Data Centers

March 2025
Molded Inductors

Figure 1: Reference schematic of a buck converter Vin = 24 V; Vout = 5 V

Increasing current densities and short switching times in MOSFETs are placing ever greater stress on the dielectric strength of inductors. Molded inductors with a distributed air gap based on iron powder enable high inductance values in the smallest of spaces and thus increase the power density. A new test con
. . . Learn More
Date:
03/31/2025
Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market

Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market

­Alphawave Semi has revealed its portfolio of optoelectronics products addressing the high-speed interconnect semiconductor market, which is forecast to exceed US$4-billion by 2028. The portfolio consists of DSPs for PAM4 and emerging Coherent-lite modulation. These are capable of transmitting AI driven h
. . . Learn More
Date:
03/25/2025
Taking Power Conversion to the Next Level

Taking Power Conversion to the Next Level

­The PE24111 expands pSemi’s portfolio of two-stage buck regulators that target applications requiring high efficiency in a low-profile form-factor (<1.2mm) applications. The device consists of a two-phase interleaved charge pump followed by an interleaved buck regulator stage. This power system greatly re
. . . Learn More
Date:
03/21/2025
Power Management in AI Data Centers

Click image to enlarge

­AI’s capabilities are revolutionizing industries and contributing to a dramatic surge in data center power consumption. Fueled by the rapid growth in AI workloads and other GPU and CPU power-intensive applications, data centers’ electricity consumption is forecast to double from 2022 to 2026, reaching mo
. . . Learn More
Date:
03/01/2025
The Data Center on Wheels

Click image to enlarge

Figure 1: Communication breakdown: Communication between the rear right camera (red) and rear left camera requires a trip to the front of the car in domain architectures and connection to the right front brake (yellow) is impossible. In zones, it is a direct connection....

­EVs can contain 3x or more chips than internal combustion engine (ICE) vehicles depending on the complexity of the vehicle. The growth of the silicon footprint in cars has paved the way for things like lane change sensors, infotainment consoles, downloadable apps, etc. - electronics have fundamentally changed th
. . . Learn More
Date:
03/01/2025