ­Atlas Material Testing Technology, the global leader in weathering testing technology, has introduced the Ci5000E Weather-Ometer®, a new configuration of its Ci5000 xenon arc platform designed specifically for accelerated testing of powered electronic devices and components. Developed to meet the evolving ac
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    Date:
    08/07/2026
    Würth Elektronik Updates its Online DC-DC Converter Designer

    Würth Elektronik Updates its Online DC-DC Converter Designer

    Würth Elektronik Updates its Online DC-DC Converter Designer
    ­The DC-DC Converter Designer is the most frequently used calculation tool in REDEXPERT. Würth Elektronik has now completely revised and expanded its online service. The heart of the new tool is its proprietary, highly accurate method for calculating inductor losses, based on actual component characterization. It
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    Date:
    08/07/2026
    NoMIS Power Demonstrates 6.5 kV SiC MOSFET, Advancing a High-Voltage Roadmap to 10 kV and 20 kV SiC IGBTs

    Dr. Adam Morgan, Co-Founder and CEO of NoMIS Power

    NoMIS Power Demonstrates 6.5 kV SiC MOSFET, Advancing a High-Voltage Roadmap to 10 kV and 20 kV SiC IGBTs
    ­NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, today announced a major high-voltage milestone: the successful demonstration of its first 6.5 kV large-die SiC MOSFET. The device was measured at over 8 kV blocking, 90 mΩ on-resistance, and 55 A drain current. Th
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    Date:
    08/06/2026
    Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

    Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

    Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference
    ­Marvell Technology, Inc. announced new innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory. The portfolio helps hyperscalers and cloud providers scale memory mo
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    Date:
    08/04/2026
    TDK Adds Vibration-Resistant Axial and Soldering-Star Capacitors for 125 V and Upgrades 63 V Series

    TDK Adds Vibration-Resistant Axial and Soldering-Star Capacitors for 125 V and Upgrades 63 V Series

    TDK Adds Vibration-Resistant Axial and Soldering-Star Capacitors for 125 V and Upgrades 63 V Series
    ­TDK Corporation has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for c
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    Date:
    08/04/2026
    KROHNE Introduces OPTIWAVE 1530 & 1560 Radar Level Transmitters

    KROHNE Introduces OPTIWAVE 1530 & 1560 Radar Level Transmitters

    KROHNE Introduces OPTIWAVE 1530 & 1560 Radar Level Transmitters
    ­KROHNE, a leading provider of industrial process instrumentation, announces the new OPTIWAVE 1530 and OPTIWAVE 1560 radar FMCW level transmitters for solids and liquid applications, including small to tall silos, narrow tanks, stockpiles, bunkers, and vessels with internal obstructions. This technology provides an
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    Date:
    08/04/2026
    4763 IEC Appliance Combi-Outlet Type F/J for Smart PDUs

    4763 IEC Appliance Combi-Outlet Type F/J for Smart PDUs

    4763 IEC Appliance Combi-Outlet Type F/J for Smart PDUs
    ­With the new 4763 Type F/J outlet, SCHURTER offers a flexible solution for modern power distribution systems, particularly in data centers. By combining Type F and Type J in a single outlet, the 4763 supports different current ratings while simplifying the design of intelligent PDUs. Compatibility A key advantage is its full mechanic
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    Date:
    08/04/2026
    Antaira Technologies Launches LANOBOX Series of All-In-One NEMA 4X Outdoor Network Enclosure

    Antaira LANOBOX 105-T

    Antaira Technologies Launches LANOBOX Series of All-In-One NEMA 4X Outdoor Network Enclosure
    ­Antaira Technologies, a global leader in industrial networking infrastructure, announced the LANOBOX Series of pre-built, IP68-rated NEMA 4X network enclosures. Each LANOBOX unit is a combined solution of a ruggedized cabinet enclosure, an Antaira PoE switch, an industrial power supply, and a 20kA surge protector. “The LANOBOX h
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    Date:
    08/03/2026
    Bourns Introduces CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors for Automotive and High-Reliability Applications

    Bourns Introduces CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors for Automotive and High-Reliability Applications

    Bourns Introduces CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors for Automotive and High-Reliability Applications
    ­Bourns today announced the CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors, available in 0508 and 0612 footprints. Rated up to 2 W and covering a resistance range of 1–30 mΩ, the CFG-A Series is AEC-Q200-compliant and designed for automotive power electronics, motor drives, and other hi
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    Date:
    08/03/2026
    Quectel's FGH200M Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified for Mass Production

    Quectel's FGH200M Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified for Mass Production

    Quectel's FGH200M Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified for Mass Production
    ­Morse Micro announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale. The FGH200M, built around Morse Micro's second-
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    Date:
    07/30/2026
    Femto Sensing International Launches New W4 Mini FBG Interrogator with 160nm Scanning Range

    Femto Sensing International Launches New W4 Mini FBG Interrogator with 160nm Scanning Range

    Femto Sensing International Launches New W4 Mini FBG Interrogator with 160nm Scanning Range
    Femto Sensing International has launched the W4 Mini FBG Interrogator, a new optical sensing instrument engineered to deliver a 160nm scanning range within a reduced physical footprint. The interrogator is designed to support high-capacity optical sensor networks while operating with minimal power consumption, a
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    Date:
    07/30/2026
    Infineon SEMPER NOR Flash Memory Strengthens Data‑Center Server Management

    The Infineon SEMPER™ NOR Flash Memory has been qualified for ASPEED Technology’s AST2700 Baseboard Management Controller (BMC).

    Infineon SEMPER NOR Flash Memory Strengthens Data‑Center Server Management
    ­Infineon Technologies AG announced that its SEMPER™ NOR Flash Memory has been qualified for ASPEED Technology’s AST2700 Baseboard Management Controller (BMC) and is now included in the AST2700 Approved Vendor List (AVL). As firmware storage for the BMC, the SEMPER NOR Flash supports the server management in
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    Date:
    07/30/2026
    Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications

    Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications

    Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications
    ­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its third‑generation (Gen 3) DDR5 Multiplexed Rank Dual In‑Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new
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    Date:
    07/30/2026
    STMicroelectronics' new Galvanically Isolated Gate Drivers Simplify Power Design with Advanced Isolation

    STMicroelectronics' new Galvanically Isolated Gate Drivers Simplify Power Design with Advanced Isolation

    STMicroelectronics' new Galvanically Isolated Gate Drivers Simplify Power Design with Advanced Isolation
    ­STMicroelectronics has extended the STGAP3S family of gate drivers that feature enhanced galvanic isolation for greater reliability, introducing an efficient and economical 3A series for circuits that need lower drive current. The new STGAP3S3S is optimized for silicon carbide (SiC) MOSFETs, wh
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    Date:
    07/29/2026
    SUNON Unveils ErP 2026-Ready Green EC Fans to Power Next-Gen AI Infrastructure

