Product News

February 2023

COSEL Adds High Power Density 700W Unit to Robust and Reliable 3

COSEL Adds High Power Density 700W Unit to Robust and Reliable 3"x5" GHA Series Power Supplies

COSEL Adds High Power Density 700W Unit to Robust and Reliable 3"x5" GHA Series Power Supplies

COSEL Co, Ltd announced the introduction of its new open-frame high power density, 700W, 3x5 inch power supply optimized for efficient cooling for use in demanding medical and industrial applications. Based on the robust platform with optimized thermal conduction, the GHA700F delivers 700W within a

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Date:

02/28/2023

Payment Solution for Ultra-Small Devices Enables NFC Wireless Charging

Payment Solution for Ultra-Small Devices Enables NFC Wireless Charging

Payment Solution for Ultra-Small Devices Enables NFC Wireless Charging

Smart wearables and IoT devices are becoming increasingly popular for a variety of applications as they offer more functionality despite severe space and power constraints. By adding NFC capabilities to wearables, they can be used to pay in stores or gain access to public transportation and office buildings. SE

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Date:

02/27/2023

STMicroelectronics Grows ST-ONE Controller Family for USB Power Delivery Applications up to 140W

STMicroelectronics grows ST-ONE controller family for USB Power Delivery applications up to 140W

STMicroelectronics Grows ST-ONE Controller Family for USB Power Delivery Applications up to 140W

STMicroelectronics has introduced the ST-ONEHP integrated digital controller, the world’s first IC certified by USB-IF according to the USB Power Delivery Extended Power Range (USB PD 3.1 EPR) specification. As the third controller in the ST-ONE family, the ST-ONEHP has 28V output capabilit

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Date:

02/27/2023

Vanguard Announces New Common Mode Choke Inductor

Vanguard Announces New Common Mode Choke Inductor

Vanguard Announces New Common Mode Choke Inductor

Vanguard Electronics, under the iNRCORE Family of Brands, is pleased to announce its new XTCMN5 Series Common Mode Choke Inductors, the latest addition to Vanguard’s growing High Temperature product line. The XTCMN5 Series Common Mode Choke Inductors have been designed to operate in extreme environme

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Date:

02/27/2023

i-ToF Imager Enables Smallest 3D Camera Systems with Improved Quantum Efficiency at Optimized Cost

i-ToF Imager Enables Smallest 3D Camera Systems with Improved Quantum Efficiency at Optimized Cost

i-ToF Imager Enables Smallest 3D Camera Systems with Improved Quantum Efficiency at Optimized Cost

Infineon Technologies AG introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family. The implementation of Infineon's advanced pixel technology enables the pixels to achieve a quantum efficiency of 30 perc

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Date:

02/25/2023

STMicroelectronics Reveals Ultra-Compact, Low-Power, NB-IoT Industrial Modules with GNSS Geo-Location Capability

STMicroelectronics Reveals Ultra-Compact, Low-Power, NB-IoT Industrial Modules with GNSS Geo-Location Capability

STMicroelectronics Reveals Ultra-Compact, Low-Power, NB-IoT Industrial Modules with GNSS Geo-Location Capability

STMicroelectronics’ ST87M01 ultra-compact and low-power modules combine highly reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. The fully programmable, certified LTE Cat NB2 NB-IoT industrial modules cover worldwide ce

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Date:

02/23/2023

Ultra-Low-Power Bi-Directional Wireless Mesh Network Modules from NeoCortec Available Through Endrich

Cato Skibsted Fagermo, Business Development Manager at NeoCortec

Ultra-Low-Power Bi-Directional Wireless Mesh Network Modules from NeoCortec Available Through Endrich

NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has signed a new distribution agreement with service-oriented special distributor, Endrich Bauelemente Vetriebs GmbH. The new agreement enables Endrich to promote worldwide NeoCortec’s NeoMesh wireless mesh network modules to

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Date:

02/23/2023

Infineon Presents User-Friendly LCC Design Tool, Enabling Highly Efficient LED Driver Design

Infineon presents user-friendly LCC design tool, enabling highly efficient LED driver design

Infineon Presents User-Friendly LCC Design Tool, Enabling Highly Efficient LED Driver Design

Lighting accounts for a significant portion of the world’s total electricity consumption, emphasizing the importance of energy-efficient solutions in this sector. Power factor correction (PFC) plus LCC resonant topology for constant current output has proven to offer outstanding efficiency combined with a

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Date:

02/23/2023

Mersen Introduces MDC Series DC Distribution Fuses

Mersen Introduces MDC Series DC Distribution Fuses

Mersen Introduces MDC Series DC Distribution Fuses

Mersen announces its latest innovative product series, MDC DC distribution fuses. With the evolution of DC distribution and new technologies on the horizon, Mersen’s MDC DC Distribution fuses help customers achieve ultimate protection for today and tomorrow and let system integrators and OEM manufacturers easily&nb

