>
>
Powering Communications

 




 

 

Powering Communications

January 2015
Power Integrations' LinkSwitch-4 switcher ICs pass US and EU CoC efficiency rules

LinkSwitch-4 CV/CC primary-side regulated (PSR) switcher ICs

Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, announced the LinkSwitch-4 family of CV/CC primary-side regulated (PSR) switcher ICs. The LinkSwitch-4 product family features an advanced adaptive base and emitter switched drive scheme for bipolar junction
. . . Read More
Date:
01/29/2015
AVX's latest high-voltage stacked SMPS capacitors suit high voltage apps

AVX RV Series capacitors

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced a new RoHS-compliant series of high voltage, DIP-leaded stacked SMPS capacitors. Rated for 1,000–5,000V and capacitance values spanning 100pF to 15µF, the new RV Series capacitors feature low ESR and ESL, low DC leakage
. . . Read More
Date:
01/28/2015
Molex's wire-to-board solution packs high power in a small footprint for top-end server applications

EXTreme Guardian connector

Molex announced the addition of 2, 3, 4, 5, and 6 circuit harness connector components to its EXTreme Guardian Power Connector system. The new components include non-overmolded latching cable receptacle housings, terminal position assurance clips (TPAs), and latchable vertical and right angle headers providing
. . . Read More
Date:
01/21/2015

AVX creates the first 0201 tantalum capacitor

AVX's sub-millimeter 0201 TACmicrochip

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the world’s smallest and lowest profile tantalum capacitor: the new sub-millimeter 0201 TACmicrochip. Measuring only 0.6mm x 0.35mm x 0.35mm, the new 0201 E case TACmicrochip Series SMD tantalum capacitors deliver
. . . Read More
Date:
01/20/2015
TI’s N-channel power MOSFETs claim industry’s lowest resistance

CSD16570Q5B and CSD17570Q5B NexFET MOSFETs

Texas Instruments introduced 11 new N-channel power MOSFETs to its NexFET product line, including the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry’s lowest on-resistance (Rdson) in a QFN package. In addition, TI’s new 12-V FemtoFET CSD13383F4 for low-voltage
. . . Read More
Date:
01/19/2015
Cree’s PT62SCMDxx dual SIC MOSFET drivers now at Mouser

PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree

Mouser Electronics, a leading authorized distributor with the latest in semiconductors and electronic components, is now stocking the PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree. Designed to drive the CREE CAS300M17BM2 SIC MOSFET modules, the PT62SCMD12 and PT62SCMD17 single-board solutions are dual silicon
. . . Read More
Date:
01/19/2015
Shmuel De Leon is pleased invites all to participate as an exhibitor or sponsor in the 5th Israeli Power Sources Conference & Exhibition (Batteries, Fuel cells, Smart-Grid & EV), which will take place in the Daniel Hotel, Herzelia, Israel on May 21, 2015. The conference is held once a year and
. . . Read More
Date:
01/19/2015
Vishay Intertechnology's IHLP 2020 Inductors operate to +155°C

IHLP low-profile, high-current inductors in the 2020 case size

Vishay Intertechnology launched two new IHLP low-profile, high-current inductors in the 2020 case size with high operating temperatures to +155°C. Offering low profiles of 3 mm, the Vishay Dale IHLP-2020CZ-51 and automotive-grade IHLP-2020CZ-5A provide a wide range of inductance values from 0.22 µH to 15 µH. With
. . . Read More
Date:
01/15/2015
Faster charging technique boosts battery's capacity

A novel rapid charging technique leads to enhanced conductivity and capacity

In the quest to develop higher-capacity, longer-lasting batteries, the focus is typically on materials or fabrication techniques. While developing a new way to study and observe battery performance in realtime, a team of researchers from the University of Maryland also discovered that by altering how their battery
. . . Read More
Date:
01/15/2015
Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014, according to IHS Technology. Global revenue this year from shipments of wireless power receivers
. . . Read More
Date:
01/15/2015
Torex Semi releases pushbutton reboot controller IC

XC6190 series push button reboot controllers

Torex Semiconductor has developed the XC6190 series of pushbutton reboot controllers, which are used for system reboot by means of a signal input from external buttons such as on a wearable device. The quiescent current in the standby state is a very small 0.01μA (TYP.). On internally-fixed reboot delay
. . . Read More
Date:
01/14/2015
Machine-to-machine methods, (or M2M), intelligent embedded and/or smart fusion have been around in some form for many years. The Internet of Things (IoT) goes way beyond this capability and interconnects virtually unlimited numbers of smart objects and changes the way we interact with our environment. To help
. . . Read More
Date:
01/13/2015
IHS identifies technologies transforming the world

Trends

The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology. “We know that technology has the capability to change the world: from the Gutenberg printing press to the steam
. . . Read More
Date:
01/12/2015
Randy Ryder of Freescale on wireless charging

