Powering Embedded Systems

March 2019

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Frederik Dostal Field Applications Engineer Analog Devices, Inc.

How should you proceed with a switching regulator with an analog ground (AGND) and a power ground (PGND)? This is a question asked by many developers designing a switching power supply. Some developers are accustomed to dealing with a digital GND and an analog GND; however, their experience frequently fails th

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Date:

03/31/2019

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Anup Bhalla, Ph.D., Vice President Engineering, UnitedSiC

Are you SiC of Silicon? - Part 1

By: Anup Bhalla, Vice President Engineering, UnitedSiC

SiC applications began in the 2000s with the adoption of SiC JBS diodes into PFC applications. This was followed by the use of SiC diodes and FETs in the PV industry. But the recent surge in applications relating to EV On-board chargers and DC-DC converters is driving SiC growth. The nascent adoption in the EV

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Date:

03/31/2019

Chris Dries, President and CEO at UnitedSiC

UnitedSiC announces strategic investment by Analog Devices

March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc. (ADI). Terms of the investment and supply agreement were not announced.

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Date:

03/18/2019

Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor

Wide Bandgap Semiconductors and Packaging - it’s happening

Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor

The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better pe

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Date:

03/08/2019

Beat Obsolescence with PULS DIN-Rail Power Supplies

PULS Power has undertaken not to discontinue standard products while enough demand is present to make them viable for manufacture. This provides their customers with the reassurance that they will not be forced into costly changes to their system components and performance in regular short intervals and to have

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Date:

03/06/2019

Industry’s smallest logic parts approved for automotive

Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’

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Date:

03/06/2019

Industry’s first automotive USB 3.1 SmartHub supports Type-C

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal conne

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Date:

03/06/2019

Power solution for high speed e-commerce hub conveyers

Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W peak power with an efficiency up to 94%. The ENI2

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Date:

03/06/2019

24 - 44 GHz Wideband Integrated Microwave 5G Transceiver

These ICs operate over a very wide frequency range with 50 Ω-match from 24 GHz up to 44 GHz, facilitating ease of design and reducing the costs of building a single platform that can cover all 5G mm Wave frequency bands including 28 GHz and 39 GHz. Additionally, the chipset is capable of flat 1 GHz RF instanta

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Date:

03/06/2019

Ultra-Low Power Technology applied to Energy Harvesting

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology that is capable of extractin

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Date:

03/06/2019

New SCALE-iDriver SiC-MOSFET Gate Driver

Power Integrations announced the SIC1182K SCALE-iDriver, a high-efficiency, single-channel SiC MOSFET gate driver that delivers the highest peak output gate current available without an external boost stage. Devices can be configured to support different gate-drive voltage requirements matching the range of requi

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Date:

03/06/2019

50-Watt, High Current Density, Non-isolated Digital DC-DC Modules

Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and configurable 25 amp, 50 watt outputs, which can

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Date:

03/06/2019

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Figure 1: Core material performance curves

Reenvision Inductor Operation to Optimize New Applications

Len Crane, Technical Marketing Manger, Coilcraft

What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application? Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained fr

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Date:

03/01/2019