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Product News

June 2025
New Off-the-Shelf Radiation-Hardened 15W DC-DC Power Converter for Space Applications

New Off-the-Shelf Radiation-Hardened 15W DC-DC Power Converter for Space Applications

New Off-the-Shelf Radiation-Hardened 15W DC-DC Power Converter for Space Applications
­Traditional space applications have long required space-grade components to help ensure the success of missions. With over 60 years of space heritage, Microchip Technology continues to broaden its space portfolio and today announces the SA15-28 off-the-shelf radiation-hardened DC-DC 15W power converter wi
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Date:
06/27/2025
Bosch Boosts Ecosystem Around BMV080 Particulate Matter Sensor

Bosch Boosts Ecosystem Around BMV080 Particulate Matter Sensor

Bosch Boosts Ecosystem Around BMV080 Particulate Matter Sensor
­In today’s fast-paced development landscape, having the right tools can mean the difference between months of delay and a rapid product launch. Bosch Sensortec is now spotlighting the rapid evolution of its developer ecosystem, as new tools and platforms launch to support the integration of the BMV080 — th
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Date:
06/25/2025
KYOCERA AVX Releases Robust new Series of Vertical-Mating Battery Connectors

KYOCERA AVX Releases Robust new Series of Vertical-Mating Battery Connectors

KYOCERA AVX Releases Robust new Series of Vertical-Mating Battery Connectors
­KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2.5mm-pitch vertical-mate ba
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Date:
06/25/2025
TDK Launches a High-Temperature, Closed-Loop MEMS Accelerometer for Energy Market Applications

TDK Launches a High-Temperature, Closed-Loop MEMS Accelerometer for Energy Market Applications

TDK Launches a High-Temperature, Closed-Loop MEMS Accelerometer for Energy Market Applications
­TDK Corporation has expanded its MEMS inertial sensors portfolio with the Tronics AXO315®T0, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications in the energy market.   Leveraging TDK’s unique closed-lo
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Date:
06/25/2025
Morse Micro Wi-Fi HaLow Technology Receives Matter Certification

Michael De Nil, co-founder and CEO of Morse Micro

Morse Micro Wi-Fi HaLow Technology Receives Matter Certification
­Morse Micro, the world’s leading provider of Wi-Fi HaLow chips, today announced that its MM6108-EKH05-Light developer platform has received Matter certification from the Connectivity Standards Alliance (CSA). This certification marks a significant milestone for Wi-Fi HaLow technology, de
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Date:
06/25/2025
STMicroelectronics’ new High-Current, Low-Voltage Switching Regulators Handle Challenging Automotive Loads

STMicroelectronics’ new High-Current, Low-Voltage Switching Regulators Handle Challenging Automotive Loads

STMicroelectronics’ new High-Current, Low-Voltage Switching Regulators Handle Challenging Automotive Loads
­STMicroelectronics’ DCP0606Y automotive step-down converters let designers build extremely compact and efficient step-down power supplies to deliver 6A maximum output current at a voltage as low as 0.6V. The converters are conceived for applications such as telematics, heads-up displays, infotainm
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Date:
06/25/2025
Mersen's Class RK1 Reducer Fuse Series with Expanded Ratings

Mersen's Class RK1 Reducer Fuse Series with Expanded Ratings

Mersen's Class RK1 Reducer Fuse Series with Expanded Ratings
­Global Electrical Power and Advanced Materials leader Mersen is pleased to announce the expansion of the 600V ratings to its first-to-market Class RK1 Reducer Fuse product series. The newly released 600V ratings provide a permanent and reliable solution and are designed to be used in all applications where st
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Date:
06/25/2025
Red Pitaya & Texas Instruments Team up to Launch Next-Gen STEMlab Boards for High-Performance Data Acquisition

Red Pitaya & Texas Instruments Team up to Launch Next-Gen STEMlab Boards for High-Performance Data Acquisition

Red Pitaya & Texas Instruments Team up to Launch Next-Gen STEMlab Boards for High-Performance Data Acquisition
­Red Pitaya, a multi-award-winning leader in providing compact, open-source, high-speed signal acquisition and processing boards and services, has announced a new board co-developed with Texas Instruments, a global semiconductor company known for its precision analog and embedded processing technologies.  The new STEMl
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Date:
06/24/2025
STMicroelectronics Extends ISO 26262 Compliant Automotive Family with 8-Channel Low-Side Driver in Space-Saving Leadless Package

STMicroelectronics Extends ISO 26262 Compliant Automotive Family with 8-Channel Low-Side Driver in Space-Saving Leadless Package