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Date:

02/23/2023

CUI Devices Adds New DIN Rail Options to Terminal Blocks Product Line

CUI Devices Adds New DIN Rail Options to Terminal Blocks Product Line

CUI Devices Adds New DIN Rail Options to Terminal Blocks Product Line

CUI Devices’ Interconnect Group announced the expansion of its line of terminal blocks with the addition of new DIN rail terminal block models. The TBDR family offers push-in spring or end cap connector types with feed through or ground type styles. These DIN rail terminal blocks are available in single-level or

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Date:

02/21/2023

Infineon's XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development

Infineon's XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development

Infineon's XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development

Mouser Electronics, Inc., is now stocking the XENSIV KIT CSK PASCO2 and XENSIV KIT CSK BGT60TR13C connected sensor kits (CSK) from Infineon Technologies AG. The XENSIV connected sensor kits provide a ready-to-use sensor development platform for IoT devices. The CSK platform enables the creation of new prototype id

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Date:

02/20/2023

Murata Introduces Next-Generation LTE M/NB-IoT Module Solution

Akira Sasaki, General Manager of Connectivity Module Marketing, Murata

Murata Introduces Next-Generation LTE M/NB-IoT Module Solution

Murata announced its second generation LTE-M/NB-IoT module, the Type2GD. Featuring recently announced ALT1350 chipset from Sony Semiconductor Israel (Sony), it is the first solution on the market that offers ultra-low power and multiple LPWA communication protocols including non-terrestrial networks (NTN) sat

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Date:

02/17/2023

Eaton Delivers Reliable, Flexible Power Protection for Connected Devices in Industrial Environments

Eaton delivers reliable, flexible power protection for connected devices in industrial environments

Eaton Delivers Reliable, Flexible Power Protection for Connected Devices in Industrial Environments

Power management company Eaton announced its latest innovation in industrial backup power with the North American launch of its DIN rail industrial uninterruptible power supply (UPS). Built to withstand the demanding physical conditions and extreme temperatures of harsh environments, the new UPS offers reliable ba

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Date:

02/17/2023

Infineon's Latest SLC38 Security Device and TrustSEC's Operating System BIO-SLCOS Provide Secured, Open Platform for Advanced Smart Card Applications

Infineon's Latest SLC38 Security Device and TrustSEC's Operating System BIO-SLCOS Provide Secured, Open Platform for Advanced Smart Card Applications

Infineon's Latest SLC38 Security Device and TrustSEC's Operating System BIO-SLCOS Provide Secured, Open Platform for Advanced Smart Card Applications

In cooperation with Infineon Technologies AG, TrustSEC has launched its new advanced smart cards operating system (OS) BIO-SLCOS. The OS uses Infineon's latest high-performance SLC38 Secure Element to provide a secured and open platform that combines the best in security, flexibility, and hardware independence to

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Date:

02/17/2023

Acopian Launches

Acopian Launches "Infinity" High Power Linear Rack & Benchtop Power Supplies

Acopian Launches "Infinity" High Power Linear Rack & Benchtop Power Supplies

Acopian launched their high power linear Infinity Rack and Benchtop power supplies rated up to 1200W. DC single/nominal output voltages range from 3.3VDC to 150VDC and up to 150A (1200W). All voltages are available in 2U, 3U and 4U high configurations. These linear power supplies are highly configurab

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Date:

02/17/2023

TDK Expands the Tronics AXO 300 Series With Two Types of High-Performance Digital MEMS Accelerometer Sensors

TDK Expands the Tronics AXO 300 Series With Two Types of High-Performance Digital MEMS Accelerometer Sensors

TDK Expands the Tronics AXO 300 Series With Two Types of High-Performance Digital MEMS Accelerometer Sensors

TDK Corporation announces the extension of Tronics AXO®300 accelerometers platform with two new products. After the successful production launch in 2020 of the ±14 g AXO315 accelerometer for high-performance navigation and positioning of dynamic systems, Tronics extends the AXO300 accelerometer se

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Date:

02/15/2023

GMS launches new 8-slot DominATR 3U OpenVPX chassis series

The X9 Venom family of 3U OpenVPX products, including this DominATR chassis, are SOSA (Sensor Open Standard Architecture) aligned and
ready to meet the C4ISR/Electronic Warfare Modular Open Suite of Standards (CMOSS) requirements of U.S. military programs and
platform upgrades

GMS launches new 8-slot DominATR 3U OpenVPX chassis series

General Micro Systems (GMS) launched its 8-slot DominATR™ 3U OpenVPX chassis to support U.S military and commercial applications. As part of the GMS X9 Venom product family, this chassis’ revolutionary architecture and lightweight materials offer improved performance, reliability and operating ra

