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December 2016
Build a WiFi-enabled 6LoWPAN wireless sensor network

STM32 Open Development Environment

Build a WiFi-enabled 6LoWPAN wireless sensor network
The STM32 Open Development Environment provides developers with end-to-end solutions to explore and validate design concepts. Using a combination of ODE components, it’s now possible to build a wireless sensor network based on 6LoWPAN connectivity leveraging a wide range of sensor technologies and make sensor da
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Date:
12/27/2016

element14 launches ‘Safe & Sound’ wearables design challenge
element14's electronic design community has launched a new Design Challenge for designers and engineers called ‘Safe and Sound’. Sponsored by Texas Instruments (TI), element14 will challenge 15 community members to design a personal safety-oriented wearable device or solution that protects a person from per
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Date:
12/26/2016
Mouser now ships Cree’s high-power, high-efficacy XLamp MHB-B LEDs

Cree XLamp MHB-B LED

Mouser now ships Cree’s high-power, high-efficacy XLamp MHB-B LEDs
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the Cree XLamp MHB-B LEDs. These new high-power LEDs enable designers to more effectively deliver lower system costs for high-lumen, high-efficiency applications de
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Date:
12/26/2016
Silicon Labs’ tiny BGM12x SiP modules for Bluetooth LE now at Mouser

BGM12x Blue Gecko SiP Modules

Silicon Labs’ tiny BGM12x SiP modules for Bluetooth LE now at Mouser
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking BGM12x Blue Gecko system-in-package (SiP) modules from Silicon Labs. Based on Silicon Labs’ Blue Gecko wireless system-on-chip (SoC), the BGM12x is the in
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Date:
12/23/2016
Nordic Semiconductor to show advanced wireless solutions at CES

Nordic Semiconductor will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs at CES 2017

Nordic Semiconductor to show advanced wireless solutions at CES
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announced it will demonstrate Bluetooth low energy- (including Bluetooth 5) and IEEE 802.15.4-enabled technologies at International CES 2017.The company is also confirming details of exhibits, demonstrations, and design partner companies it will be ho
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Date:
12/23/2016
Public tender offer by TDK subsidiary EPCOS to acquire Tronics successful
TDK and Tronics Microsystems jointly announced that the all-cash public tender offer launched by TDK's wholly-owned subsidiary EPCOS was successfully closed on December 14, 2016. EPCOS, a leading manufacturer of electronic components, modules and systems based in Munich, Germany, acquired 72.38% of the outstanding sha
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Date:
12/21/2016
Vishay's hybrid solid-state relays offer fast operation, wide temp range, and high load voltage

VOR hybrid solid-state relays

Vishay's hybrid solid-state relays offer fast operation, wide temp range, and high load voltage
Vishay Intertechnology expanded its VOR family of hybrid solid-state relays with four new devices designed to deliver superior electrical characteristics for telecommunications, industrial, security system, and metering applications. Compared to similar solutions, the new Vishay Semiconductors 1 Form A VOR1121A6, VO
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Date:
12/21/2016
ON Semi to demo new rapid-charging USB-C solutions at CES

USB Type-C

ON Semi to demo new rapid-charging USB-C solutions at CES
ON Semiconductor, driving energy efficient innovations, will be showcasing its portfolio of solutions for the effective implementation of USB Type-C applications at the 2017 Consumer Electronics Show (CES) in Las Vegas. USB Type-C is the rapidly emerging default industry-standard for wired smart and rapid charging an
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Date:
12/20/2016
STMicro and Valencell to work on advanced biometric platform for wearables
Valencell, a leading innovator in performance biometric data sensor technology, and STMicroelectronics, a semiconductor leader serving customers across the spectrum of electronics applications, announced the launch of a new, highly accurate and scalable development kit for biometric wearables that includes ST’s co
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Date:
12/20/2016
Novel material with ferroelectricity and ferromagnetism may lead to better memory

Portions of the BiFeO3 lattice of cycloidal and collinear phases with only Fe ions are shown at left and right, respectively. The arrows indicate the Fe3+ moment direction. The ground state of BiFeO3 had a cycloidal spin structure, which is destabilized by substitution of Co for Fe and at higher temperatures. The spin magnetic moments compensate with each other in the left panel, but canting between neighboring spins leads to the appearance of weak ferromagnetism in the left panel.

Novel material with ferroelectricity and ferromagnetism may lead to better memory
Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors. Traditional computer memory, k
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Date:
12/20/2016
Ways to participate in the “Solar in Your Community Challenge”

Solar in Your Community Challenge

Ways to participate in the “Solar in Your Community Challenge”
The Solar in Your Community Challenge is a $5 million prize competition funded by the SunShot Initiative that aims to expand solar electricity access. Specifically, it focuses on low-and moderate-income (LMI) households and nonprofits that haven’t been able to take advantage of the booming solar market. Challenge pa
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Date:
12/19/2016
Linear's octal simultaneous-sampling SAR ADC offers 16-Bit 1.5Msps/channel performance

Octal, 16-Bit, 1.5Msps/Ch, Simultaneous Sampling, True Differential Input SAR ADC

Linear's octal simultaneous-sampling SAR ADC offers 16-Bit 1.5Msps/channel performance
Linear Technology introduced the LTC2320-16 16-bit 1.5Msps per channel, no latency successive approximation register (SAR) ADC with eight simultaneously sampling channels supporting a rail-to-rail input common mode range. The LTC2320-16 features a flexible analog front end that accepts fully differential, unipolar or
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Date:
12/19/2016
Solder-on-polyester creates cost-effective flex circuits

