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August 2023
2200V Silicon Carbide MOSFETs Enhance Efficiency in Challenging Applications

2200V Silicon Carbide MOSFETs Enhance Efficiency in Challenging Applications

2200V Silicon Carbide MOSFETs Enhance Efficiency in Challenging Applications
­Toshiba Electronics Europe GmbH (“Toshiba”) has developed a new 2200V rated silicon carbide (SiC) MOSFET with embedded Schottky barrier diode (SBD) for use in 1500V DC applications such as photovoltaic (PV) inverters, electric vehicle (EV) chargers, high frequency DC/DC converters and energy storage systems. The
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Date:
08/30/2023

A Highly Flexible and Easy to Integrate 800V SiC Inverter

A Highly Flexible and Easy to Integrate 800V SiC Inverter

A Highly Flexible and Easy to Integrate 800V SiC Inverter
­McLaren Applied has launched IPG5-x, a highly flexible 800V Silicon Carbide (SiC) inverter that can be integrated into Electric Drive Units (EDUs). Targeting growing OEM demand for high-performing, integrated EDUs that save space and cost, the British engineering and technology pioneer has developed IPG5-x to
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Date:
08/30/2023
DC/DC Converter Eval Board for 100 W Fast Charging

Silanna’s new evaluation board will help build and test 100 W end-to-end fast charger applications built around the company’s CO2 Smart Power family.

DC/DC Converter Eval Board for 100 W Fast Charging
The SZDL3105BB-EVB02 buck converter design example is configured for a 5 V to 20V at5 A output and integrates all necessary connections to properly test and evaluate the efficiency and other performance metrics of the Silanna SZDL3105B fully-integrated DC/DC converter. A range of compatible daughter boards ensure
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Date:
08/29/2023
Rutronik introduces XLR-LV supercapacitor modules from EATON

Rutronik introduces XLR-LV supercapacitor modules from EATON

Rutronik introduces XLR-LV supercapacitor modules from EATON
­  Due to their low self-discharge and low leakage current, the modules also convince with a longer service life. Thanks to the IP65 housing and stable performance at operating temperatures between -40 °C and +85 °C, they are predestined for use in harsh environments. The supercapacitor modules, as
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Date:
08/29/2023
THERM-A-GAP GEL 50TBL excels in thin bond line applications

THERM-A-GAP GEL 50TBL excels in thin bond line applications

THERM-A-GAP GEL 50TBL excels in thin bond line applications
THERM-A-GAP GEL 50TBL is a new dispensable thermal gel that offers 5 W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05 mm, the apparent thermal conductivity exceeds 10 W/m-K. With a ‘TBL’ suffix that stands for ‘thin bond line’, the new thermal gel needs no mixing or secondary
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Date:
08/29/2023
Lightning Motorcycles accelerates into the EV racing record books

Richard Hatfield, founder and CEO of Lightning Motorcycles Corporation, which now holds the land speed record for electric motorcycles, exceeding 215mph.

Lightning Motorcycles accelerates into the EV racing record books
The San Carlos, California., company was founded in 2007, just a few streets over from another electric vehicle pioneer– Tesla. Having cut his teeth on EVs in the late 1990s on the development of an electric Porsche, Hatfield, a lifelong motorcyclist, set his sights on creating a motorcycle that leveraged
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Date:
08/29/2023
Flexible PXI/PXIe Microwave Switching Family from Pickering Interfaces Delivers Performance and Test System Optimization

Flexible PXI/PXIe Microwave Switching Family from Pickering Interfaces Delivers Performance and Test System Optimization

Flexible PXI/PXIe Microwave Switching Family from Pickering Interfaces Delivers Performance and Test System Optimization
­Pickering Interfaces announced its new 40/42-890 family of modular, flexible PXI/PXIe microwave switches, bringing highly configurable RF switching solutions up to 110GHz to the PXI platform. This new range will support the latest and most demanding RF and communications test requirements as operating freq
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Date:
08/29/2023
Guaranteed High Performance: Swissbit Launches D1200 Datacenter SSD