    SUNON Unveils ErP 2026-Ready Green EC Fans to Power Next-Gen AI Infrastructure

    SUNON Unveils ErP 2026-Ready Green EC Fans to Power Next-Gen AI Infrastructure
    ­As global industries rush to scale AI infrastructure under stringent ESG mandates, high-efficiency thermal management has become mission-critical. Addressing the newly implemented EU ErP 2026 energy efficiency standards, SUNON has launched its next-generation Green EC Fan Series, delivering on the ultimate br
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    Date:
    07/29/2026
    Small DP12IP Series Current Transducer from Danisense Delivers ppm-Class Precision

    Small DP12IP Series Current Transducer from Danisense Delivers ppm-Class Precision

    Small DP12IP Series Current Transducer from Danisense Delivers ppm-Class Precision
    ­Danisense, the leader in high-accuracycurrent sense transducers for demanding applications, announcing its new high-precision DP12IP current transducer designed for isolated DC and AC current measurement in demanding PCB-mounted power electronics applications. Based on Danisense’s closed-loop compensat
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    Date:
    07/28/2026
    Infineon Extends Solid State Isolator Portfolio with Compact ISSI20BxxF Family for High-Volume Industrial Automation Applications

    Infineon extends its Solid State Isolator portfolio with the compact ISSI20BxxF family

    Infineon Extends Solid State Isolator Portfolio with Compact ISSI20BxxF Family for High-Volume Industrial Automation Applications
    ­Infineon Technologies AG introduces the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs). Housed in a compact PG-DSO-8 15
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    Date:
    07/28/2026
    RS and RS PRO Streamline Control Panel Integration in Automated Industrial Environments

    RS and RS PRO Streamline Control Panel Integration in Automated Industrial Environments

    RS and RS PRO Streamline Control Panel Integration in Automated Industrial Environments
    ­RS, a high-service global product and service solutions provider for industrial customers, provides comprehensive support for the rapidly accelerating cross-market trend towards control panel integration, which is being driven by digital transformation and smart factory initiatives. As industrial automatio
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    Date:
    07/27/2026
    High-Performance Module for Physical AI Applications at the Rugged Edge

    High-Performance Module for Physical AI Applications at the Rugged Edge

    High-Performance Module for Physical AI Applications at the Rugged Edge
    ­congatec – a leading provider of embedded and edge computing technology – today introduced its new COM-HPC Client Size C module with AMD Ryzen™ AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications. Fea
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    Date:
    07/23/2026
    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers

    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers

    Siemens and Partners Develop Reference Architecture Purpose-Built for NVIDIA AI Data Centers
    ­Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls architecture for hy
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    Date:
    07/23/2026
    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint

    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint

    TDK Presents SMD Common-Mode Chokes for up to 80 V/35 A With a Minimized PCB Footprint
    ­TDK Corporation presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board space, these components fe
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    Date:
    07/23/2026
    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor

    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor

    Advanced Energy Launches 1100 W PFC Module with the Industry's Highest Power Density in a Half-Brick Form Factor
    ­Advanced Energy Industries, Inc., a global leader in highly engineered, precision power conversion, measurement and control solutions, today announced a new 1100 W board-mounted power factor correction (PFC) module — the industry's first solution of its kind in a half-brick form factor. Advanced Energy’s A
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    Date:
    07/22/2026
    Yokogawa Test & Measurement Releases WT1500 High-Precision Power Analyzer

    Yokogawa WT1500 High-Precision Power Analyzer

    Yokogawa Test & Measurement Releases WT1500 High-Precision Power Analyzer
    ­Yokogawa Test & Measurement Corporation today announces the release of the WT1500 high-precision power analyzer. A new addition to the WT series, the WT1500 addresses a growing need for high-voltage, multi-functional measurement within the renewable energy and electrified vehicle (xEV) markets. It also of
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    Date:
    07/22/2026
    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications

    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications

    WITT Gas Controls Next‑Generation Dome Pressure Regulators for Demanding Gas Applications
    ­WITT Gas Controls, a global leader in gas safety, control, and analysis solutions, has upgraded its proven dome pressure regulator product line with a next-generation design featuring optimized pilot pressure regulators. Engineered to maintain stable working pressure under widely varying flow rates and inlet pr
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    Date:
    07/21/2026
    Toshiba Expands Lineup of AEC‑Q101 Compliant 40V N-channel MOSFETs in Small, Thermally Enhanced S-TOGL Package

    Toshiba expands lineup of AEC‑Q101 compliant 40V N-channel MOSFETs in small, thermally enhanced S-TOGL package

    Toshiba Expands Lineup of AEC‑Q101 Compliant 40V N-channel MOSFETs in Small, Thermally Enhanced S-TOGL Package
    ­Toshiba Electronics Europe GmbH (“Toshiba”) has launched the XPJ1R504PB, an automotive-compliant 40V, 120A N-channel power MOSFET housed in the S‑TOGL™ package, expanding its lineup for 12V systems. Target applications include inverters, semiconductor relays, load switches, and motor drives. By adding th
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    Date:
    07/21/2026
    Bourns Releases New Shielded Power Inductors for High-Current, Low-Profile Automotive and DC-DC Designs

    Bourns Releases New Shielded Power Inductors for High-Current, Low-Profile Automotive and DC-DC Designs

    Bourns Releases New Shielded Power Inductors for High-Current, Low-Profile Automotive and DC-DC Designs
    ­Bourns announces the release of its SRP2010PA, SRP2510PA, and SRP2512PA Series shielded power inductors designed to support high current operation in space-constrained electronic designs. The new series combines a metal-alloy powder core with shielded construction to reduce magnetic field ra
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    Date:
    07/17/2026
    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments

    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments

    Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
    ­As industrial environments become more automated and connected, demand for Power over Ethernet is rising to enable industrial applications by delivering reliable power and data over a single cable, simplifying deployment and scalability. To offer an industrial-grade solution, Microchip Technology has extended it
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    Date:
    07/16/2026
    Emerson Launches Modular Testing Architecture for Automotive Display and Camera Interfaces

    The NI PXIe-1480 carrier module supports interchangeable interface devices for automotive display and camera testing

    Emerson Launches Modular Testing Architecture for Automotive Display and Camera Interfaces
    ­Emerson today introduced a new modular test architecture designed to address increasing complexity in software-defined vehicles. Built on NI-based technology, the automotive vision device combines a high-performance FPGA core with interchangeable serializer/deserializer (SerDes) interface devices, enabling eng
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    Date:
    07/16/2026
    Insulation Monitoring Solution for Fast EV Charging Stations

