Power Semiconductors
February 2023
Click image to enlarge
Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices
Introduction
Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed.
This has led to the development of models and equations for failure modes like time-de
. . . Learn More
Date:
02/24/2023
Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies AG announced it has successfully registered its QDPAK and DDPAK to
. . . Learn More
Date:
02/09/2023
Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability
TDK Corporation presents its new EPCOS B43652* series of snap-in aluminum electrolytic capacitors that are characterized by very compact dimensions and very high ripple current-carrying capacity. The RoHS-compatible capacitors are designed for a maximum rated voltage of 450 V DC and cover a capacitance ra
. . . Learn More
Date:
02/09/2023
Click image to enlarge
Figure 1. AD7606B in a typical power line monitoring application
For many applications, monitoring powerlines implies the use of current transformers and resistor divider networks in order to sense the three phases and neutral voltages and currents, as shown in Figure 1. The AD7606B, due to its high input impedance, can directly interface with a sensor, easing the da
. . . Learn More
Date:
02/01/2023
Archives