STMicroelectronics Extends ISO 26262 Compliant Automotive Family with 8-Channel Low-Side Driver in Space-Saving Leadless Package
­STMicroelectronics’ L9800 8-channel automotive low-side driver is ISO 26262 compliant and housed in a compact, leadless outline that saves space in body-control modules, HVAC and climate controls, and power-domain controls. The L9800 outputs can drive resistive, capacitive, or inductive loads like rela
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Date:
06/23/2025
Silanna Semiconductor SL2002 Laser Driver ICs Enable Smaller, More-Efficient Rangefinders That Run Off 3 V Coin Cell Batteries

Silanna Semiconductor SL2002 Laser Driver ICs Enable Smaller, More-Efficient Rangefinders That Run Off 3 V Coin Cell Batteries

Silanna Semiconductor SL2002 Laser Driver ICs Enable Smaller, More-Efficient Rangefinders That Run Off 3 V Coin Cell Batteries
­Silanna Semiconductor, a global leader in analog innovation, today announced the release of the SL2002, the second breakthrough product in its FirePower™ family of laser driver ICs.  The SL2002 has been optimized for low-voltage operation in small-form-factor systems, enabling powerful laser perfo
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Date:
06/20/2025
STMicroelectronics Launches Feature-Rich, Radiation-Hardened Point-of-Load Converters for Low Earth Orbit Applications

STMicroelectronics Launches Feature-Rich, Radiation-Hardened Point-of-Load Converters for Low Earth Orbit Applications

STMicroelectronics Launches Feature-Rich, Radiation-Hardened Point-of-Load Converters for Low Earth Orbit Applications
­STMicroelectronics’ LEOPOL1 point-of-load step-down converter for Low Earth Orbit (LEO) deployments meets the needs of equipment developers targeting the New Space market, now expanding throughout North America, Asia, and Europe. The emerging New Space industry, driven by private-sector companies, is enabli
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Date:
06/19/2025
Toshiba Introduces 2-Channel Automotive High-Speed Digital Isolators

Toshiba Introduces 2-Channel Automotive High-Speed Digital Isolators

Toshiba Introduces 2-Channel Automotive High-Speed Digital Isolators
­Toshiba Electronics Europe GmbH (“Toshiba”) extends its lineup of isolation devices with four AEC-Q100 qualified, 2-channel, high-speed digital isolators. The new DCM32xx00 series supports stable operation with high common-mode transient immunity (CMTI) of 100kV/µs (typ.) at data transmission rates of
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Date:
06/19/2025
X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient single-photon avalanche diode (SPAD) implementations, this new isolation class enables tighter fun
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Date:
06/19/2025
Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging that Meets Power Demands in AI Servers

Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging that Meets Power Demands in AI Servers

Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging that Meets Power Demands in AI Servers
­Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3x3.3 Source-Down packaging technology.  De
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Date:
06/18/2025
SEGGER’s J-Trace PRO Offers Turnkey Instruction Tracing for ST’s High-Performance STM32N6 Microcontrollers with AI Acceleration

SEGGER’s J-Trace PRO Offers Turnkey Instruction Tracing for ST’s High-Performance STM32N6 Microcontrollers with AI Acceleration

SEGGER’s J-Trace PRO Offers Turnkey Instruction Tracing for ST’s High-Performance STM32N6 Microcontrollers with AI Acceleration
­The STM32N6 series contains an embedded proprietary neural processing unit, multiple graphics accelerators, a computer vision pipeline, and a multimedia encoder and decoder. J-Trace PRO is SEGGER’s streaming trace probe that is capable of capturing full traces over long periods, allowing for recording of hard-t
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Date:
06/18/2025
TDK Introduces Automotive Power-Over-Coax Inductor for Filters with Industry-Leading Simplicity and Efficiency

TDK Introduces Automotive Power-Over-Coax Inductor for Filters with Industry-Leading Simplicity and Efficiency

TDK Introduces Automotive Power-Over-Coax Inductor for Filters with Industry-Leading Simplicity and Efficiency
­TDK Corporation launches the ADL8030VA, a high-performance inductor designed specifically for power-over-coaxial (PoC) applications. Due to its high impedance over a wide frequency range, this component streamlines the PoC filter design by requiring only one single component instead of the conventional approach wi
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Date:
06/17/2025
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon

Will Chu, senior vice president of Custom Cloud Solutions at Marvell

Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon
­Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, expanded its custom technology platform with the launch of the industry’s first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI
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Date:
06/17/2025
Quantic X-Microwave Launches Newly Enhanced Layout Tool for RF Designers