    Insulation Monitoring Solution for Fast EV Charging Stations

    Insulation Monitoring Solution for Fast EV Charging Stations
    ­Carlo Gavazzi Automation, the international electronics group active in the design, manufacture, and marketing of electronic equipment, is pleased to introduce the DRC61 Series, an insulation monitoring device specifically developed for unearthed DC systems up to 1,000 Volts DC, targeting the fast-growing EV
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    Date:
    07/16/2026
    The Versatile MIL-C-55302 PCB and Cable Connectors from Incon can be Sourced Through Powell Electronics

    The Versatile MIL-C-55302 PCB and Cable Connectors from Incon can be Sourced Through Powell Electronics

    The Versatile MIL-C-55302 PCB and Cable Connectors from Incon can be Sourced Through Powell Electronics
    ­Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, offers the complete line of Incon MIL-C-55302 printed circuit board and cable connectors. Qualified to the Defense Supply Center Columbus (DSCC) Qualified Products List (QPL), the co
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    Date:
    07/16/2026
    Infineon Introduces RIC70115 Radiation-Hardened GaN HEMT Driver for Satellite and High-Reliability Space Applications

    The Infineon RIC70115 supports both silicon and GaN MOSFET designs in low-side and high-side configurations, giving power system designers greater flexibility to adopt GaN-based power architectures in space platforms.

    Infineon Introduces RIC70115 Radiation-Hardened GaN HEMT Driver for Satellite and High-Reliability Space Applications
    ­Infineon Technologies AG introduces the RIC70115, a radiation-hardened (rad hard) gallium nitride (GaN) high-electron mobility transistor (HEMT) driver designed for satellite and high-reliability space applications where power conversion performance and long-term operational integrity are critical requirements. Th
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    Date:
    07/15/2026
    DCM2: The High-Power DC Energy Meter for Battery Storage Systems, DC Industry, Microgrids, and MCS Chargers

    DCM2: The High-Power DC Energy Meter for Battery Storage Systems, DC Industry, Microgrids, and MCS Chargers

    DCM2: The High-Power DC Energy Meter for Battery Storage Systems, DC Industry, Microgrids, and MCS Chargers
    ­The DCM2 significantly expands Carlo Gavazzi’s metering portfolio beyond the existing DCT1 and DCM1 ranges by introducing a solution capable of supporting systems up to 1500 V dc and 1500 A dc, and applications reaching up to 2.25 MW. While the current DCM1 and DCT1 series already address DC metering and trans
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    Date:
    07/15/2026
    WeEn Strengthens SST Leadership with WMSC Family of 1200-2300 V SiC Power Modules

    WeEn Strengthens SST Leadership with WMSC Family of 1200-2300 V SiC Power Modules

    WeEn Strengthens SST Leadership with WMSC Family of 1200-2300 V SiC Power Modules
    ­WeEn Semiconductors, specialists in developing and manufacturing advanced bipolar power semiconductor products, has launched a new family of cutting-edge AC-DC and DC-DC SiC power modules to target the growing range of solid-state transformer (SST) applications, as well as EV super chargers and smart-grid/renewable app
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    Date:
    07/14/2026
    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters

    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters

    EMIS Advanced Single Phase and Three Phase Common Mode Facility Power Line Filters
    ­Global EMC solutions provider EMIS  introduces the SMF911 and TMF911 series of Single Phase and Three Phase Common Mode Facility Power Line Filters, engineered to provide exceptional electromagnetic interference (EMI) and radio frequency interference (RFI) suppression for industrial, commercial, de
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    Date:
    07/13/2026
    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite

    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite

    Microchip Expands Developer Access with Free MPLAB® XC Compilers and MPLAB Machine Learning Development Suite
    ­Microchip Technology has announced that its MPLAB® XC Pro Compilers and MPLAB Machine Learning (ML) Development Suite are now available at no cost to customers. By enabling unlimited installs across individual and team environments, these tools give developers free access to advanced optimization capabilities an
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    Date:
    07/10/2026
    Melexis Expands Groundbreaking Triphibian Technology for Low-Pressure Applications

    Melexis Expands Groundbreaking Triphibian Technology for Low-Pressure Applications

    Melexis Expands Groundbreaking Triphibian Technology for Low-Pressure Applications
    ­Melexis introduces new low-pressure variants across its Triphibian® pressure sensor family, supporting configurable pressure spans as low as 2 bar. Available for the MLX90830, MLX90833, and MLX90834, the new variants extend Triphibian technology, which uniquely measures both gas and liquid pressures, into th
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    Date:
    07/09/2026
    High-Power, High-Efficiency Eighth-Brick IBC Optimized for AI demands

    High-Power, High-Efficiency Eighth-Brick IBC Optimized for AI demands

    High-Power, High-Efficiency Eighth-Brick IBC Optimized for AI demands
    ­Flex Power Modules has introduced the BMR353, a next-generation high-power DC/DC intermediate bus converter (IBC) engineered for the demanding power requirements of AI data centers. The non-isolated eighth-brick IBC delivers a fully regulated 12.2 V output from a 40-60 V input, providing 860 W of continuous
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    Date:
    07/09/2026
    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density

    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density

    Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density
    ­Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DF
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    Date:
    07/08/2026
    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model

    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model

    TDK Expands HWS3000 Series with Wide Range Three-Phase Input Model
    ­TDK Corporation announces the expansion of the 3000 W TDK-Lambda HWS3000 programmable AC-DC power supply series with the introduction of the HWS3000GT4 model. Now available with a new wide-range 340 – 528 Vac three-phase input option, this addition offers engineers greater installation flexibility, improved co
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    Date:
    07/07/2026
    Infineon Launches SECORA ID Key S USB, a new Security Solution Supporting FIDO2 and PKI for Secured Logical Access

    SECORA™ ID Key S USB from Infineon is a Java Card™-based solution with USB and NFC connectivity for secured authentication and digital signatures.

    Infineon Launches SECORA ID Key S USB, a new Security Solution Supporting FIDO2 and PKI for Secured Logical Access
    ­Infineon Technologies AG is launching the SECORA™ ID Key S USB, a Java Card™-based solution with USB and NFC connectivity for secured authentication and digital signatures. As the first FIDO-certified Level 3+ solution and compliant with CTAP 2.1, the authenticator enables phishing-resistant, passwordless au
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    Date:
    07/07/2026
    Deal Between 3PEAK and Anglia Delivers Cost-Effective Drop-in Analog Parts with Increased Functionality

    Deal Between 3PEAK and Anglia Delivers Cost-Effective Drop-in Analog Parts with Increased Functionality

    Deal Between 3PEAK and Anglia Delivers Cost-Effective Drop-in Analog Parts with Increased Functionality
    ­Anglia Components, one of Europe’s longest-established, independent, authorised distributors of electronic components, has signed a distribution deal with 3PEAK Incorporated, semiconductor company focusing on high-performance, high-quality, and highly reliable ICs, including signal chain, power management, an
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    Date:
    07/06/2026
    Bourns TVS Diodes Address High‑Surge ESD Protection in DFN‑2 (0402) Footprints

