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Powering Communications

 




 

 

Powering Communications

December 2016
The U.S. Department of Energy (DOE) has issued a pre-publication Federal Register final rule pertaining to energy conservation standards for uninterruptible power supplies, a class of battery chargers. (December 28, 2016). This pre-publication final rule is subject to the procedures at 10 CFR 430.5.
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Date:
12/29/2016
Infinite Electronics, a supplier of engineering grade RF components, assemblies and wired / wireless connectivity solutions, announced that it has acquired KP Performance Antennas, an Edmonton Canada based manufacturer of broadband antennas and accessories. Founded in 2008, KP formed a strong team
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Date:
12/27/2016
 Build a WiFi-enabled 6LoWPAN wireless sensor network

STM32 Open Development Environment

The STM32 Open Development Environment provides developers with end-to-end solutions to explore and validate design concepts. Using a combination of ODE components, it’s now possible to build a wireless sensor network based on 6LoWPAN connectivity leveraging a wide range of sensor technologies and make sensor
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Date:
12/27/2016

Elma Electronic announced it has added EKF Elektronik, a premier designer of boards based on 3U CompactPCI Serial and PMC/XMC mezzanine standards, to its partner ecosystem. EKF brings 40 years of technical expertise in modular industrial computing to Elma’s portfolio of building blocks for embedded system
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Date:
12/23/2016
Nordic Semiconductor to show advanced wireless solutions at CES

Nordic Semiconductor will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs at CES 2017

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announced it will demonstrate Bluetooth low energy- (including Bluetooth 5) and IEEE 802.15.4-enabled technologies at International CES 2017.The company is also confirming details of exhibits, demonstrations, and design partner companies it will be
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Date:
12/23/2016
Silicon Labs’ tiny BGM12x SiP modules for Bluetooth LE now at Mouser

BGM12x Blue Gecko SiP Modules

Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking BGM12x Blue Gecko system-in-package (SiP) modules from Silicon Labs. Based on Silicon Labs’ Blue Gecko wireless system-on-chip (SoC), the BGM12x is the
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Date:
12/23/2016
Novel material with ferroelectricity and ferromagnetism may lead to better memory

Portions of the BiFeO3 lattice of cycloidal and collinear phases with only Fe ions are shown at left and right, respectively. The arrows indicate the Fe3+ moment direction. The ground state of BiFeO3 had a cycloidal spin structure, which is destabilized by substitution of Co for Fe and at higher temperatures. The spin magnetic moments compensate with each other in the left panel, but canting between neighboring spins leads to the appearance of weak ferromagnetism in the left panel.

Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors. Traditional computer
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Date:
12/20/2016
Murata’s high-density mono block converters now at Mouser

Murata MYMGK Mono Block Type DC-DC Converters

Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the MYMGK Mono Block type DC-DC converters from Murata Power Solutions. These new 20A and 6A voltage converters provide the highest power density on the
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Date:
12/19/2016
AT&S to present at Nepcon 2017 in Tokyo

Ever-higher speeds and HF designs also place high demands on printed circuit board technology

At Nepcon 2017 (18-20 January 2017) in Tokyo, AT&S will be presenting innovative technologies as a response to current challenges in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturisation, high data rates and/or high frequencies, power electronics with increasing
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Date:
12/16/2016
TDK's latest industrial power supply delivers up to 3200W at 24V in 2U

TPS3000 industrial power supply

TDK introduced the TPS3000-24 industrial power supply, delivering up to 3200W output power (24V at 133.3A) in a 2U high package. It operates from a high voltage, wide range Delta or Wye 350 - 528Vac three phase input, avoiding the requirement for step down transformers and assisting phase load current balancing.
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Date:
12/14/2016
Powerbox promotes Patrick Le FÃvre to Chief Marketing and Communications Officer

Patrick Le Fèvre

Powerbox International has promoted Patrick Le Fèvre, its Marketing and Communication Director, to the role of Chief Marketing and Communications Officer (CMCO). In an extension of his responsibilities to promote Powerbox standard and custom products and solutions, starting 1st of January 2017, Le Fèvre will
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Date:
12/14/2016
PSDcast - Sani Ronen of Microsemi on enabling wireless infrastructures

Sani Ronen of Microsemi

In this PSDcast, Sani Ronen of Microsemi talks to Alix Paultre of Power Systems Design on enabling wireless infrastructures. The challenges when moving to higher bandwidths and frequencies place pressure on the related systems involved. In order to enable enterprises to migrate to these higher levels of
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Date:
12/14/2016
Harwin launches EZ-Boardware SMT spring-contact dev kit

Spring Contact Development Kit

Harwin, the leading hi-rel connector and SMT board hardware manufacturer, is showcasing its new Spring Contact Development Kit for electronic design engineers and design houses at SPS IPC Drives. Harwin Spring Contacts are single contact, surface mount PCB devices with multiple uses including general electrical
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Date:
12/13/2016
In today’s data acquisition systems (DAQs), performance boundaries are continually being pushed.  System designers require higher speed, lower noise, and better total harmonic distortion (THD) performance; all of which are possible but none of which are free.  These performance improvements typically
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Date:
12/07/2016
Artesyn launches 28Vout DC-DC 700W Half-Brick for telecom and wireless

ADH700 half-brick dc-dc converter module

Artesyn Embedded Technologies launched a new 700 watt half-brick dc-dc converter module, the ADH700 series. The first model available offers a 28 V nominal output and is designed to support the popular use of LDMOS technology used in high power wireless base station (BTS) deployments. LDMOS stands for laterally
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Date:
12/06/2016
STMicro's mini multi-sensor module jumpstarts IoT and wearables

SensorTile has a complete Bluetooth Low-Energy transceiver including a miniature single-chip balun on-board

STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub
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Date:
12/05/2016
Safety vs. performance

The creepage distance is the shortest path between two conductors along the surface of an isolator (typically a PCB)

When designing a switch-mode power supply (SMPS) operating losses and the ability to dissipate heat are critical selection criteria for MOSFETs. The standard TO-220 package is generally good at dissipating heat and the wide range of heatsinks and forced-air cooling options available can easily improve this.
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Date:
12/04/2016
Selco Products has been manufacturing custom cable and wire harnesses assemblies for many years for large OEM customers, and recently expanded its harness capabilities to meet custom designs from new and existing OEM customers. This has enabled Selco to support these customers from engineering design to rapid
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Date:
12/02/2016
PSDcast - Nathan Tracy of TE Connectivity on Open Compute Project hardware

Nathan Tracy of TE Connectivity

In this PSDcast, Nathan Tracy of TE Connectivity talks to Alix Paultre of Power Systems Design about the Open Compute project and the hardware infrastructures involved. The company recently designed a new family of bus bar clip and cable assemblies to meet the Open Compute Project (OCP) distribution architecture,
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Date:
12/01/2016

 



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