Powering Communications
July 2020
Threats from intentional jamming and spoofing of U.S. Global Positioning System (GPS) signals, as well as cybersecurity risks to critical infrastructure, demonstrate the need for powerful and secure time and frequency systems that ensure continuing operability and performance. Microchip Technology Inc. announced th
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Date:
07/30/2020
TE Connectivity (TE) is introducing its new antenna product portfolio for Wi-Fi 6E that supports triple bands, including the new 6 GHz band. TE's antenna solutions and integration expertise unleash the power of the extensive additional spectrum from Wi-Fi 6E, enabling new applications and services, greater network fle
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Date:
07/23/2020
Chris Dries, the President and CEO of UnitedSiC
You’ve probably heard that President Trump and the Department of Homeland Security took actions with mammoth ramifications for our industry. To whit, Trump restricted H-1B visas for engineers, computer programmers and other technical workers through 2020. Is this a boon for domestic employment or a shackle fo
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Date:
07/23/2020
RIGOL Technologies announces the new RSA3000N and RSA5000N Spectrum Analyzer which extends the flexibility and capability of the UltraReal platform with a new Vector Network Analyzer measurement mode.
The RSA5000N and the RSA3000N deliver the same performance specifications and feature set as the current R
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Date:
07/21/2020
Bel Magnetic Solutions announces a single port and eight-port 2.5GBASE-T MagJack ICM. These ICMs offer a cost-effective solution for upgrading end-product performance to multi-rate, NBASE-T Ethernet standards.
These reliable, cost-competitive ICMs are compatible with all new multi-rate Ethernet PHYs and are s
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Date:
07/16/2020
Valid Manian, COO, Morse Micro
A startup by the name of Morse Micro is developing the smallest Wi-Fi HaLow system-on-chip, which supposedly provides 10 times the range, 100 times the area, and 1000 times the volume of traditional Wi-Fi ...
Date:
07/14/2020
Vishay Intertechnology, Inc. introduced a new 30 V n-channel MOSFET half-bridge power stage that combines a high side TrenchFET MOSFET and low side SkyFET MOSFET with an integrated Schottky diode in one compact PowerPAIR 3.3 mm by 3.3 mm package. For power conversion in computing and telecom applications, the Vi
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Date:
07/08/2020
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