    Bourns® Model CDDFN2‑T3V3SC and CDDFN2‑T5V0SC TVS Diodes

    Bourns TVS Diodes Address High‑Surge ESD Protection in DFN‑2 (0402) Footprints
    ­Bourns announced the Model CDDFN2‑T3V3SC and CDDFN2‑T5V0SC Surface‑Mount Transient Voltage Suppressor (TVS) Diodes, designed to provide ESD, EFT, and surge protection in DFN‑2 (0402) footprints for space‑constrained electronic designs. The bidirectional devices support IEC 61000‑4‑2,‑4‑4, an
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    Date:
    07/02/2026
    TDK Introduces Compact SMD Components for Gate Drivers and Isolated DC-DC Converters in xEVs

    TDK Introduces Compact SMD Components for Gate Drivers and Isolated DC-DC Converters in xEVs

    TDK Introduces Compact SMD Components for Gate Drivers and Isolated DC-DC Converters in xEVs
    ­TDK Corporation introduces the E13 EM series (ordering code: B8280*F*). These IGBT/FET gate drive transformers are designed for automotive 500-V battery systems, enabling reliable isolation in traction inverters and compact DC-DC converters. By meeting stringent creepage and clearance requirements, this new ser
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    Date:
    07/02/2026
    KYOCERA AVX Releases new Web-Based Antenna Integration Tool

    KYOCERA AVX Releases new Web-Based Antenna Integration Tool

    KYOCERA AVX Releases new Web-Based Antenna Integration Tool
    ­KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new web-based RF engineering tool — the Antenna Integrator Studio.  Wireless connectivity has become a ubiquitous capability for elect
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    Date:
    06/29/2026
    Streamline Spacecraft Timing Architecture with Microchip’s Radiation-Tolerant, Low-Power, Low-Jitter Six-Output Clock Generator

    Streamline Spacecraft Timing Architecture with Microchip’s Radiation-Tolerant, Low-Power, Low-Jitter Six-Output Clock Generator

    Streamline Spacecraft Timing Architecture with Microchip’s Radiation-Tolerant, Low-Power, Low-Jitter Six-Output Clock Generator
    ­Spacecraft timing systems must provide highly stable, precise signals for navigation, communications and scientific instruments, even when GNSS signals are weak or unavailable. Designers often rely on multiple oscillators and buffers to supply precise frequencies to various subsystems, adding size, mass and co
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    Date:
    06/25/2026
    Melexis Tackles Signal Integrity Challenges in High-Power EVs with Digital Current Sensor

    Melexis Tackles Signal Integrity Challenges in High-Power EVs with Digital Current Sensor

    Melexis Tackles Signal Integrity Challenges in High-Power EVs with Digital Current Sensor
    ­Melexis unveils the MLX91229, a conventional-Hall current sensor featuring a sigma-delta digital output to improve signal integrity in electrically noisy environments. Supporting current sensing from 200 A to 2000 A, the new IC is optimized for traction inverters and other automotive systems where local power el
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    Date:
    06/25/2026
    Compact Protection for Maximum Reliability

    Compact Protection for Maximum Reliability

    Compact Protection for Maximum Reliability
    ­The new PPTC series PFTA, PFTB, PFTC and PFTL from SCHURTER provide reliable resettable overcurrent and overtemperature protection for modern electronic applications. In the event of a fault, the polymer PTC device automatically increases resistance to effectively protect systems against overloads an
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    Date:
    06/25/2026
    TE Connectivity Expands 1.27 mm Pitch Board-Connector-Portfolio with SMC Connector Series

    TE Connectivity Expands 1.27 mm Pitch Board-Connector-Portfolio with SMC Connector Series

    TE Connectivity Expands 1.27 mm Pitch Board-Connector-Portfolio with SMC Connector Series
    ­TE Connectivity, a world leader in connectors and sensors, is presenting their latest AMP SMC essential connector with a 1.27 mm pitch. It complements the existing fine pitch portfolio and, thanks to various configurations, offers developers and designers a wide range of options to tailor their board-to-board an
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    Date:
    06/25/2026
    Infineon Introduces the AIROC UWB TSL100 for Precise Positioning and Smart Presence Detection on a Single Chip

    Infineon Introduces the AIROC UWB TSL100 for Precise Positioning and Smart Presence Detection on a Single Chip

    Infineon Introduces the AIROC UWB TSL100 for Precise Positioning and Smart Presence Detection on a Single Chip
    ­Infineon Technologies AG introduced the AIROC™ UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing se
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    Date:
    06/25/2026
    ABB Introduces ReliaHome ELITE Circuit Breakers: Adaptive Machine Learning Technology for Smarter, Safer Homes

    ABB Introduces ReliaHome ELITE Circuit Breakers: Adaptive Machine Learning Technology for Smarter, Safer Homes

    ABB Introduces ReliaHome ELITE Circuit Breakers: Adaptive Machine Learning Technology for Smarter, Safer Homes
    ­ABB today announced the launch of ReliaHome® ELITE AFCI/DFCI Circuit Breakers, a new generation of residential protection built on adaptive, machine-learning arc-fault technology. Using multiple, advanced algorithms, ReliaHome® ELITE distinguishes real electrical threats from harmless background noise, delivering rel
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    Date:
    06/24/2026
    Infineon RASIC CTRX8188F Enters Mass Production as Automotive Industry's First 8Tx8Rx Imaging Radar MMIC, Accelerating the Shift to Centralized Radar Architectures

    Infineon RASIC CTRX8188F Enters Mass Production as Automotive Industry's First 8Tx8Rx Imaging Radar MMIC, Accelerating the Shift to Centralized Radar Architectures

    Infineon RASIC CTRX8188F Enters Mass Production as Automotive Industry's First 8Tx8Rx Imaging Radar MMIC, Accelerating the Shift to Centralized Radar Architectures
    ­Infineon Technologies AG has started the production of the RASIC™ CTRX8188F, a next-generation 8Tx8Rx radar transceiver that positions Infineon at the forefront of the rapidly expanding automotive 4D and HD imaging radar market. The device is ready for production engineered to support edge processing in co
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    Date:
    06/24/2026
    Indeeco Introduces New Instrument Enclosure Heaters for Reliable Freeze Protection

    Indeeco Introduces New Instrument Enclosure Heaters for Reliable Freeze ProtectionIndeeco Introduces New Instrument Enclosure Heaters for Reliable Freeze Protection

    Indeeco Introduces New Instrument Enclosure Heaters for Reliable Freeze Protection
    ­Indeeco, a leader in electric heating and thermal management, announces the release of its new Instrument Enclosure Heaters—an energy-efficient solution designed to help protect sensitive electrical and mechanical components from freezing, condensation, and cold-weather performance issues. Designed for use i
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    Date:
    06/24/2026
    Ambiq Launches heliaCORE for Real-World Edge AI Deployment

