LinkSwitch-4 CV/CC primary-side regulated (PSR) switcher ICs
Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, announced the LinkSwitch-4 family of CV/CC primary-side regulated (PSR) switcher ICs. The LinkSwitch-4 product family features an advanced adaptive base and emitter switched drive scheme for bipolar junction
AVX, a leading manufacturer of passive components and interconnect solutions, has introduced a new RoHS-compliant series of high voltage, DIP-leaded stacked SMPS capacitors. Rated for 1,000–5,000V and capacitance values spanning 100pF to 15µF, the new RV Series capacitors feature low ESR and ESL, low DC leakage
EXTreme Guardian connector
Molex announced the addition of 2, 3, 4, 5, and 6 circuit harness connector components to its EXTreme Guardian Power Connector system. The new components include non-overmolded latching cable receptacle housings, terminal position assurance clips (TPAs), and latchable vertical and right angle headers providing
AVX's sub-millimeter 0201 TACmicrochip
AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the world’s smallest and lowest profile tantalum capacitor: the new sub-millimeter 0201 TACmicrochip. Measuring only 0.6mm x 0.35mm x 0.35mm, the new 0201 E case TACmicrochip Series SMD tantalum capacitors deliver
CSD16570Q5B and CSD17570Q5B NexFET MOSFETs
Texas Instruments introduced 11 new N-channel power MOSFETs to its NexFET product line, including the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry’s lowest on-resistance (Rdson) in a QFN package. In addition, TI’s new 12-V FemtoFET CSD13383F4 for low-voltage
PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree
Mouser Electronics, a leading authorized distributor with the latest in semiconductors and electronic components, is now stocking the PT62SCMDxx Dual SIC MOSFET Driver Boards from Cree. Designed to drive the CREE CAS300M17BM2 SIC MOSFET modules, the PT62SCMD12 and PT62SCMD17 single-board solutions are dual silicon
Shmuel De Leon is pleased invites all to participate as an exhibitor or sponsor in the 5th Israeli Power Sources Conference & Exhibition (Batteries, Fuel cells, Smart-Grid & EV), which will take place in the
Daniel Hotel, Herzelia, Israel on May 21, 2015. The conference is held once a year and
IHLP low-profile, high-current inductors in the 2020 case size
Vishay Intertechnology launched two new IHLP low-profile, high-current inductors in the 2020 case size with high operating temperatures to +155°C. Offering low profiles of 3 mm, the Vishay Dale IHLP-2020CZ-51 and automotive-grade IHLP-2020CZ-5A provide a wide range of inductance values from 0.22 µH to 15 µH.
A novel rapid charging technique leads to enhanced conductivity and capacity
In the quest to develop higher-capacity, longer-lasting batteries, the focus is typically on materials or fabrication techniques. While developing a new way to study and observe battery performance in realtime, a team of researchers from the University of Maryland also discovered that by altering how their battery
Propelled by the arrival of the Apple Watch, the global market for wireless power and charging in wearable applications is set to attain a gargantuan 3,000 percent expansion this year compared to 2014, according to IHS Technology.
Global revenue this year from shipments of wireless power receivers
XC6190 series push button reboot controllers
Torex Semiconductor has developed the XC6190 series of pushbutton reboot controllers, which are used for system reboot by means of a signal input from external buttons such as on a wearable device.
The quiescent current in the standby state is a very small 0.01μA (TYP.). On internally-fixed reboot delay
Machine-to-machine methods, (or M2M), intelligent embedded and/or smart fusion have been around in some form for many years. The Internet of Things (IoT) goes way beyond this capability and interconnects virtually unlimited numbers of smart objects and changes the way we interact with our environment. To help
The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.
“We know that technology has the capability to change the world: from the Gutenberg printing press to the steam
In this PSDcast Randy Ryder of Freescale talks to Alix Paultre of Power Systems Design about wireless power transmission and some of the issues involved. Currently the biggest opportunity lies in the charging of batteries in mobile devices, so issues range from multiple standards to energy densities of storage
Active-Semi announced the availability of Qi-compatible medium power (MP) wireless charging solutions based on PAC5220 Power Application Controller (PAC) IC for powering smart phones, mobile devices and tablets. This announcement comes as a follow-up to previously released Qi-certified A11 and A6 Wireless transmitter
FV Series AC film capacitor
AVX, a leading manufacturer of passive components and interconnect solutions, has introduced the FV Series AC film capacitors. Designed to provide Class X2 interference suppression, FV Series metallized polypropylene film capacitors are rated for 305Vrms and exhibit self-healing properties, high moisture resistance,
Medusa from Farsens is a development platform for UHF RFID battery-free devices
The Medusa from Farsens is a development platform for UHF RFID battery-free devices. The Medusa includes an ANDY100 chip with EPC C1G2 communication and a MSPG2233IPW20 microcontroller from Texas Instruments for communication with developers’ circuits.
Users can now develop their own wireless sensors
The MIC95410 7A load switch
Micrel, an industry leader in high performance linear and power solutions, LAN and timing and communications solutions, introduced the MIC95410 7A load switch in a compact 1.2mm x 2.0mm package. This device can be used for systems requiring power partitioning and has the capability of a controlled power up sequence
Molex, a leading interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry.
Intel Corporation announced a number of technology advancements and initiatives aimed at accelerating computing into the next dimension. The announcements include the Intel Curie module, a button-sized hardware product for wearable solutions; applications for Intel RealSense cameras spanning robots, flying multi-copter
One year following Consumer Electronics Show (CES) 2014, the Alliance for Wireless Power (A4WP) announced it has doubled its membership and expanded the applicability of the Rezence technical specification to include wireless charging of cell phones and smartphones, tablets, notebooks, laptops and desktop PC
Positronic’s Scorpion modular signal power connector
Astute Electronics, a leading supplier of electronic components and value added services, has announced the availability of Positronic’s Scorpion modular signal power connector family including the low profile version. Positronic uses modular tooling that enables the quick turnaround of a very large number
Cooler Master, a leading creator, innovator and manufacturer of desktop
components and peripherals, and CoolChip Technologies, a leading
fabless technology house of thermal management solutions,
announced a partnership to bring kinetic cooling technology to the
Revenues for the consumer electronics (CE) industry are projected to grow three percent in 2015 and to reach an all-time high of $223.2 billion, according to The U.S. Consumer Electronics Sales and Forecasts, the semi-annual industry report released today by the Consumer Electronics Association (CEA). The total
M/A-COM Technology Solutions (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, announced a comprehensive new portfolio of passive components for DOCSIS 3.1 compliant cable TV (CATV) and broadband Internet systems. This new product family, spanning upstream
Jeremy Rifkin, author of The Zero Marginal Cost Society, joined BK Yoon, President of Samsung Electronics, on stage during Mr. Yoon’s opening keynote address on the future of the Internet of Things at the 2015 International Consumer Electronics Show (CES) in Las Vegas. Mr. Rifkin described how the Internet
Application developers registered with the Smart TV Alliance develop applications for 58 million smart TVs in a single, integrated process within the Smart TV Alliance Common Developer Portal. One-third of the world’s smart TVs are now compatible with the Smart TV Alliance development toolkit. The Common Developer