Lighting & Illumination
March 2019
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How should you proceed with a switching regulator with an analog ground (AGND) and a power ground (PGND)? This is a question asked by many developers designing a switching power supply. Some developers are accustomed to dealing with a digital GND and an analog GND; however, their experience frequently fails th
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Date:
03/31/2019
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Anup Bhalla, Ph.D., Vice President Engineering, UnitedSiC
SiC applications began in the 2000s with the adoption of SiC JBS diodes into PFC applications. This was followed by the use of SiC diodes and FETs in the PV industry. But the recent surge in applications relating to EV On-board chargers and DC-DC converters is driving SiC growth. The nascent adoption in the EV
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Date:
03/31/2019
SHAKOPEE, Minn. - In the midst of increasing compliance demands for emissions monitoring and nitrogen oxide (NOx) measurement in industrial applications, companies now have the opportunity to move beyond costly consumables and complex gas sample treatment associated with aging, legacy measurement sy
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Date:
03/29/2019
OTTAWA, Ontario, Canada – GaN Systems announced the availability of the GS-065 low current (3.5A to 11A) transistor line. The product suite, developed for sub-1kW power applications, is targeted for consumer level power supply products such as AC adapters for gaming and workstation laptops, TV power, LED lighting, wi
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Date:
03/27/2019
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PI InnoSwitch3-MX & InnoMux
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, has announced the release of the InnoMux™ chipset for display power supplies. The chipset’s unique single-stage power architecture reduces losses in display applications by increasing overall efficiency in constant-voltage and constant-curr
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Date:
03/27/2019
MALVERN, Pa. — Vishay Intertechnology, Inc. expanded its offering of Automotive Grade IHLP low profile, high current inductors with a new device in the 2020 case size. The Vishay Dale IHLP-2020BZ-5A combines a high operating temperature to +155°C with a low profile of 2 mm to save space in under the hood auto
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Date:
03/21/2019
SiC JFETs for Low Power AC/DC Flyback Converters
March 19, 2019, Applied Power Electronics Conference (APEC) Anaheim CA, and Princeton,New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced it has released a range of SiC JFET die suitable for co-packaging with a controller IC with built in low voltage MOSFET to fa
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Date:
03/20/2019
DURHAM, N.C. - Cree, Inc. announces the execution of a definitive agreement to sell its Lighting Products business unit (“Cree Lighting”), which includes the LED lighting fixtures, lamps and corporate lighting solutions business for commercial, industrial and consumer applications, to IDEAL INDUSTRIES, INC.
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Date:
03/20/2019
CARLSBAD, Calif. – Brightworks Technology, Inc., announces its new development initiative to produce market-leading, reliable, efficient, compact and water-resistant AC/DC LED drivers for demanding outdoor, architectural lighting, signage, and horticulture applications. Brightworks’ Silverback series which is
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Date:
03/19/2019
ANAHEIM, Calif. -- Fabless power semiconductor company Helix Semiconductors announced sampling of its MxC 300 AC-DC power ICs. The MxC 300 is a two-chip solution that offers the highest power density in the industry – up to 10x higher than transformer-based solutions – for 65W AC-DC power supply products. Ev
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Date:
03/19/2019
Chris Dries, President and CEO at UnitedSiC
March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc. (ADI). Terms of the investment and supply agreement were not announced.
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Date:
03/18/2019
EL SEGUNDO, Calif. — Efficient Power Conversion (EPC) announces the EPC2052, a 100 V GaN transistor with a maximum RDS(on) of 13.5mΩ and a 74 A pulsed output current for high efficiency power conversion in a tiny 2.25mm2 footprint.
Applications demanding higher efficiency and power density no longer hav
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Date:
03/15/2019
Last month, we did a PSDcast with PowerAmerica, a Department of Energy institute tasked with accelerating the commercialization of wide-bandgap (WBG) semiconductors. And with the Applied Power Electronics Conference and Exposition (APEC) right around the corner (or closer, depending on when you read this), we’
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Date:
03/11/2019
Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor
The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better pe
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Date:
03/08/2019
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Figure 1. Boost topology for generating a high voltage from a low voltage
If a high voltage needs to be generated from a low voltage, a boost converter can be used. This represents one of the three elementary switching regulator topologies and requires only two switches, an inductor, and input and output capacitors. Besides the boost converter, the other basic topologies are the buck co
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Date:
03/08/2019
(SHANGHAI) – I-Star Lighting continues to expand its product portfolio available in the North American market.
According to Melissa Chen, vice president of I-Star Lighting. “This year we are introducing a number of new LED drivers that enable our customers to develop more innovative and dynamic LED light
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Date:
03/07/2019
In the ETH lab, shining a light through the center of a transparent pane coated with nanoparticles prevents the lit area from fogging.
Anyone who skis, wears glasses, uses a camera or drives a car is familiar with the problem: if you come into a humid environment from the cold, your eyewear, camera lens or windshield can quickly fog up. Researchers at ETH Zurich have now developed a new transparent material coating that greatly reduces this ef
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Date:
03/06/2019
The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles.
The quick connect technology used in the Han ES Press HMC involves the con
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Date:
03/06/2019
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified.
These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’
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Date:
03/06/2019
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal conne
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Date:
03/06/2019
Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W peak power with an efficiency up to 94%. The ENI2
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Date:
03/06/2019
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application.
Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology that is capable of extractin
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Date:
03/06/2019
Dialog Semiconductor unveiled the SmartBond DA1469x family of Bluetooth low energy SoCs, its most advanced, feature-rich range of multi-core microcontroller units (MCUs) for wireless connectivity. The new product family which includes four variants, builds on the successes of Dialog’s SmartBond products addin
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Date:
03/06/2019
ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This new package offers superior mountability and long operational life, which makes it ideal for use in display panels (e.g. temperature control displays) in industria
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Date:
03/06/2019
Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and configurable 25 amp, 50 watt outputs, which can
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Date:
03/06/2019
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Figure 1: Core material performance curves
What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application? Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained fr
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Date:
03/01/2019
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