Motor Drives, Robotics & Controls
October 2017
ON Semiconductor has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel array of 1936H x 1188V. The AR0239 produces extraordinarily clear and sharp digital images in challenging bright and low light conditions. This, along with its ability to capture continuous video and
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Date:
10/31/2017
TTI, Inc is now stocking Smiths Interconnect SnapTac® series circular miniature snap fit connectors. The circular SnapTac series is available in 7, 13 and 19-way configurations and offers improved functionality and performance in extreme environments. Increased features, hardware coding options, termination s
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Date:
10/31/2017
BrainChip has shipped its first BrainChip Accelerator card to a major European automobile manufacturer.
As the first commercial implementation of a hardware-accelerated spiking neural network (SNN) system, the shipment of BrainChip Accelerator is a significant milestone in neuromorphic computing, a branch of
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Date:
10/24/2017
LDRA announced LDRA tool suite for Medical Devices, a variant of its leading LDRA tool suite specifically tailored to help companies achieve IEC 62304 compliance and faster development of safety- and security-critical medical device applications. The LDRA tool suite for Medical Devices automates software quali
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Date:
10/24/2017
Rutronik will be exhibiting its entire service portfolio, with a special focus on technologies of the future, at the World Electronics Forum 2017. The forum will be held on October 24 – 28 in Angers, France.
The goal of the World Electronics Forum (WEF) is information sharing regarding the current challeng
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Date:
10/24/2017
TDK Corporation presents the new B32355C* series of EPCOS MotorCap™ motor run capacitors, which are designed for a high continuous operating temperature of 100 °C. They are based on a metalized polypropylene film, feature self-healing properties, and conform to Safety Class S3 as specified in IEC 60252-1. The
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Date:
10/19/2017
OMC launched two new high density PCB-mounting SMA (H22) style housings for its wide range of fibre optic transmitters and receivers which save board space and ensure long-term performance.
The company has released two new space-saving housing styles: High Density SMA (HDSMA) which is designed to be edge-
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Date:
10/19/2017
Toshiba Electronics Europe has announced new 40V and 60V power MOSFETs based on the company’s latest generation U-MOS-IX-H trench semiconductor process.
The TK3R1P04PL, TK4R4P06PL and TK6R7P06PL N-channel MOSFETs can be driven by 4.5V logic levels and offer ultra-low maximum on resistance (RDS(ON))
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Date:
10/16/2017
To complement its widely-used Datamate wire-to-board connector offering, hi-rel connector manufacturer Harwin now supplies a comprehensive range of backshells with a rugged aluminium alloy construction and electroless nickel plating. Through these accessories, which can be applied to new installations or alternativ
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Date:
10/16/2017
Panasonic Industry Europe announced Panasonic Corporation has developed a 3D LiDAR (Light Detection and Ranging) Sensor equipment that measures distance between the equipment and the object from the round-trip travelling time of the pulse laser that is projected to the object. sensor that accurately measure the
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Date:
10/16/2017
Vishay Intertechnology announced that eight Vishay Milwaukee 1500 W RBSF series wirewound braking resistors are being used to provide a smooth ride for passengers of the Wonderfair Wheel, North America's largest travelling Ferris wheel.
Standing 15 stories high and featuring 36 fully enclosed gondolas and a spec
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Date:
10/12/2017
Telit’s end-to-end IoT solutions are enabling real-time sensor data from robotic lawnmowers that offers valuable insight into green-space environmental conditions and park maintenance
Telit announced that Husqvarna is using a wireless sensor device co-developed by Telit and Wireless System Integration (WSI), an award-winning Sweden-ba
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Date:
10/10/2017
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