Wearables & Nanopower

May 2019

Versatile Boost Controller for LED/LCD Applications

The device supplies a constant voltage or constant current to drive displays and backlights with a dimming ratio of 100:1. It is well suited for use as a backlight driver for LCD TVs, LCD monitors, and flat panel displays, as well as an LED driver for commercial lighting applications. The AL3353 is a mu

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Date:

05/30/2019

Open Frame Power Supplies with UL8750 Safety Approval

The LU225 family meets EN55015 (EN55032) Class B Conducted EMI, IEC61000-3-2 Class C (LED dimming) and EN60950 standards, and is one of the first open frame power supplies in the industry to feature UL8750 approval for LED equipment. An active inrush current limit capability of 15 A also min

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Date:

05/22/2019

Eight-port switch supports new IEEE 802.3bt PoE standard

Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design. Designed for enterprise connected lighting applications, the PDS-408G connects separate systems such as lighting, sensors, HVAC and W

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Date:

05/22/2019

High Temperature Micro-D Series connectors available at TTI

Optimised to save space and weight in demanding applications, such as space vehicles, defence systems and oil exploration equipment, Micro Series Connectors are rugged and moisture-sealed. These data, power and signal interconnects combine versatility with high performance and high reliability and are designed to b

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Date:

05/22/2019

LTM2810 µModule Isolators, Now Shipping from Mouser

The LTM2810 µModule isolators are suitable for test and measurement equipment, medical equipment, electric vehicle (EV) and hybrid electric vehicle (HEV) systems, industrial applications, and metering systems. The Analog Devices LTM2810 µModule isolators, available

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Date:

05/22/2019

Low profile 180W U-channel PSU for space-critical applications

The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection) of isolation while delivering up to 94% efficiency.

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Date:

05/22/2019

Samtec’s mPOWER Ultra Micro Power Connectors Now at Mouser

Offering current ratings up to 21 A per blade in a 2 mm pitch, mPOWER connectors provide an ultra-small, high-power solution with exceptional design flexibility for power-only or power-and-signal applications. Samtec’s mPOWER connector system, available from Mouser Electronics, features gold-plated power blades a

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Date:

05/22/2019

Infineon scales up production and rolls out of CoolSiC MOSFETs

They are rated from 30 mΩ to 350 mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650 V CoolSiC MOSFET product family, both to be launched soon. With these products, Infineon addresses the fast grow

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Date:

05/22/2019

New CoolSiC Schottky diode 1200 V G5 portfolio from Infineon

It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC charging, solar energy systems, uninterruptible power supply (UPS) and other industrial applicat

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Date:

05/22/2019

Complete Range of Switcher ICs with Integrated 900 V MOSFETs

The newly released devices include ICs for high-efficiency isolated flyback power supplies and for simple non-isolated buck converters. Applications include three-phase industrial power supplies up to 480 VAC, and high-quality consumer products destined for regions with unstable m

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Date:

05/22/2019

UnitedSiC adds 7 SiC FETs to 650V product portfolio

These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively. The new devices will appeal to designers who prefer a 3-lead, TO

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Date:

05/22/2019

8 x 8mm LFPAK MOSFET family delivers up to 48x power density

LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8mm offer a footprint reduction of 60 %, and a 64 % lower profile. Unlike other packages where performance is often limited by internal bond wires, LFPAK88 devices employ the copper-clip and solder die at

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Date:

05/22/2019

Current transducers with measuring range up to 450 Apk

The family consists of three new models: LZSR 100-P, LZSR 150-P and LZSR 200-P. These new transducers are based on LEM’s latest leading-edge ASIC technology, which has been proven in the past launched LF xx10, LH, LxSR current transducer series. Used in a closed loop mode, the ASIC based on Hall effec

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Date:

05/22/2019

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Anup Bhalla, Vice President Engineering, UnitedSiC

Are you SiC of Silicon? - Part 2

By: Anup Bhalla, Vice President Engineering, UnitedSiC

State of SiC Device and Package Technology It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such as on-resistance per unit area (Rds

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Date:

05/01/2019