Quantic X-Microwave Launches Newly Enhanced Layout Tool for RF Designers

Quantic X-Microwave Launches Newly Enhanced Layout Tool for RF Designers
­Quantic X-Microwave®, a business of Quantic Electronics® (“Quantic”) and leading provider of RF & microwave solutions, today announced the launch of its newly enhanced Layout Tool, a powerful interactive design environment enabling part selection and layout of signal chains using X-MWblocks®. Specifically tailored
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Date:
06/16/2025
Bourns Expands POWrFuse Line with New Series Featuring Higher Voltage Rating, Broader Current Range and Versatile Package Options

Bourns® PF-63R50H Series POWrFuse™ High-Power Fuses

Bourns Expands POWrFuse Line with New Series Featuring Higher Voltage Rating, Broader Current Range and Versatile Package Options
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced it has expanded its POWrFuse™ High-Power Fuse portfolio with a new higher voltage rated series. Bourns engineered the PF-63R50H Series with advanced fe
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Date:
06/16/2025
LEM Releases a First of its Kind High-Voltage Battery Sensor that Combines Shunt and Hall Effect Technologies

LEM Releases a First of its Kind High-Voltage Battery Sensor that Combines Shunt and Hall Effect Technologies

LEM Releases a First of its Kind High-Voltage Battery Sensor that Combines Shunt and Hall Effect Technologies
­LEM Electrical measurement technology specialist LEM has launched a new current sensing unit for battery management in electric vehicles (EVs). For the first time on the market, LEM has put together shunt and open-loop Hall effect technologies in a single part, called Hybrid Supervising Unit (HSU), to meet th
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Date:
06/13/2025
Bourns Announces 1500 VDC-Rated POWrFuse High-Power Fuse Series Specifically Designed for Photovoltaic Applications

Bourns Announces 1500 VDC-Rated POWrFuse High-Power Fuse Series Specifically Designed for Photovoltaic Applications

Bourns Announces 1500 VDC-Rated POWrFuse High-Power Fuse Series Specifically Designed for Photovoltaic Applications
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its PF-PVC150R Series POWrFuse™ High-Power Fuses specifically designed for photovoltaic (gPV) applications. The new series features enhanced voltage an
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Date:
06/12/2025
Advanced Energy Launches Medical CF-Rated AC-DC Power Supplies That Simplify Isolation and Speed Time-to-Market

Advanced Energy Launches Medical CF-Rated AC-DC Power Supplies That Simplify Isolation and Speed Time-to-Market

Advanced Energy Launches Medical CF-Rated AC-DC Power Supplies That Simplify Isolation and Speed Time-to-Market
­Advanced Energy Industries, Inc., a global leader in highly engineered, precision power conversion, measurement and control solutions, announced the new NCF425 series of CF-rated medical open frame AC-DC power supplies. The system-level cardiac floating (CF) rating is the most stringent medical device elec
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Date:
06/12/2025
Bourns Introduces Thick Film on Steel Product Line Offering Advanced Capabilities that Support High-Energy Applications

Bourns® Model TFOS30-1-150 Thick Film on Steel

Bourns Introduces Thick Film on Steel Product Line Offering Advanced Capabilities that Support High-Energy Applications
Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its Thick Film on Steel (TFOS) product line that features advanced capabilities designed to support high energy applications. Bourns® Model TFOS30-1-150 is th
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Date:
06/11/2025
Quantic X-Microwave Enhances Modular RF Solutions with Altum RF Components

Quantic X-Microwave Enhances Modular RF Solutions with Altum RF Components

Quantic X-Microwave Enhances Modular RF Solutions with Altum RF Components
­Quantic X-Microwave®, a business of Quantic Electronics® (“Quantic”) and leading provider of modular RF and microwave solutions, today announced the addition of Altum RF components to its extensive portfolio. Altum RF’s high-performance amplifier products are now available as X-MWblocks®, of
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Date:
06/11/2025
STMicroelectronics Reveals Space-Saving, High-Frequency Digital Automotive Audio Amplifiers for Smart-Cockpit Applications

STMicroelectronics Reveals Space-Saving, High-Frequency Digital Automotive Audio Amplifiers for Smart-Cockpit Applications

STMicroelectronics Reveals Space-Saving, High-Frequency Digital Automotive Audio Amplifiers for Smart-Cockpit Applications
­STMicroelectronics has revealed new class-D automotive audio amplifiers for smart-cockpit applications, engineered for tiny overall dimensions and with a digital input that simplifies circuit design.  The new HFDA80D and HFDA90D extend ST’s family of high-frequency automotive amplifiers, complemen
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Date:
06/10/2025
Quantic X-Microwave Expands X-MWblocks Catalog with New UMS Amplifier Family