    Ambiq Launches heliaCORE for Real-World Edge AI Deployment

    Ambiq Launches heliaCORE for Real-World Edge AI Deployment
    ­Ambiq Micro, Inc., a technology leader in ultra-low-power semiconductor solutions for edge AI, today announced heliaCORE™, the foundational software layer powering its HELIA™ Edge AI ecosystem. Built specifically for Apollo SoCs, heliaCORE provides optimized AI kernels, broad operator acceleration, and pr
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    Date:
    06/23/2026
    Pickering Expands Analog Output Portfolio for Functional Test and HIL

    Pickering Expands Analog Output Portfolio for Functional Test and HIL

    Pickering Expands Analog Output Portfolio for Functional Test and HIL
    ­Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced three new PXI/PXIe analog output modules, expanding its growing portfolio of signal sourcing and sensor simulation for functional and hardware-in-the-loop (HI
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    Date:
    06/23/2026
    Epson Low-power OCXO Redefines Precision Timing for AI and Edge Infrastructure

    Madura Fontaine, Product Marketing Manager, Epson Microdevices

    Epson Low-power OCXO Redefines Precision Timing for AI and Edge Infrastructure
    ­Epson Timing has introduced a new, low-power, oven-controlled crystal oscillator engineered to deliver the ultra-stable timing performance required for AI, edge, and next-generation communication infrastructures, while reducing power consumption and design footprint. The new OG7050CAN is verified to consum
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    Date:
    06/23/2026
    ABB Expands non-Invasive Sensing Portfolio to Advance Simpler and Safer Temperature Measurement

    Jacques Mulbert, President of ABB’s Measurement & Analytics division

    ABB Expands non-Invasive Sensing Portfolio to Advance Simpler and Safer Temperature Measurement
    ­ABB has expanded its NINVA™ non-invasive temperature measurement portfolio with the introduction of NINVA™ Integrated, NINVA™ Remote, and NINVA™ Compact. The new solutions are designed to address distinct application needs in oil & gas, chemicals, power, and marine where safety and accuracy are pa
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    Date:
    06/18/2026
    Toshiba Releases 60V and 100V N-channel Power MOSFETs in Three New Package Options to Improve Efficiency of Industrial Equipment Power Lines

    Toshiba Releases 60V and 100V N-channel Power MOSFETs in Three New Package Options to Improve Efficiency of Industrial Equipment Power Lines

    Toshiba Releases 60V and 100V N-channel Power MOSFETs in Three New Package Options to Improve Efficiency of Industrial Equipment Power Lines
    ­Toshiba Electronics Europe GmbH (“Toshiba”) has expanded its portfolio of N-channel power MOSFETs with the launch of nine new parts in three types of small, high heat dissipation packages. The new lineup comprises three 100V products for 48V power lines in industrial equipment and six 60V products for 24
    . . . Learn More
    Date:
    06/18/2026
    800 W Quarter-Brick DC/DC Converter for Telecom RFPA and Datacom Applications

    800 W Quarter-Brick DC/DC Converter for Telecom RFPA and Datacom Applications

    800 W Quarter-Brick DC/DC Converter for Telecom RFPA and Datacom Applications
    ­Flex Power Modules has introduced a new variant of the BMR684, a quarter-brick isolated DC/DC converter designed for telecom radio frequency power amplifier (RFPA) applications. The BMR6841120/201 module delivers 800 W—an increase of 14% over the previous generation—while operating across a 36 V to 75
    . . . Learn More
    Date:
    06/18/2026
    Sumida Introduces +165°C Metal Composite Power Inductors

    Sumida Introduces +165°C Metal Composite Power Inductors

    Sumida Introduces +165°C Metal Composite Power Inductors
    ­Sumida Corporation, a global leader in inductive components and solutions, announced the availability of the MCDMCF201612/DS, a new high-temperature SMD power inductor engineered to operate reliably in environments where conventional inductors fall short. Featuring an operational temperature range of -55°C to
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    Date:
    06/16/2026
    STMicroelectronics' Multiplier-Less PFC Controller Enhances Cost-Sensitive, Energy-Efficient Applications

    STMicroelectronics' Multiplier-Less PFC Controller Enhances Cost-Sensitive, Energy-Efficient Applications

    STMicroelectronics' Multiplier-Less PFC Controller Enhances Cost-Sensitive, Energy-Efficient Applications
    ­STMicroelectronics’ L6462A transition-mode (TM) power-factor correction (PFC) controller cuts bill-of-materials (BOM) costs while enhancing efficiency, enabling consumer products and power supplies up to 250W to meet stringent eco-design norms.  The L6462A uses a current generator and shape
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    Date:
    06/16/2026
    SpinDrive Launches Magma X100 Controller, Bringing Active Magnetic Bearing Technology to a New Generation of Industrial Applications

    SpinDrive Launches Magma X100 Controller, Bringing Active Magnetic Bearing Technology to a New Generation of Industrial Applications

    SpinDrive Launches Magma X100 Controller, Bringing Active Magnetic Bearing Technology to a New Generation of Industrial Applications
    ­SpinDrive, a Finnish company delivering market-leading advanced active magnetic bearing (AMB) systems for a wide range of industrial machinery, is announcing the launch of the Magma X100, a new magnetic bearing controller platform designed for lower-power, ultra-high-speed applications up to 150 kW. Due to be
    . . . Learn More
    Date:
    06/11/2026
    Nexperia Expands 650 V GaN FET Portfolio with Multiple RDS(on) Classes and Industry-Standard Packages

    Nexperia Expands 650 V GaN FET Portfolio with Multiple RDS(on) Classes and Industry-Standard Packages

    Nexperia Expands 650 V GaN FET Portfolio with Multiple RDS(on) Classes and Industry-Standard Packages
    ­Nexperia today announced the expanded portfolio of 650 V industrial-grade high-power GaN FETs for demanding power conversion applications. The portfolio includes devices in 35 mΩ, 50 mΩ and 70 mΩ, offered in industry-standard TO-247-3, TO-247-4, TOLL and TOLT packages. The extended portfolio provides power en
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    Date:
    06/11/2026
    TDK Expands Cost-Effective Series of DIN-rail Mount Power Supplies to Include 12, 48, and 72 V Output Models

    TDK Expands Cost-Effective Series of DIN-rail Mount Power Supplies to Include 12, 48, and 72 V Output Models

    TDK Expands Cost-Effective Series of DIN-rail Mount Power Supplies to Include 12, 48, and 72 V Output Models
    ­TDK Corporation announces the expansion of the TDK-Lambda D1SE series of cost-effective DIN-rail mount power supplies with 12, 48, and 72 V output models. Initially launched with 120, 240 and 480 W 24 V versions, the series offering has now been broadened to better support the needs of various applications, su
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    Date:
    06/11/2026
    Taiwan Semi Introduces AEC-Q 40/60V Power MOSFETs in PDFN56U, Wettable Flank Package