Solder on Polyester Substrate

Solder-on-polyester creates cost-effective flex circuits
Molex has introduced Solder on Polyester Substrate, a flexible, economical alternative to rigid PCB and polyimide. Surface Mount (SMT) components, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate. Custom designed products can be
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Date:
12/16/2016
Ambiq Micro's Apollo 2 can double battery life in wearables

Ambiq Micro's Apollo 2 can double battery life in wearables

Ambiq Micro's Apollo 2 can double battery life in wearables
Ambiq Micro, the leader in ultra-low power solutions, today released the Apollo 2 Wearables and IoT Platform. The Platform offers breakthrough power consumption of under 10µA/MHz, which allows for double the battery life in wearable devices. Apollo 2's performance will lead to longer battery life, enhanced inte
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Date:
12/16/2016
ROHM launches high-voltage Zener diode lineup

UDZLV and KDZLV series high-voltage Zener diodes

ROHM launches high-voltage Zener diode lineup
ROHM has announced the development of high-voltage Zener diodes optimized for protection and constant current applications in a variety of electronic circuits. The UDZLV and KDZLV series are comprised of 12 models in Zener voltages ranging from 51V to 150V. They are also AEC-Q101 compliant and provide superior su
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Date:
12/15/2016
PSDcast - Sani Ronen of Microsemi on enabling wireless infrastructures

Sani Ronen of Microsemi

PSDcast - Sani Ronen of Microsemi on enabling wireless infrastructures
In this PSDcast, Sani Ronen of Microsemi talks to Alix Paultre of Power Systems Design on enabling wireless infrastructures. The challenges when moving to higher bandwidths and frequencies place pressure on the related systems involved. In order to enable enterprises to migrate to these higher levels of pe
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Date:
12/14/2016
Tiny nano-power op-amp also boosts sensing accuracy

TSU111 nano-power op amp

Tiny nano-power op-amp also boosts sensing accuracy
With its tiny 1.2mm x 1.3mm outline and typical current of only 900nA, the TSU111 nano-power op-amp from STMicroelectronics helps cut the size and energy needs of analog circuits to the bare minimum in medical monitors, wearable electronics, gas detectors, pH sensors, infrared motion sensors, and payment tags.
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Date:
12/12/2016
Breakthrough reveals novel alternative to batteries
Ground-breaking research from the University of Surrey and Augmented Optics, in collaboration with the University of Bristol, has developed potentially transformational technology which could revolutionise the capabilities of appliances that have previously relied on battery power to work. This development by Augmen
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Date:
12/08/2016
Molex partners to make SoftBattery for IoT
Strengthening an expanding portfolio of printed electronics solutions, Molex has signed a worldwide license agreement to manufacture Enfucell SoftBattery power sources. With over a decade developing the patented technology, Enfucell has been a forerunner in printable battery design for the needs of healthcare, sp
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Date:
12/08/2016
Alpha and Omega launch 100V FETs for flyback SR

AO4290A and AON6220 100V MOSFETs

Alpha and Omega launch 100V FETs for flyback SR
Alpha and Omega Semiconductor, a designer, developer, and supplier of power semiconductors and power ICs, announced the release of two new products in the 100V MOSFET family, AO4290A and AON6220. These products are designed for synchronous rectification for flyback converters, used in high-speed charger and PD
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Date:
12/07/2016
Dynamic power scaling
Bruce Petipas, Analog Devices

In today’s data acquisition systems (DAQs), performance boundaries are continually being pushed.  System designers require higher speed, lower noise, and better total harmonic distortion (THD) performance; all of which are possible but none of which are free.  These performance improvements typically co
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Date:
12/07/2016
Music to my ears

The EPCOS PQSine active harmonic filter

Music to my ears
Dr. Richard Michelson, EPCOS, a TDK Company

To a non-engineer, the word “harmonics” has a beautiful sound – one that to many conjures up an image of a concert with instruments playing beautiful music. The harmony is what combines with the melody to turn the composition into something complex and beautiful rather than being just a simple tune. However, when most
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Date:
12/07/2016
STMicro's mini multi-sensor module jumpstarts IoT and wearables

SensorTile has a complete Bluetooth Low-Energy transceiver including a miniature single-chip balun on-board

STMicro's mini multi-sensor module jumpstarts IoT and wearables
STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub fo
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Date:
12/05/2016
Safety vs. performance

The creepage distance is the shortest path between two conductors along the surface of an isolator (typically a PCB)

Safety vs. performance
Srivatsa Raghunath, Infineon Technologies

When designing a switch-mode power supply (SMPS) operating losses and the ability to dissipate heat are critical selection criteria for MOSFETs. The standard TO-220 package is generally good at dissipating heat and the wide range of heatsinks and forced-air cooling options available can easily improve this. Le
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Date:
12/04/2016
Anritsu's PIM Hunter test probe can better locate external PIM sources

PIM Hunter

Anritsu's PIM Hunter test probe can better locate external PIM sources
Anritsu expands its field test portfolio with the introduction of PIM Hunter, a passive intermodulation (PIM) test probe that helps field technicians more quickly discover the precise location of external PIM sources at cell sites. Designed for use with Anritsu’s PIM Master, Spectrum Master and BTS Master ha
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Date:
12/01/2016
Molex signs distribution agreement with Bürklin Elektronik
Molex has signed a distribution agreement for their industrial product range with Bürklin Elektronik for Europe. Bürklin is a German distributor of high quality electronic components. More than 34,500 items from the Molex Industrial segment can now be ordered via Bürklin Elektronik. This will include h
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Date:
12/01/2016
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