Quantic X-Microwave Expands X-MWblocks Catalog with New UMS Amplifier Family

Quantic X-Microwave Expands X-MWblocks Catalog with New UMS Amplifier Family
­Quantic X-Microwave®, a business of Quantic Electronics® (“Quantic”) and leading provider of modular RF and microwave solutions, today announced the immediate availability of over twelve new high-performance amplifier products from United Monolithic Semiconductors (UMS), integrated into th
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Date:
06/10/2025
FCL Components Launches Tab Terminal, High Voltage DC Switching Relay

FCL Components Launches Tab Terminal, High Voltage DC Switching Relay

FCL Components Launches Tab Terminal, High Voltage DC Switching Relay
­FCL Components America, Inc., has released the FTR-E1J 20A, a tab terminal-type high voltage DC switching relay, based on its FTR-E1 series. It is screw mounted and does not use printed circuit boards. This new relay delivers 20A 800 VDC, 10A 1,000VDC higher voltage switching with no specific polarity requireme
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Date:
06/10/2025
High-Efficiency GaN Inverter Brings GaN Power to Medium-Voltage Motor Drives

High-Efficiency GaN Inverter Brings GaN Power to Medium-Voltage Motor Drives

High-Efficiency GaN Inverter Brings GaN Power to Medium-Voltage Motor Drives
­Efficient Power Conversion Corporation (EPC) announces the release of the EPC9196, a high-performance 25 ARMS, 3-phase BLDC motor drive inverter reference design powered by the EPC2304 eGaN® FET. The EPC9196 is specifically designed for medium-voltage (96 V – 150 V) battery-powered motor drive applications, in
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Date:
06/10/2025
Renesas Brings USB-C Rev. 2.4 Support to New Ultra-Low-Power RA2L2 Microcontroller Group

Renesas Brings USB-C Rev. 2.4 Support to New Ultra-Low-Power RA2L2 Microcontroller Group

Renesas Brings USB-C Rev. 2.4 Support to New Ultra-Low-Power RA2L2 Microcontroller Group
­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, th
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Date:
06/10/2025
ROHM Develops Breakthrough AI-Equipped MCU

ROHM Develops Breakthrough AI-Equipped MCU

ROHM Develops Breakthrough AI-Equipped MCU
­ROHM Semiconductor announced they have developed AI-equipped MCUs (AI MCUs) – ML63Q253x-NNNxx / ML63Q255x-NNNxx – that enable fault prediction and degradation forecasting using sensing data in a wide range of devices, including industrial equipment such as motors. These MCUs are the
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Date:
06/05/2025
Infineon Collaborates with Typhoon HIL to Accelerate Development of xEV Power Electronic Systems using Real-Time Hardware-in-the-loop Platform

Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers can now use a complete HIL simulation and test solution using Typhoons HIL simulator.

Infineon Collaborates with Typhoon HIL to Accelerate Development of xEV Power Electronic Systems using Real-Time Hardware-in-the-loop Platform
­Infineon Technologies AG announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working wi
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Date:
06/05/2025
STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm

STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm

STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm
­STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity. The module is the first product of ST’s collaboration with Qualcomm Technologies, Inc. anno
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Date:
06/04/2025
Würth Elektronik Presents its Skoll-I Bluetooth Module

Product-related service: A dedicated evaluation board and various software tools are available for the Skoll-I wireless module.
Image source: Würth Elektronik

Würth Elektronik Presents its Skoll-I Bluetooth Module
­Manufacturer of electronic and electromechanical components, introduces Skoll-I, a compact wireless module that combines both Bluetooth® Classic and Bluetooth® LE (Low Energy) version 5.4 in a single solution. Measuring just 16.6 × 12 × 1.7 mm, the module is already certified for conformity in
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Date:
06/03/2025
Bourns Unveils Current Transformer Line with New Model that Features High Turns Ratio with Permalloy T-Core Construction

Bourns® Model PCP300-T414250S Current Transformer

Bourns Unveils Current Transformer Line with New Model that Features High Turns Ratio with Permalloy T-Core Construction
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today unveiled the Company’s new current transformer line with its Model PCP300-T414250S Transformer. The new model is made with high-efficiency permalloy material th
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Date:
06/02/2025
Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components

Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components

Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components
­Rhopoint Components, specialist distributor  of precision electronic components, sensors, connectors and modular systems, announces the availability of the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module. Applications include power systems for Electric Vehicles
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Date:
06/02/2025
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