    Taiwan Semi Introduces AEC-Q 40/60V Power MOSFETs in PDFN56U, Wettable Flank Package

    Taiwan Semi Introduces AEC-Q 40/60V Power MOSFETs in PDFN56U, Wettable Flank Package
    ­Taiwan Semiconductor, global supplier of discrete power electronics devices, LED drivers, analog ICs, TVSs and ESD protection devices, introduces the TQM series of automotive-grade power MOSFETs. The n-channel, 40V/60V devices come in a wettable flank PDFN56U package supporting drop-in pin compatibility with oth
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    Date:
    06/09/2026
    onsemi Introduces Industry-First Elite Pairing Studio to Simplify Power Design

    onsemi Introduces Industry-First Elite Pairing Studio to Simplify Power Design

    onsemi Introduces Industry-First Elite Pairing Studio to Simplify Power Design
    ­The onsemi Elite Pairing Studio is an online design environment that simplifies pairing SiC MOSFETs and gate drivers for demanding power electronics applications, including AI data centers, electric vehicles, and industrial systems. By providing visibility into device‑level behavior and pairing trade‑offs, th
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    Date:
    06/08/2026
    Kaman Highlights AMS Family of High-Precision Non-Contact Displacement Sensors for Aerospace and Military Markets

    Kaman Highlights AMS Family of High-Precision Non-Contact Displacement Sensors for Aerospace and Military Markets

    Kaman Highlights AMS Family of High-Precision Non-Contact Displacement Sensors for Aerospace and Military Markets
    ­The Measuring Division of Kaman Precision Products, Inc., the world leader in the design and manufacture of high-performance position measurement systems, highlights its Advanced Magnetic Sensing (AMS) family of high-precision non-contact measuring systems, specifically designed for the aerospace and military ma
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    Date:
    06/05/2026
    STMicroelectronics' 48V Automotive Pre-Driver Combines ISO 21780 Compliance with 8-Channel Flexibility for Mild-Hybrid and Auxiliary Systems

    STMicroelectronics' 48V Automotive Pre-Driver Combines ISO 21780 Compliance with 8-Channel Flexibility for Mild-Hybrid and Auxiliary Systems

    STMicroelectronics' 48V Automotive Pre-Driver Combines ISO 21780 Compliance with 8-Channel Flexibility for Mild-Hybrid and Auxiliary Systems
    ­With an absolute maximum rating (AMR) of 75V, STMicroelectronics’ L98GD8E is the only 48V automotive pre-driver to combine compliance with the ISO 21780 standard for 48V electrical systems and eight channels for high-side and low-side driving. The device’s eight outputs are independently configurable for drivi
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    Date:
    06/05/2026
    Toshiba Launches 40V N-channel Power MOSFETs in SOP Advance (EWF) Package to Boost Efficiency in Automotive Applications

    Toshiba Launches 40V N-channel Power MOSFETs in SOP Advance (EWF) Package to Boost Efficiency in Automotive Applications

    Toshiba Launches 40V N-channel Power MOSFETs in SOP Advance (EWF) Package to Boost Efficiency in Automotive Applications
    ­Toshiba Electronics Europe GmbH (“Toshiba”) announces the launch of three new 40V N-channel power MOSFETs: the XPMR5904PB available now, and the XPMR7404PB and XPMR8504PB, which will become available shortly. These devices use the newly adopted SOP Advance (EWF) package and are designed for demanding automotive ap
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    Date:
    06/05/2026
    Melexis Introduces the World's First 2-wire 2-bit Hall Switch

    Melexis Introduces the World's First 2-wire 2-bit Hall Switch

    Melexis Introduces the World's First 2-wire 2-bit Hall Switch
    ­Melexis unveils the MLX92344, a highly flexible PCB-less solution for contactless detection of up to four positions, eliminating the need for bulky microswitches. While ensuring backward compatibility over 2-wires, it introduces fully programmable current levels and magnetic thresholds. This innovation enables th
    . . . Learn More
    Date:
    06/05/2026
    Bourns MH1608A Series High‑Current Ferrite Beads Support EMI Suppression in Space‑Constrained Automotive Designs

    Bourns® MH1608A Series compact EMI suppression for high-current designs

    Bourns MH1608A Series High‑Current Ferrite Beads Support EMI Suppression in Space‑Constrained Automotive Designs
    ­Bourns announces the release of the MH1608A Series High Current Chip Ferrite Beads, an AEC‑Q200‑compliant, automotive grade component family designed to suppress high‑frequency noise in space‑constrained electronic designs. The series combines a compact 1.6 × 0.8 mm footprint with low DC resistance an
    . . . Learn More
    Date:
    06/04/2026
    650V ICeGaN Device for Automotive Applications from CGD Helps Increase EV Range

    Daniel Murphy, Senior Director of Product Management at CGD

    650V ICeGaN Device for Automotive Applications from CGD Helps Increase EV Range
    ­Cambridge GaN Devices (CGD) has developed a 650V GaN IC for automotive applications that addresses automakers desire to improve inverter efficiency. ICeGaN® helps designers realise smaller, lighter inverters that help extend EV range which is crucial in continuing to drive consumer momentum away from IC
    . . . Learn More
    Date:
    06/04/2026
    Tiny Pressure Sensor With Analog Voltage Output In A DIP-06 Package

    Different variants of AMS 6836 for the measurement of differential, bidirectional differential and absolute pressure.

    Tiny Pressure Sensor With Analog Voltage Output In A DIP-06 Package
    ­The new AMS 6836 pressure sensor series from the manufacturer Analog Microelectronics offers high-precision pressure measurements in an ultra-compact DIP-06 package (11 x 7.6 x 7.2 mm^3). As the small, cost-effective variant of AMS 6832, AMS 6836 was developed for miniaturizing pressure sensing and control un
    . . . Learn More
    Date:
    06/04/2026
    XpressConnect PCIe 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers

    XpressConnect PCIe 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers

    XpressConnect PCIe 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
    ­As AI workloads continue to scale, data center architects are increasingly constrained by limited signal reach and rising latency, which can leave valuable memory resources underutilized across large GPU clusters. These challenges are amplified as interconnect speeds increase. At 64 GT/s (giga transfers per sec
    . . . Learn More
    Date:
    06/02/2026
    Marvell Announces Availability of Industry's First 102.4 Tbps Switch Purpose-Built for AI and Cloud Data Center Infrastructure

    Marvell Announces Availability of Industry's First 102.4 Tbps Switch Purpose-Built for AI and Cloud Data Center Infrastructure