Guaranteed High Performance: Swissbit Launches D1200 Datacenter SSD

Guaranteed High Performance: Swissbit Launches D1200 Datacenter SSD
­Swissbit announces the launch of its latest PCIe SSD specifically designed for data center applications. The new D1200 SSD is optimized for workloads demanded by applications including databases, cloud computing, media streaming or artificial intelligence (AI). It combines outstanding performance values, reliability an
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Date:
08/29/2023
New Dielectric Material for High Voltage Capacitors

New Dielectric Material for High Voltage Capacitors

New Dielectric Material for High Voltage Capacitors
­Dean Technology is excited to introduce the Class II Y6P, a new dielectric material for high voltage ceramic capacitors. DTI’s Y6P dielectric material is a Class II ceramic capacitor dielectric that has a high dielectric constant, low dissipation factor, and excellent stability over a wide
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Date:
08/29/2023
High Current 200 V and 300 V Rad-Hard GaN Power Devices Increase Power Density for Demanding Space Applications

High Current 200 V and 300 V Rad-Hard GaN Power Devices Increase Power Density for Demanding Space Applications

High Current 200 V and 300 V Rad-Hard GaN Power Devices Increase Power Density for Demanding Space Applications
­EPC Space announces the introduction of two new rad-hard GaN transistors with ultra-low on-resistance and high current capability for high power density solutions that are lower cost and more efficient than the nearest comparable radiation-hardened silicon MOSFET. These devices come packaged in hermetic pa
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Date:
08/28/2023
New Gigabit Ethernet Switch with AVB/TSN and Integrated PHYs for Industrial Automation

New Gigabit Ethernet Switch with AVB/TSN and Integrated PHYs for Industrial Automation

New Gigabit Ethernet Switch with AVB/TSN and Integrated PHYs for Industrial Automation
­Industrial automation and digital transformation are driving market growth for scalable and standardized networking solutions to address the needs of commercial Operational Technology (OT) deployments. To provide automation manufacturers with a comprehensive networking solution, Microchip Technology announces the LAN9662 Gi
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Date:
08/22/2023
Spark Connected and Infineon Technologies Unveil 500 W Wireless Charging Module

Spark Connected and Infineon Technologies Unveil 500 W Wireless Charging Module

Spark Connected and Infineon Technologies Unveil 500 W Wireless Charging Module
­Spark Connected and Infineon Technologies AG are announcing the market release of a 500 W wireless charging solution named Yeti. The ready-to-integrate wireless charging module is intended for the powering and charging of industrial machinery, autonomous mobile robots, automated guided vehicles, light electric ve
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Date:
08/18/2023
One-Piece 2nd Generation GDBC Connectors from Gigalane for Complex Stack ups in 5G Systems now Available from Powell Electronics

One-Piece 2nd Generation GDBC Connectors from Gigalane for Complex Stack ups in 5G Systems now Available from Powell Electronics

One-Piece 2nd Generation GDBC Connectors from Gigalane for Complex Stack ups in 5G Systems now Available from Powell Electronics
­Now in stock at Powell Electronics are 2nd generation one-piece GDBC direct board contacts from Gigalane. The simple one-piece design of the components enables a high integration and miniaturization of board-to-board and board-to-module RF interconnections. GDBC series contacts are very easy to use in
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Date:
08/18/2023
Tiny Low-Power Cost-Optimized Solder-Down NXP i.MX93 Module Suits Intelligent Edge Processing

Tiny Low-Power Cost-Optimized Solder-Down NXP i.MX93 Module Suits Intelligent Edge Processing

Tiny Low-Power Cost-Optimized Solder-Down NXP i.MX93 Module Suits Intelligent Edge Processing
­Direct Insight has launched the QS93, a miniature QFN-style system-on-module (SoM) that provides a low-power, 64-bit solution for intelligent edge processing. Based on NXP’s new dual-core i.MX935 with ARM Cortex-A55 processors, plus RAM, Flash memory and power management, the QS93 measures ju
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Date:
08/18/2023
Moxa Introduces New Flagship Model of Secure Cellular Routers with All-round Data Protection

