Data Centers

June 2025
Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging that Meets Power Demands in AI Servers

Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging that Meets Power Demands in AI Servers

­Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3x3.3 Source-Down packaging technology.  De
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Date:
06/18/2025
Marvell Develops Industry’s First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon

Will Chu, senior vice president of Custom Cloud Solutions at Marvell

­Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, expanded its custom technology platform with the launch of the industry’s first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI
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Date:
06/17/2025