    Marvell Announces Availability of Industry's First 102.4 Tbps Switch Purpose-Built for AI and Cloud Data Center Infrastructure
    ­Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today introduced Marvell Teralynx T100, the industry’s first 102.4 Tbps switch silicon purpose-built for the AI era. Unlike legacy switching platforms designed for traditional enterprise and cloud data centers, the Teralynx T1
    . . . Learn More
    Date:
    06/01/2026
    Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption

    Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption

    Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module to Accelerate Long-Range IoT Adoption
    ­Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced the MM8108-M20, a high-power Wi-Fi HaLow module designed to help product teams in the US and Canada bring long-range, low-power Wi-Fi HaLow devices to market faster. Built around Morse Micro’s second-generation MM8108 Wi-Fi HaL
    . . . Learn More
    Date:
    06/01/2026
    MH3261‑T Series High Current Chip Ferrite Beads for EMI Suppression in High‑Density Power

    Bourns® MH3261-T Series Ferrite Beads for high-current EMI suppression

    MH3261‑T Series High Current Chip Ferrite Beads for EMI Suppression in High‑Density Power
    ­Bourns announced the MH3261‑T Series High Current Chip Ferrite Beads, designed to address EMI suppression challenges in high‑density PCB layouts where current capacity and board space are constrained. The series combines a compact 3.2 × 1.6 mm footprint with low DC resistance and rated current capability up
    . . . Learn More
    Date:
    06/01/2026
    VIAVI Introduces GNSS-Disciplined Oscillator for Precision Timing in Size, Weight and Power-Constrained Platforms

    VIAVI Introduces GNSS-Disciplined Oscillator for Precision Timing in Size, Weight and Power-Constrained Platforms

    VIAVI Introduces GNSS-Disciplined Oscillator for Precision Timing in Size, Weight and Power-Constrained Platforms
    ­VIAVI Solutions Inc. (VIAVI) has announced the launch of the µPNT GDO-1000, a new GNSS-disciplined oscillator built in the M.2 B-key form factor. Measuring just 22mm x 42mm, the size of a postage stamp, and weighing less than 4 grams, the GDO-1000 is designed for platforms requiring accurate timing in places wh
    . . . Learn More
    Date:
    06/01/2026
    Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center

    Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center

    Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center
    ­Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced two new ultra-slim, compact auxiliary power supply reference designs for 800 VDC AI data centers. The single-output, 15 W design is only 30 mm by 30 mm with a 7 mm profile, while the isolated, si
    . . . Learn More
    Date:
    06/01/2026
    NXP Semiconductors' i.MX RT1180 Microcontrollers, Now at Mouser, Offer Advanced Security for Ethernet and Industry 4.0/5.0 Applications

    NXP Semiconductors' i.MX RT1180 Microcontrollers, Now at Mouser, Offer Advanced Security for Ethernet and Industry 4.0/5.0 Applications

    NXP Semiconductors' i.MX RT1180 Microcontrollers, Now at Mouser, Offer Advanced Security for Ethernet and Industry 4.0/5.0 Applications
    ­Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, is now stocking the i.MX RT1180 crossover microcontrollers (MCUs) from NXP® Semiconductors. The dual-core, real-time MCUs feature a high-performance Arm
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    Date:
    05/28/2026
    Essential Performance and Real-time Control Without the Baggage

    Essential Performance and Real-time Control Without the Baggage

    Essential Performance and Real-time Control Without the Baggage
    ­Designers of real-time control applications are increasingly challenged to balance performance and peripheral integration while keeping system cost and complexity low. To address these challenges, Microchip Technology Inc. has introduced the dsPIC33CK Value Line family of Digital Signal Controllers (D
    . . . Learn More
    Date:
    05/28/2026
    New ClampSonic 4 clamp-on Ultrasonic Flow Meter from WIKA for Contactless Measurement of Process Liquids

    The new ClampSonicTM4 from WIKA is available in a field version (left) and a wireless version (right)

    New ClampSonic 4 clamp-on Ultrasonic Flow Meter from WIKA for Contactless Measurement of Process Liquids
    ­WIKA has expanded its portfolio with a new flow meter for challenging process media. The FLC-CS4 from the ClampSonic™ instrument series features a contactless clamp-on design. When mounted on the outside of a pipe, the instrument can measure flow non-invasively in both directions. The transducers use the pr
    . . . Learn More
    Date:
    05/28/2026
    Henkel Ultra-Low Viscosity Technomelt Material Delivers Rugged Protection for Challenging Electronic Device Designs

    Henkel Ultra-Low Viscosity Technomelt Material Delivers Rugged Protection for Challenging Electronic Device Designs

    Henkel Ultra-Low Viscosity Technomelt Material Delivers Rugged Protection for Challenging Electronic Device Designs
    ­Expanding its award-winning line of Technomelt low pressure molding materials, Henkel today announced the addition of Technomelt PA 6370, a highly flowable, ultra-low melt viscosity formulation engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling ga
    . . . Learn More
    Date:
    05/27/2026
    Bel Launches TLP5000 Series Liquid-Cooled 3-Phase AC-DC Converters for High-Power Industrial Applications

    Bel Launches TLP5000 Series Liquid-Cooled 3-Phase AC-DC Converters for High-Power Industrial Applications

    Bel Launches TLP5000 Series Liquid-Cooled 3-Phase AC-DC Converters for High-Power Industrial Applications
    ­Bel Fuse Inc., a leading global manufacturer of trusted components, systems, and solutions for mission-critical applications across industrial, aerospace and defense, and data solutions markets, launched its TLP5000 Series, a new generation of liquid-cooled, high-power 3-phase AC-DC converters designed to me
    . . . Learn More
    Date:
    05/27/2026
    Microchip Launches 3.3 kV HV‑D3 mSiC Power Modules to Enable Solid-State Transformers for AI Data Centers

    Microchip Launches 3.3 kV HV‑D3 mSiC Power Modules to Enable Solid-State Transformers for AI Data Centers

    Microchip Launches 3.3 kV HV‑D3 mSiC Power Modules to Enable Solid-State Transformers for AI Data Centers
    ­Microchip Technology announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high‑voltage power applications. The new modules integrate 3.3 kV silicon carbide (S
    . . . Learn More
    Date:
    05/26/2026
    STMicroelectronics' new GaN Semiconductors Improve Energy Efficiency for High-Demand Applications from AI Servers to Robotics

    STMicroelectronics' new GaN Semiconductors Improve Energy Efficiency for High-Demand Applications from AI Servers to Robotics

    STMicroelectronics' new GaN Semiconductors Improve Energy Efficiency for High-Demand Applications from AI Servers to Robotics
    ­New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The 700V PowerGaN devices in the STPOWER portfolio address challenges such as rising AI server power consumption an
    . . . Learn More
    Date:
    05/26/2026
    TDK Launches new Stray-Field Robust Fast Hall Sensor with Analog Outputs for ASIL D Applications

    TDK Launches new Stray-Field Robust Fast Hall Sensor with Analog Outputs for ASIL D Applications

    TDK Launches new Stray-Field Robust Fast Hall Sensor with Analog Outputs for ASIL D Applications
    ­TDK Corporation announces the addition of HAL 3025 to its Micronas fast Hall sensor position sensor family. Following the successful launch of HAL 3020 and HAL 3021, HAL 3025 extends the portfolio with a single die sensor that is assessed for stringent ISO 26262 ASIL D requirements an
    . . . Learn More
    Date:
    05/26/2026
    Infineon CoolGaN BDS 40 V G3 Family Delivers up to 82% Footprint Reduction for Portable Power Designs

    The Infineon CoolGaN BDS 40 V G3 family addresses the full spectrum of mobile power switching requirements from compact wearables to high-performance notebooks.