Moxa Introduces New Flagship Model of Secure Cellular Routers with All-round Data Protection

Moxa Introduces New Flagship Model of Secure Cellular Routers with All-round Data Protection
­Moxa, Inc., introduced a new flagship model to its OnCell Series of next-generation secure cellular routers, the OnCell G4302-LTE4. These advanced-level secure cellular routers have new security software that complies with IEC 62443-4-2 standards, improving performance and speeding up vulnerability fixes. Al
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Date:
08/18/2023
Würth Elektronik Introduces PFC Inductor Family

Würth Elektronik Introduces PFC Inductor Family

Würth Elektronik Introduces PFC Inductor Family
­The expansion of the WE-TORPFC inductor series, with 17 new parts, is now available from Würth Elektronik. These toroidal inductors are suitable for continuous-conduction mode (CCM) Boost converters and are capable of producing up to several kW of power. Unlike traditional bobbin-wound power factor co
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Date:
08/18/2023
KYOCERA AVX Releases New SCM Series Series-Connected Supercapacitor Modules

KYOCERA AVX Releases New SCM Series Series-Connected Supercapacitor Modules

KYOCERA AVX Releases New SCM Series Series-Connected Supercapacitor Modules
­KYOCERA AVX released the new SCM Series double-layer, series-connected electrochemical supercapacitor modules.  The new SCM Series series-connected supercapacitor modules can be used by themselves or in conjunction with primary or secondary batteries to extend battery life and backup ti
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Date:
08/16/2023
Littelfuse Launches World's Smallest Subminiature Flange Mount Reed Sensors for Various Applications

Littelfuse Launches World's Smallest Subminiature Flange Mount Reed Sensors for Various Applications

Littelfuse Launches World's Smallest Subminiature Flange Mount Reed Sensors for Various Applications
­Littelfuse, Inc. announced the release of its newest products, the 59155 and 59156, which are the world’s smallest subminiature flange mount reed sensors. The sensors' design provides compact size, contactless activation, and customization options, making them suitable for  a wide range of tight-spacing app
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Date:
08/15/2023
Infineon Introduces new Automotive 60 V and 120 V OptiMOS 5 in TOLx Packages for 24 V-72 V Supplied High Power ECUs

Infineon is expanding its OptiMOS 5 automotive MOSFET lineup to address the growing demand for ECUs in the electrification of transportation, offering new products with compact size, excellent thermal performance, and superior switching capabilities.

Infineon Introduces new Automotive 60 V and 120 V OptiMOS 5 in TOLx Packages for 24 V-72 V Supplied High Power ECUs
­The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in th
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Date:
08/15/2023
High-Efficiency DC/DC Converter Evaluation Board for 100 W Fast Charger Designs

High-Efficiency DC/DC Converter Evaluation Board for 100 W Fast Charger Designs

High-Efficiency DC/DC Converter Evaluation Board for 100 W Fast Charger Designs
­Silanna Semiconductor has announced an evaluation board that will help engineers to quickly build and test 100 W end-to-end fast charger applications built around the company’s CO2 Smart Power family of wide-voltage, high-frequency point of load converters.  The SZDL3105BB-EVB02 buck converter d
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Date:
08/10/2023
Automotive 60 V and 120 V OptiMOS 5 in TOLx Packages for 24 V-72 V Supplied High Power ECUs

Infineon is expanding its OptiMOS 5 automotive MOSFET lineup to address the growing demand for ECUs in the electrification of transportation, offering new products with compact size, excellent thermal performance, and superior switching capabilities.