Randy Ryder of Freescale

In this PSDcast Randy Ryder of Freescale talks to Alix Paultre of Power Systems Design about wireless power transmission and some of the issues involved. Currently the biggest opportunity lies in the charging of batteries in mobile devices, so issues range from multiple standards to energy densities of storage
. . . Read More
Date:
01/12/2015
Active-Semi announced the availability of Qi-compatible medium power (MP) wireless charging solutions based on PAC5220 Power Application Controller (PAC) IC for powering smart phones, mobile devices and tablets. This announcement comes as a follow-up to previously released Qi-certified A11 and A6 Wireless transmitter
. . . Read More
Date:
01/08/2015
AVX's latest AC film caps suppress Class X2 interference in power & RF apps

FV Series AC film capacitor

AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the FV Series AC film capacitors. Designed to provide Class X2 interference suppression, FV Series metallized polypropylene film capacitors are rated for 305Vrms and exhibit self-healing properties, high moisture resistance,
. . . Read More
Date:
01/08/2015
Farsens releases MEDUSA development platform for battery-free wireless sensors and actuators

Medusa from Farsens is a development platform for UHF RFID battery-free devices

The Medusa from Farsens is a development platform for UHF RFID battery-free devices. The Medusa includes an ANDY100 chip with EPC C1G2 communication and a MSPG2233IPW20 microcontroller from Texas Instruments for communication with developers’ circuits. Users can now develop their own wireless sensors
. . . Read More
Date:
01/07/2015
Micrel launches small and efficient load switch for mobiles

The MIC95410 7A load switch

Micrel, an industry leader in high performance linear and power solutions, LAN and timing and communications solutions, introduced the MIC95410 7A load switch in a compact 1.2mm x 2.0mm package. This device can be used for systems requiring power partitioning and has the capability of a controlled power up sequence
. . . Read More
Date:
01/07/2015
Molex, a leading interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry.   “Together, Molex
. . . Read More
Date:
01/07/2015
Intel accelerates wearable tech

The Intel Curie module

Intel Corporation announced a number of technology advancements and initiatives aimed at accelerating computing into the next dimension. The announcements include the Intel Curie module, a button-sized hardware product for wearable solutions; applications for Intel RealSense cameras spanning robots, flying multi-copter
. . . Read More
Date:
01/07/2015
One year following Consumer Electronics Show (CES) 2014, the Alliance for Wireless Power (A4WP) announced it has doubled its membership and expanded the applicability of the Rezence technical specification to include wireless charging of cell phones and smartphones, tablets, notebooks, laptops and desktop PC
. . . Read More
Date:
01/07/2015
Scorpion power/signal connectors from Astute provide flexibility in hi-rel applications

Positronic’s Scorpion modular signal power connector

Astute Electronics, a leading supplier of electronic components and value added services, has announced the availability of Positronic’s Scorpion modular signal power connector family including the low profile version. Positronic uses modular tooling that enables the quick turnaround of a very large number
. . . Read More
Date:
01/07/2015
Cooler Master, a leading creator, innovator and manufacturer of desktop components and peripherals, and CoolChip Technologies, a leading fabless technology house of thermal management solutions, announced a partnership to bring kinetic cooling technology to the multi-billion dollar
. . . Read More
Date:
01/06/2015
Revenues for the consumer electronics (CE) industry are projected to grow three percent in 2015 and to reach an all-time high of $223.2 billion, according to The U.S. Consumer Electronics Sales and Forecasts, the semi-annual industry report released today by the Consumer Electronics Association (CEA). The total
. . . Read More
Date:
01/06/2015
M/A-COM Technology Solutions (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, announced a comprehensive new portfolio of passive components for DOCSIS 3.1 compliant cable TV (CATV) and broadband Internet systems. This new product family, spanning upstream
. . . Read More
Date:
01/06/2015
Jeremy Rifkin, author of The Zero Marginal Cost Society, joined BK Yoon, President of Samsung Electronics, on stage during Mr. Yoon’s opening keynote address on the future of the Internet of Things at the 2015 International Consumer Electronics Show (CES) in Las Vegas. Mr. Rifkin described how the Internet
. . . Read More
Date:
01/06/2015
Application developers registered with the Smart TV Alliance develop applications for 58 million smart TVs in a single, integrated process within the Smart TV Alliance Common Developer Portal. One-third of the world’s smart TVs are now compatible with the Smart TV Alliance development toolkit. The Common Developer
. . . Read More
Date:
01/05/2015

 



 Home | Site Map | Contact | Privacy Policy | Refund Policy | Terms of Service | Copyright © 2018 Power Systems Corporation, All rights reserved 
X

Join Our Newsletter

Sign up today for free and be the first to get notified.