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Date:

02/14/2023

STMicroelectronics Introduces Highly Integrated 32-Channel Ultrasound Transmitter Optimized for Handheld Scanners

STMicroelectronics Introduces Highly Integrated 32-Channel Ultrasound Transmitter Optimized for Handheld Scanners

STMicroelectronics Introduces Highly Integrated 32-Channel Ultrasound Transmitter Optimized for Handheld Scanners

STMicroelectronics has expanded its family of advanced ultrasound transmitters by adding a 32-channel variant with high output current for portable applications. The new transmitter, STHVUP32, provides ±800mA aimed at portable systems that demand extra drive capability for a coaxial cable-mounted probe. Joining the portf

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Date:

02/14/2023

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

Alliance Memory announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package. Providing the company's customers with a higher-density option for a wide range of applications, the AS4C1G16D4-062BCN delivers improved performance over previous-generation DDR

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Date:

02/14/2023

Navitas Fast Charges Global Launch of The OnePlus 11 5G

Navitas Fast Charges Global Launch of The OnePlus 11 5G

Navitas Fast Charges Global Launch of The OnePlus 11 5G

Navitas Semiconductor has confirmed that its GaNFast technology fast-charges the newly-released OnePlus 11 5G flagship smartphone. Powered by a Qualcomm Snapdragon 8 Gen 2 chipset, the flagship OnePlus 11 5G combines a modern, elegant design with effortless imaging supported by the 3rd Generation Hasselbla

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Date:

02/13/2023

Eighth-Brick DC-DC Provides 240 W From a Wide Input Range

Eighth-Brick DC-DC Provides 240 W From a Wide Input Range

Eighth-Brick DC-DC Provides 240 W From a Wide Input Range

Flex Power Modules has extended its PKB-D series of isolated eighth-brick DC-DC converters with the launch of the PKB5213D, featuring a wide 18-60 V input range to include 24 V and 48 V nominal inputs, and a fully regulated 12 V output rated at 20 A/240 W. The part’s Isolation is 2250 VDC input to

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Date:

02/09/2023

Space-saving Solution for Circuit Isolation

Würth Elektronik introduces its WL-OCPT dual-channel optocoupler phototransistor

Space-saving Solution for Circuit Isolation

Würth Elektronik has expanded its WL-OCPT optocoupler product family with the DIP-8 design. Two-channel optocoupler phototransistors with eight pins are now available. This design contains two circuits inside a single component constructed from two input LEDs and two output phototransistors, therefore two se

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Date:

02/09/2023

Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

Infineon QDPAK and DDPAK Top-Side Cooling Packages Registered as JEDEC Standard for High-Power Applications

The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies AG announced it has successfully registered its QDPAK and DDPAK to

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Date:

02/09/2023

Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability

Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability

Compact Snap-In Aluminum Electrolytic Capacitors with 85% Increased Ripple Current Capability

TDK Corporation presents its new EPCOS B43652* series of snap-in aluminum electrolytic capacitors that are characterized by very compact dimensions and very high ripple current-carrying capacity. The RoHS-compatible capacitors are designed for a maximum rated voltage of 450 V DC and cover a capacitance ra

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Date:

02/09/2023

Sfera Labs Extends Family of Pi-Based Edge Computing Servers with Strato Pi CM v3 and Strato Pi CM Duo v3

Sfera Labs Extends Family of Pi-Based Edge Computing Servers with Strato Pi CM v3 and Strato Pi CM Duo v3

Sfera Labs Extends Family of Pi-Based Edge Computing Servers with Strato Pi CM v3 and Strato Pi CM Duo v3

Sfera Labs has expanded its Strato Pi CM family of compact Raspberry Pi-based Compute Module (CM) servers with two new models that provide support for the new Raspberry Pi Compute Module 4S (CM4S) alongside other performance improvements. The Strato Pi CM v3 and Strato Pi CM Duo v3 are ideally suited to industrial an

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Date:

02/08/2023

Compact Intelligent (Smart) Low Side Switches: Reduced Power Loss and Safer Operation

Compact Intelligent (Smart) Low Side Switches: Reduced Power Loss and Safer Operation

Compact Intelligent (Smart) Low Side Switches: Reduced Power Loss and Safer Operation

ROHM Semiconductor announced a new generation of single- and dual-channel 40 V intelligent (smart) low side switches, the BV1LExxxEFJ-C and BM2LExxxFJ-C series. The two product families are ideally designed for automotive and industrial applications. They are AEC-Q100 qualified and ar

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Date:

02/08/2023

Harwin Showcases Performance-Enhanced, Cost-Effective Industrial Connectors

Harwin Showcases Performance-Enhanced, Cost-Effective Industrial Connectors

Harwin Showcases Performance-Enhanced, Cost-Effective Industrial Connectors

Harwin's high density board-to-board connectors are intended for use in challenging industrial applications, providing assured long-term operation. The BBi portfolio includes components for drives and controls, edge-based computing hardware, automation systems, robotics, instrumentation and monitoring equipment, IIo

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Date:

02/06/2023

Integrated Flyback Controller with Advanced Features Boosts LED Lighting Performance

Integrated Flyback Controller with Advanced Features Boosts LED Lighting Performance

Integrated Flyback Controller with Advanced Features Boosts LED Lighting Performance

STMicroelectronics’ HVLED101 90-400V flyback controller for LED-lighting applications up to 180W enhances performance and simplifies design through extensive feature integration, patented control techniques, and support for primary-sensing regulation. Joining ST’s HVLED family of high-power-factor controlle

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Date:

02/06/2023

Advanced Energy Introduces Ultra-Miniature, Programmable High Voltage Precision DC-DC Converters

Advanced Energy Introduces Ultra-Miniature, Programmable High Voltage Precision DC-DC Converters

Advanced Energy Introduces Ultra-Miniature, Programmable High Voltage Precision DC-DC Converters

Advanced Energy Industries, Inc., introduced a new series of ultra-miniature isolated single and dual-output high voltage DC-DC converters. The Advanced Energy UltraVolt© AEQ series optimizes power conversion in a wide range of medical, life science, industrial and semiconductor equipment applications. Devices in the AE

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Date:

02/03/2023

Single-Chip Antenna-Matching ICs for Easier, Faster Design with Bluetooth LE SoCs and STM32 Wireless Microcontrollers

Single-Chip Antenna-Matching ICs for Easier, Faster Design with Bluetooth LE SoCs and STM32 Wireless Microcontrollers

Single-Chip Antenna-Matching ICs for Easier, Faster Design with Bluetooth LE SoCs and STM32 Wireless Microcontrollers

STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers. The MLPF-NRG-01D3 for BlueNRG-LPS and MLPF-WB-02D3 for STM32WB integrate the compl

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Date:

02/02/2023

Automotive-Qualified Supercapacitors are Tested and Qualified to the Stringent AEC-Q200 Standard

Automotive-Qualified Supercapacitors are Tested and Qualified to the Stringent AEC-Q200 Standard

Automotive-Qualified Supercapacitors are Tested and Qualified to the Stringent AEC-Q200 Standard

KYOCERA AVX is proud to announce its first automotive-qualified supercapacitors, which are also known as cylindrical, electrochemical, double-layer capacitors. The five new automotive-qualified SCC Series supercapacitors are tested and qualified to the stringent AEC-Q200 standard, which pro

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Date:

02/02/2023

Elma Adds to Comprehensive Line of SOSA Aligned Backplanes That Enable Complex, High Speed Signal Processing in Rugged Applications

Elma Adds to Comprehensive Line of SOSA Aligned Backplanes That Enable Complex, High Speed Signal Processing in Rugged Applications

Elma Adds to Comprehensive Line of SOSA Aligned Backplanes That Enable Complex, High Speed Signal Processing in Rugged Applications

Elma Electronic has now added six additional high-speed backplanes that align with The Open Group Sensor Open Systems Architecture (SOSA) Technical Standard 1.0 and incorporate the latest optical fiber and RF connectivity. With 2-, 4- and 6-slot options, the expanded 3U OpenVPX series of backplanes provides de

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Date:

02/02/2023

World's First 64 Gbps Fully Integrated Loopback Solution for High-Speed Data Connectivity

Block diagram of the Menlo Micro 5620 (Graphic: Business Wire)

World's First 64 Gbps Fully Integrated Loopback Solution for High-Speed Data Connectivity

Menlo Microsystems, Inc. (Menlo Micro), introduced a new dual double-pole/triple-throw (2x DP3T) switch. The MM5620 switch provides the highest performance and data rates for high-speed differential data applications. It offers unprecedented levels of parallel testing on space-constrained final test and probe tes

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Date:

02/01/2023

Current Transducer with Large Aperture for Automotive (EV) Test Benches & Battery Testing

Current Transducer with Large Aperture for Automotive (EV) Test Benches & Battery Testing

Current Transducer with Large Aperture for Automotive (EV) Test Benches & Battery Testing

Danisense announced the release of its latest current transducer mainly aimed for automotive (EV) test benches and battery testing & evaluation systems. Featuring a very large aperture of 41.2mm, the DN1000ID current transducer enables power cables with large power connectors to be easily fi

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Date:

02/01/2023

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