Power Semiconductors

February 2023
Developing a New Approach to Predicting the Behavior of GaN Devices

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Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices

­Introduction Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed. This has led to the development of models and equations for failure modes like time-de
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Date:
02/24/2023
Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

­The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies AG announced it has successfully registered its QDPAK and DDPAK to
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Date:
02/09/2023
Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability

Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability

­TDK Corporation presents its new EPCOS B43652* series of snap-in aluminum electrolytic capacitors that are characterized by very compact dimensions and very high ripple current-carrying capacity. The RoHS-compatible capacitors are designed for a maximum rated voltage of 450 V DC and cover a capacitance ra
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Date:
02/09/2023
Improving System-Level Performance and Robustness in Power Line Monitoring

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Figure 1. AD7606B in a typical power line monitoring application

­For many applications, monitoring powerlines implies the use of current transformers and resistor divider networks in order to sense the three phases and neutral voltages and currents, as shown in Figure 1. The AD7606B, due to its high input impedance, can directly interface with a sensor, easing the da
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Date:
02/01/2023

 

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