Consumer

July 2024

Magnachip Unveils Its First 8th-Generation MXT LV MOSFET Designed with Super-Short Channel FET II

Magnachip Semiconductor Corporation announced the release of its 8th-generation 1) MXT LV MOSFET (Metal Oxide Semiconductor Field Effect Transistor) for smartphone battery protection circuits. Magnachip has introduced its proprietary Super-Short Channel FET II (SSCFET® II) technology for the f

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Date:

07/30/2024

Board-to-Board Connectors Market Size Forecast to Exceed USD 20.5 billion by 2034, Growing at a 4.5% CAGR

The global board-to-board connectors market (보드-보드 커넥터 시장) is poised to expand at a CAGR of 4.5% from 2024 to 2034. By the end of this forecast period, the market is anticipated to total US$ 20.5 billion. Board-to-board connectors play an important role in providing integration of

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Date:

07/26/2024

The Industry's First Analog-Digital Fusion Control Power Supply Solution

ROHM Semiconductor announced LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30W to 1kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. Analog controlle

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Date:

07/15/2024

Alliance Memory Expands eMMC Offering With New 5GB and 10GB 3D pSLC Solutions

Alliance Memory introduced new industrial-grade 3D pSLC embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications. Offering 30,000 program/erase cycles, the 5GB ASFC5G31P3-51BIN and 10GB ASFC10G31P3-51BIN integrate high-reliability 3D pSLC NAND fla

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Date:

07/12/2024

STMicroelectronics Reveals ST BrightSense Image Sensor Ecosystem for Advanced Camera Performance Everywhere

STMicroelectronics has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and consumer applications ensure superior camera performance by de

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Date:

07/08/2024

Penn State researchers developed a new soft and stretchable material that can be 3D-printed. The material can be used to fabricate wearable devices, such a sensor that can be worn on a finger, as shown here.

Self-Assembling, Highly Conductive Sensors Could Improve Wearable Devices

PENN STATE

To advance soft robotics, skin-integrated electronics and biomedical devices, researchers at Penn State have developed a 3D-printed material that is soft and stretchable — traits needed for matching the properties of tissues and organs — and that self-assembles. Their approach employs a process that eliminates ma

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Date:

07/02/2024