Automotive 60 V and 120 V OptiMOS 5 in TOLx Packages for 24 V-72 V Supplied High Power ECUs
­The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in th
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Date:
08/10/2023
Bourns Adds 12 New High Current Model Series to its Shielded Power Inductor Line

Bourns adds 12 new model series to its shielded power inductor portfolio

Bourns Adds 12 New High Current Model Series to its Shielded Power Inductor Line
­Bourns, Inc., announced the addition of 12 new high current model series to its shielded power inductor line. The Bourns power inductors are manufactured to provide engineers with distinct design advantages through either a carbonyl powder core or a metal alloy powder core, shielded construction to provide hi
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Date:
08/10/2023
SEGGER Releases the Flasher Hub-12 High-Speed ISP Gang-Programmer with Integrated USB Connectivity

SEGGER Releases the Flasher Hub-12 High-Speed ISP Gang-Programmer with Integrated USB Connectivity

SEGGER Releases the Flasher Hub-12 High-Speed ISP Gang-Programmer with Integrated USB Connectivity
­The Flasher Hub-12 is SEGGER’s streamlined solution for high-volume, high-speed gang programming, with USB connectivity integrated into the new housing. Flasher Hub-12 controls up to 12 Flasher Compact devices so that they program simultaneously. Each channel can be configured to progra
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Date:
08/09/2023
Bourns Introduces High Voltage 2-Electrode GDT Series Designed for IEC 62368-1 Compliant Equipment and Powerline Protection

Bourns Model GDT28H GDT Series

Bourns Introduces High Voltage 2-Electrode GDT Series Designed for IEC 62368-1 Compliant Equipment and Powerline Protection
­Bourns, Inc., announced an addition to its next-generation gas discharge tube (GDT) product line with the introduction of a high voltage 2-electrode overvoltage protector family. The Bourns® Model GDT28H Series is designed to meet the protection requirements of today's powerline equipment for gen
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Date:
08/09/2023
TDK Offers New Ultra-Compact Snap-In Capacitor Series with Extremely High Capacitance Density

TDK offers new ultra-compact snap-in capacitor series with extremely high capacitance density

TDK Offers New Ultra-Compact Snap-In Capacitor Series with Extremely High Capacitance Density
­TDK Corporation presents the new EPCOS B43657 aluminum electrolytic capacitor series with snap-in terminals. The capacitors achieve a service life of at least 2000 h at a maximum operating temperature of 105°C and cover a rated voltage range from 450 V DC to 475 V DC with capacitance va
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Date:
08/08/2023
Eaton Delivers 9PX Lithium-ion UPS in new 6 kVA Power Rating with Remote Firmware Upgrades and

Eaton Delivers 9PX Lithium-ion UPS in new 6 kVA Power Rating with Remote Firmware Upgrades and "Set-it-and-forget-it" Deployment

Eaton Delivers 9PX Lithium-ion UPS in new 6 kVA Power Rating with Remote Firmware Upgrades and "Set-it-and-forget-it" Deployment
­Intelligent power management company Eaton announced that its 9PX lithium-ion uninterruptible power supply (UPS) is now available in a 6 kVA power rating. Responding to customer demand, the latest model incorporates the same innovative capabilities of existing 9PX lithium-ion UPS models – including li
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Date:
08/07/2023
Littelfuse Unveils SZSMF4L Automotive Grade 400-Watt TVS Diodes in Surface Mount Package

Littelfuse Unveils SZSMF4L Automotive Grade
400-Watt TVS Diodes in Surface Mount Package

Littelfuse Unveils SZSMF4L Automotive Grade 400-Watt TVS Diodes in Surface Mount Package
­Littelfuse, Inc. announced the release of its new SZSMF4L 400 W TVS Diode Series. As automotive electronics continue increasing in volume and sophistication, all these components require protection from high voltage, high energy transients.  The SZSMF4L TVS Diodes protect these sensitive systems with fast
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Date:
08/07/2023
MCU Embedded Power IC-Families with CAN FD Interface Provide Faster Communication and Higher Performance

Infineon Technologies introduces the TLE988x and TLE989x families. These system-on-chip solutions with integrated gate driver, microcontroller, communication interface and power supply are suitable for automotive brushed DC and brushless DC motor control applications.