    Infineon CoolGaN BDS 40 V G3 Family Delivers up to 82% Footprint Reduction for Portable Power Designs
    ­Infineon Technologies AG expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S.  The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of
    . . . Learn More
    Date:
    05/26/2026
    Melexis Integrates On-Chip DC/DC Power to Simplify LIN RGB Automotive Lighting

    Melexis Integrates On-Chip DC/DC Power to Simplify LIN RGB Automotive Lighting

    Melexis Integrates On-Chip DC/DC Power to Simplify LIN RGB Automotive Lighting
    ­Melexis announces the MLX81119, an 18-channel LIN RGB LED controller with an integrated DC/DC converter, designed to simplify and optimize automotive lighting systems. By generating the LED supply voltage locally on chip, the MLX81119 significantly reduces power dissipation, external components and space requirements in
    . . . Learn More
    Date:
    05/21/2026
    STMicroelectronics Announces Enhanced Version of Industry-Proven Battery-Management IC

    STMicroelectronics Announces Enhanced Version of Industry-Proven Battery-Management IC

    STMicroelectronics Announces Enhanced Version of Industry-Proven Battery-Management IC
    ­STMicroelectronics’ L9963F automotive battery-management IC includes all the features needed to manage lithium battery packs in hybrid (HE) and full electric (FE) vehicles, as well as industrial energy storage systems, and 48V/96V applications. The L9963F brings under-the-skin improvements to the ind
    . . . Learn More
    Date:
    05/21/2026
    Alpha and Omega Semiconductor Unveils Total Power Solution for Next-Gen Intel Panther Lake and Wildcat Lake Platforms

    Alpha and Omega Semiconductor Unveils Total Power Solution for Next-Gen Intel Panther Lake and Wildcat Lake Platforms

    Alpha and Omega Semiconductor Unveils Total Power Solution for Next-Gen Intel Panther Lake and Wildcat Lake Platforms
    Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced a new family of digital multiphase controllers: the AOZ71049QI, AOZ71149QIand AOZ71146QI.Specifically en
    . . . Learn More
    Date:
    05/18/2026
    Reliable Stratos T2 Series Media Converters from Cinch Now Available Through Powell Electronics

    Reliable Stratos T2 Series Media Converters from Cinch Now Available Through Powell Electronics

    Reliable Stratos T2 Series Media Converters from Cinch Now Available Through Powell Electronics
    ­The rugged Stratos T2 Series media converter from Cinch Connectivity Solutions can now be sourced through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial. The components are designed to provide seamless conversion between el
    . . . Learn More
    Date:
    05/15/2026
    Sager Electronics and APEM Sign Distribution Agreement

    Adrian Orat, Supplier Marketing and Product Manager at Sager Electronics

    Sager Electronics and APEM Sign Distribution Agreement
    ­Sager Electronics, a leading North American distributor of Interconnect, Power, and Electromechanical products and custom solutions provider, is pleased to announce the addition of APEM to its line card. This new partnership expands Sager’s electromechanical offering with APEM’s comprehensive ra
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    Date:
    05/14/2026
    KIOXIA Unveils High Performance KIOXIA XG10 Series SSDs for PC OEMs

    KIOXIA Unveils High Performance KIOXIA XG10 Series SSDs for PC OEMs

    KIOXIA Unveils High Performance KIOXIA XG10 Series SSDs for PC OEMs
    ­KIOXIA Europe GmbH today announced the KIOXIA XG10 Series solid state drives (SSDs), its latest high-performance client storage solution engineered for PC OEMs. Targeting the performance segment, the new KIOXIA XG10 Series leverages PCIe 5.0 technology to significantly elevate speed and responsiveness ac
    . . . Learn More
    Date:
    05/14/2026
    Vacuum Interrupters Introduces RVI-WL-23338 Replacement Vacuum Interrupter for Westinghouse R-4 Vacuum Circuit Breakers

    Vacuum Interrupters Introduces RVI-WL-23338 Replacement Vacuum Interrupter for Westinghouse R-4 Vacuum Circuit Breakers

    Vacuum Interrupters Introduces RVI-WL-23338 Replacement Vacuum Interrupter for Westinghouse R-4 Vacuum Circuit Breakers
    ­Vacuum Interrupters, a leading manufacturer of replacement vacuum interrupters, pole assemblies, parts, and components for medium-voltage vacuum circuit breakers and contactors, introduces the RVI-WL-23338 replacement vacuum interrupter. This direct fit-and-function replacement unit for Westingho
    . . . Learn More
    Date:
    05/12/2026
    Toshiba Expands 80V N-channel MOSFET Lineup to Support 48V Automotive Systems

    Toshiba Expands 80V N-channel MOSFET Lineup to Support 48V Automotive Systems

    Toshiba Expands 80V N-channel MOSFET Lineup to Support 48V Automotive Systems
    ­Toshiba Electronics Europe GmbH (“Toshiba”) introduces two AEC-Q101 compliant 80V N-channel MOSFETs, expanding its lineup to support 48V automotive systems. The XPH2R608QB and XPH3R908QB are the first products from the latest-generation U-MOSX-H process to be housed in the SOP Advance (WF) package with we
    . . . Learn More
    Date:
    05/12/2026
    Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

    Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

    Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing
    ­Infineon Technologies AG announced a collaboration with d-Matrix®, a pioneer in highly interactive, low-latency AI inference compute for data centers. Infineon’s power solutions help d-Matrix’s Corsair™ inference accelerator achieve industry-leading performance, energy efficiency, and system integration in
    . . . Learn More
    Date:
    05/12/2026
    Archive

    Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications

    Jul 30,2026

    KYOCERA AVX Releases new Web-Based Antenna Integration Tool

    Jun 29,2026

    New ClampSonic 4 clamp-on Ultrasonic Flow Meter from WIKA for Contactless Measurement of Process Liquids

    May 28,2026

    Littelfuse Launches High-Voltage TPSMC, TPSMD, TP5.0SMDJ TVS Diodes for Automotive Power Protection

    Apr 30,2026

     

     

     

     

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