MCU Embedded Power IC-Families with CAN FD Interface Provide Faster Communication and Higher Performance
­Infineon Technologies AG introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX MCU embedded power ICs. By integrating a gate driver, microcontroller, communication interface and power supply on a single chip, Infineon’s system-on-chip solutions ac
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Date:
08/07/2023
Mouser Expands Range of Wireless Connectivity Products

Mouser Expands Range of Wireless Connectivity Products

Mouser Expands Range of Wireless Connectivity Products
­Mouser Electronics, Inc., continues to expand its portfolio of wireless connectivity products. Wireless connectivity underpins many technologies in our daily lives, from robust and precise automotive positioning to enabling satellite based IoT connectivity for geographically remote assets. Without the provi
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Date:
08/07/2023
GaN Integrated Power ICs Deliver High-Speed, High-Efficiency Power in 40% Smaller Size

New gallium nitride (GaN) integrated power ICs deliver high-speed, high-efficiency power in 40% smaller size than best-in-class, legacy silicon solutions for power-hungry AI and Edge computing.

GaN Integrated Power ICs Deliver High-Speed, High-Efficiency Power in 40% Smaller Size
­Navitas Semiconductor, the only pure-play, next-generation power semiconductor company, announced that its CRPS185 3,200 W “Titanium Plus” server reference design not only surpasses the stringent 80Plus Titanium efficiency requirements, but also effectively satisfies the increasing power demands of AI da
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Date:
08/03/2023
SEGGER Embedded Studio now Freely Available to SemiDrive Customers

SEGGER Embedded Studio now Freely Available to SemiDrive Customers

SEGGER Embedded Studio now Freely Available to SemiDrive Customers
­SemiDrive is a leading automotive chip company in China. SemiDrive’s products are installed in a range of vehicles covering over 90% of auto manufacturers in China. SEGGER Microcontroller, now in its fourth decade in the embedded system industry, is the developer of Embedded Studio, which is a prof
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Date:
08/03/2023
Solitron Devices Expands JFET Product Line

Solitron Devices Expands JFET Product Line

Solitron Devices Expands JFET Product Line
­Solitron Devices is pleased to announce a substantial expansion of the Junction Field-Effect Transistor (JFET) portfolio of products. Expanding on the existing JANTXV qualified product line, Solitron has added 16 new N channel devices offered with COTS and hi reliability screening options. Packaged in hermet
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Date:
08/03/2023
Renesas Embraces Microsoft Visual Studio Code Across Its Entire Industry-Leading MCU and MPU Lineup

Renesas Embraces Microsoft Visual Studio Code Across Its Entire Industry-Leading MCU and MPU Lineup

Renesas Embraces Microsoft Visual Studio Code Across Its Entire Industry-Leading MCU and MPU Lineup
­Renesas Electronics Corporation announced that customers can now use Microsoft® Visual Studio Code (VS Code) to program the complete line of Renesas microcontrollers (MCUs) and microprocessors (MPUs). Renesas has added tool extensions for all of its embedded processors to the Microsoft VS Code we
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Date:
08/01/2023
Advantest Rolls Out Thermal Control Products for MPT3000 Solid-State Drive Test Platform

Advantest Rolls Out Thermal Control Products for MPT3000 Solid-State Drive Test Platform

Advantest Rolls Out Thermal Control Products for MPT3000 Solid-State Drive Test Platform
­Leading semiconductor test equipment supplier Advantest Corporation announced two new additions to its MPT3000 solid-state drive (SSD) test platform. The Independent Thermal Control (ITC) device interface boards (DIBs) and Engineering Thermal Chamber (ETC) target early engineering adoption of the MPT3000 by en
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Date:
08/01/2023
Infineon Uses Recyclable PCBs from Jiva Materials to Minimize Electronic Waste and Carbon Footprint

Soluboard’s plant-based PCB material is made from natural fibers, which have a much lower carbon footprint than the traditional glass-based fibers. The organic structure is enclosed in a non-toxic polymer that dissolves when immersed in hot water, leaving only compostable organic material.

Infineon Uses Recyclable PCBs from Jiva Materials to Minimize Electronic Waste and Carbon Footprint
­With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing the carbon footprint and promoting sustainability are therefore key to achieving climate goals and improving environmental protection. This is wh
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Date:
08/01/2023
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